Matti A. Korhonen

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Ithaca, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
High density electronic packages
- Patent number 7,358,603
- Issue date Apr 15, 2008
- Che-Yu Li & Company, LLC
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a contact member cable
- Patent number 6,546,625
- Issue date Apr 15, 2003
- High Connection Density, Inc.
- Ai D. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire segment based interposer for high frequency electrical connection
- Patent number 6,264,476
- Issue date Jul 24, 2001
- High Connection Density, Inc.
- Che-yu Li
- G01 - MEASURING TESTING
Information Patent Grant
Self-assembled low-insertion force connector assembly
- Patent number 5,928,005
- Issue date Jul 27, 1999
- Cornell Research Foundation, Inc.
- Che-yu Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High Density Electronic Packages
- Publication number 20080036071
- Publication date Feb 14, 2008
- Che-Yu Li & Company, LLC
- Che-Yu Li
- G01 - MEASURING TESTING