Mauro Kobrinsky

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact resistance reduction in transistor devices with metallizati...
- Patent number 12,342,574
- Issue date Jun 24, 2025
- Intel Corporation
- Koustav Ganguly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-height interconnect trenches for resistance and capacitance o...
- Patent number 12,334,392
- Issue date Jun 17, 2025
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked and bonded memory arrays
- Patent number 12,327,809
- Issue date Jun 10, 2025
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip level vias in metallization layers for integrated circuit devices
- Patent number 12,315,794
- Issue date May 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip level vias in metallization layers for integrated circuit devices
- Patent number 12,288,746
- Issue date Apr 29, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing for integrated circuit devices and assemblies
- Patent number 12,278,229
- Issue date Apr 15, 2025
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having partitioned source or drain co...
- Patent number 12,230,717
- Issue date Feb 18, 2025
- Intel Corporation
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having asymmetric sou...
- Patent number 12,230,721
- Issue date Feb 18, 2025
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 12,211,794
- Issue date Jan 28, 2025
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having removed substrate
- Patent number 12,199,143
- Issue date Jan 14, 2025
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing for integrating photonic and electronic compon...
- Patent number 12,147,083
- Issue date Nov 19, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a placeholder for backside contact formation for transistor...
- Patent number 12,148,751
- Issue date Nov 19, 2024
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory arrays with layer selector transistors
- Patent number 12,114,479
- Issue date Oct 8, 2024
- Intel Corporation
- Wilfred Gomes
- G11 - INFORMATION STORAGE
Information Patent Grant
Transistor channel passivation with 2D crystalline material
- Patent number 12,107,170
- Issue date Oct 1, 2024
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench via for three-dimensional integrated circuit
- Patent number 12,100,705
- Issue date Sep 24, 2024
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional nanoribbon-based dynamic random-access memory
- Patent number 12,058,849
- Issue date Aug 6, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with crenellated metal trace layout
- Patent number 11,996,362
- Issue date May 28, 2024
- Intel Corporation
- Patrick Morrow
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabrication of stackable embedded eDRAM using a binary alloy based...
- Patent number 11,985,909
- Issue date May 14, 2024
- Intel Corporation
- Elijah Karpov
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
- Patent number 11,948,874
- Issue date Apr 2, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with three-dimensional (3D) monolithic memo...
- Patent number 11,901,347
- Issue date Feb 13, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device layer interconnects
- Patent number 11,881,452
- Issue date Jan 23, 2024
- Intel Corporation
- Mark Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,830,788
- Issue date Nov 28, 2023
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing for integrated circuit devices and assemblies
- Patent number 11,817,442
- Issue date Nov 14, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having asymmetric sou...
- Patent number 11,799,037
- Issue date Oct 24, 2023
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing of microeletronic assemblies with first and se...
- Patent number 11,756,886
- Issue date Sep 12, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress compensation for wafer to wafer bonding
- Patent number 11,721,554
- Issue date Aug 8, 2023
- Intel Corporation
- Anant Jahagirdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor based memory cells on both sides of a layer of...
- Patent number 11,690,211
- Issue date Jun 27, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having partitioned source or drain co...
- Patent number 11,621,354
- Issue date Apr 4, 2023
- Intel Corporation
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with back-side interconnection to deep so...
- Patent number 11,616,015
- Issue date Mar 28, 2023
- Intel Corporation
- Patrick Morrow
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...
- Publication number 20250227956
- Publication date Jul 10, 2025
- Intel Corporation
- Koustav GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY
- Publication number 20250227968
- Publication date Jul 10, 2025
- Intel Corporation
- Marni NABORS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED PENETRATIN...
- Publication number 20250227978
- Publication date Jul 10, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-CUT BACKSIDE SOURCE OR...
- Publication number 20250221040
- Publication date Jul 3, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
BACKSIDE EPITAXIAL GROWTH FOR IMPROVED CONTACT AREA
- Publication number 20250220994
- Publication date Jul 3, 2025
- Intel Corporation
- Mauro J. Kobrinsky
Information Patent Application
FRONT SIDE AND BACKSIDE SOURCE OR DRAIN CONTACTS
- Publication number 20250220959
- Publication date Jul 3, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH ASYMMETRIC EPITAXIAL SOURCE OR DR...
- Publication number 20250220978
- Publication date Jul 3, 2025
- Intel Corporation
- Gilbert DEWEY
Information Patent Application
TRANSISTORS WITH ASYMMETRIC SOURCE AND DRAIN CONTACTS
- Publication number 20250220950
- Publication date Jul 3, 2025
- Intel Corpration
- Gilbert Dewey
Information Patent Application
DIRECTED SELF ASSEMBLY-ENABLED BACK-SIDE CONTACT ARRAYS ALIGNED TO...
- Publication number 20250218937
- Publication date Jul 3, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT FEATURES WITH FLOATING DIELECTRIC STRUCTURE
- Publication number 20250218868
- Publication date Jul 3, 2025
- Intel Corporation
- Sudipto Naskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACK-SIDE GATE VIAS
- Publication number 20250218869
- Publication date Jul 3, 2025
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...
- Publication number 20250220991
- Publication date Jul 3, 2025
- Intel Corporation
- Shao Ming KOH
Information Patent Application
DOUBLE-SIDED DEVICE CONTACTS AND THROUGH VIAS FOR PERFORMANCE AND L...
- Publication number 20250221020
- Publication date Jul 3, 2025
- Intel Corporation
- Sanjay Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYERS WITH AIR GAPS
- Publication number 20250210411
- Publication date Jun 26, 2025
- Intel Corporation
- Ananya Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20250201797
- Publication date Jun 19, 2025
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING PARTITIONED SOURCE OR DRAIN CO...
- Publication number 20250159927
- Publication date May 15, 2025
- Intel Corporation
- Mauro J. KOBRINSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOU...
- Publication number 20250151338
- Publication date May 8, 2025
- Intel Corporation
- Biswajeet GUHA
Information Patent Application
BACKSIDE SOURCE/DRAIN TRANSISTOR CONTACT FLOW WITH SELECTIVE ETCH M...
- Publication number 20250113580
- Publication date Apr 3, 2025
- Intel Corporation
- Leonard Guler
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING REMOVED SUBSTRATE
- Publication number 20250107181
- Publication date Mar 27, 2025
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DIFFERENTIATED SOURCE OR DRAIN ST...
- Publication number 20250107183
- Publication date Mar 27, 2025
- Intel Corporation
- Leonard P. GULER
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATING PHOTONIC AND ELECTRONIC COMPON...
- Publication number 20250020873
- Publication date Jan 16, 2025
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF A PLACEHOLDER FOR BACKSIDE CONTACT FORMATION FOR TRANSISTOR...
- Publication number 20250022878
- Publication date Jan 16, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-...
- Publication number 20250006568
- Publication date Jan 2, 2025
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT...
- Publication number 20240429291
- Publication date Dec 26, 2024
- Intel Corporation
- Joseph D’SILVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT REVEAL UNIFORMITY
- Publication number 20240421153
- Publication date Dec 19, 2024
- Intel Corporation
- Joseph D’SILVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS
- Publication number 20240421101
- Publication date Dec 19, 2024
- Intel Corporation
- Sunny CHUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT STITCHING
- Publication number 20240405085
- Publication date Dec 5, 2024
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS
- Publication number 20240389300
- Publication date Nov 21, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...
- Publication number 20240347610
- Publication date Oct 17, 2024
- Intel Corporation
- Koustav GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONDUCTIVE SOURCE OR DR...
- Publication number 20240332302
- Publication date Oct 3, 2024
- Intel Corporation
- Joseph D’SILVA
- H01 - BASIC ELECTRIC ELEMENTS

Mauro Kobrinsky

Person

Patents Grantslast 30 patents

Contact resistance reduction in transistor devices with metallizati...

Multi-height interconnect trenches for resistance and capacitance o...

Vertically stacked and bonded memory arrays

Skip level vias in metallization layers for integrated circuit devices

Skip level vias in metallization layers for integrated circuit devices

Hybrid manufacturing for integrated circuit devices and assemblies

Integrated circuit structures having partitioned source or drain co...

Gate-all-around integrated circuit structures having asymmetric sou...

Integrated circuits and methods for forming thin film crystal layers

Gate-all-around integrated circuit structures having removed substrate

Integrated circuit assemblies with direct chip attach to circuit bo...

Hybrid manufacturing for integrating photonic and electronic compon...

Use of a placeholder for backside contact formation for transistor...

Three-dimensional memory arrays with layer selector transistors

Transistor channel passivation with 2D crystalline material

Deep trench via for three-dimensional integrated circuit

Three-dimensional nanoribbon-based dynamic random-access memory

Integrated circuit device with crenellated metal trace layout

Fabrication of stackable embedded eDRAM using a binary alloy based...

Vertically spaced intra-level interconnect line metallization for i...

Microelectronic package with three-dimensional (3D) monolithic memo...

Device layer interconnects

Integrated circuits and methods for forming integrated circuits

Hybrid manufacturing for integrated circuit devices and assemblies

Gate-all-around integrated circuit structures having asymmetric sou...

Hybrid manufacturing of microeletronic assemblies with first and se...

Stress compensation for wafer to wafer bonding

Thin film transistor based memory cells on both sides of a layer of...

Integrated circuit structures having partitioned source or drain co...

Integrated circuit device with back-side interconnection to deep so...

Patents Applicationslast 30 patents

CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY

INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED PENETRATIN...

INTEGRATED CIRCUIT STRUCTURE WITH FRONT-SIDE-CUT BACKSIDE SOURCE OR...

BACKSIDE EPITAXIAL GROWTH FOR IMPROVED CONTACT AREA

FRONT SIDE AND BACKSIDE SOURCE OR DRAIN CONTACTS

INTEGRATED CIRCUIT STRUCTURE WITH ASYMMETRIC EPITAXIAL SOURCE OR DR...

TRANSISTORS WITH ASYMMETRIC SOURCE AND DRAIN CONTACTS

DIRECTED SELF ASSEMBLY-ENABLED BACK-SIDE CONTACT ARRAYS ALIGNED TO...

SELF-ALIGNED INTERCONNECT FEATURES WITH FLOATING DIELECTRIC STRUCTURE

SELF-ALIGNED BACK-SIDE GATE VIAS

INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...

DOUBLE-SIDED DEVICE CONTACTS AND THROUGH VIAS FOR PERFORMANCE AND L...

INTERCONNECT LAYERS WITH AIR GAPS

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

INTEGRATED CIRCUIT STRUCTURES HAVING PARTITIONED SOURCE OR DRAIN CO...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOU...

BACKSIDE SOURCE/DRAIN TRANSISTOR CONTACT FLOW WITH SELECTIVE ETCH M...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING REMOVED SUBSTRATE

INTEGRATED CIRCUIT STRUCTURE WITH DIFFERENTIATED SOURCE OR DRAIN ST...

HYBRID MANUFACTURING FOR INTEGRATING PHOTONIC AND ELECTRONIC COMPON...

USE OF A PLACEHOLDER FOR BACKSIDE CONTACT FORMATION FOR TRANSISTOR...

INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT REVEAL UNIFORMITY

BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT STITCHING

THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS

CONTACT RESISTANCE REDUCTION IN TRANSISTOR DEVICES WITH METALLIZATI...

INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE CONDUCTIVE SOURCE OR DR...