Mehul B. NAIK

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Monolithic complementary field-effect transistors having carbon-dop...
- Patent number 12,262,559
- Issue date Mar 25, 2025
- Applied Materials, Inc.
- Andrew Anthony Cockburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 12,046,508
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming backside power rails
- Patent number 12,002,705
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,967,527
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nickel silicide materials
- Patent number 11,965,236
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Minrui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse selective etch stop layer
- Patent number 11,955,382
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Kevin Kashefi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive metals and subtractive metal semiconductor structures
- Patent number 11,923,244
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,908,696
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cleaning a structure and method of depositing a capping l...
- Patent number 11,830,725
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Naomi Yoshida
- B08 - CLEANING
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,776,806
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,749,532
- Issue date Sep 5, 2023
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controllable metal and barrier-liner recess
- Patent number 11,705,366
- Issue date Jul 18, 2023
- Micromaterials LLC
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated contact silicide with tunable work functions
- Patent number 11,626,288
- Issue date Apr 11, 2023
- Applied Materials, Inc.
- Raymond Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 11,615,984
- Issue date Mar 28, 2023
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect for semiconductor device
- Patent number 11,508,617
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,410,885
- Issue date Aug 9, 2022
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,380,536
- Issue date Jul 5, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,373,903
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damage free metal conductor formation
- Patent number 11,289,342
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,257,677
- Issue date Feb 22, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatuses for forming interconnection structures
- Patent number 11,205,589
- Issue date Dec 21, 2021
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process integration approach for selective metal via fill
- Patent number 11,164,780
- Issue date Nov 2, 2021
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap fill deposition process
- Patent number 11,101,174
- Issue date Aug 24, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of selective deposition process
- Patent number 11,094,588
- Issue date Aug 17, 2021
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controllable metal and barrier-liner recess
- Patent number 11,062,942
- Issue date Jul 13, 2021
- Micromaterials LLC
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cobalt agglomeration resistance and gap-fill performance b...
- Patent number 11,043,415
- Issue date Jun 22, 2021
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a structure for semiconductor applications
- Patent number 10,957,533
- Issue date Mar 23, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a metal silicide interconnection nanowire struc...
- Patent number 10,930,472
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal silicide layers and metal silicide layers...
- Patent number 10,916,433
- Issue date Feb 9, 2021
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20240379420
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE SELECTIVE EPITAXY CONTACT APPROACH
- Publication number 20240363354
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- He REN
- C30 - CRYSTAL GROWTH
Information Patent Application
FABRICATION OF HIGH ASPECT RATIO ELECTRONIC DEVICES WITH MINIMAL SI...
- Publication number 20240321641
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES
- Publication number 20240213088
- Publication date Jun 27, 2024
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC COMPLEMENTARY FIELD-EFFECT TRANSISTORS HAVING CARBON-DOP...
- Publication number 20230326925
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Andrew Anthony Cockburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FORMING BACKSIDE POWER RAILS
- Publication number 20230260825
- Publication date Aug 17, 2023
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20230187276
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20230045689
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CONTACT SILICIDE WITH TUNABLE WORK FUNCTIONS
- Publication number 20230034058
- Publication date Feb 2, 2023
- Raymond HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220359224
- Publication date Nov 10, 2022
- Hao JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...
- Publication number 20220336271
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Aligned Subtractive Processes And Electronic Devices Therefrom
- Publication number 20220328352
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES
- Publication number 20220285212
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL
- Publication number 20220270871
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSE SELECTIVE ETCH STOP LAYER
- Publication number 20220181204
- Publication date Jun 9, 2022
- Applied Materials, Inc.
- Kevin Kashefi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20220130676
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-Step Pre-Clean for Selective Metal Gap Fill
- Publication number 20210351032
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20210317580
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Shi YOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods For Controllable Metal And Barrier-Liner Recess
- Publication number 20210305091
- Publication date Sep 30, 2021
- Micromaterials LLC.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING A STRUCTURE AND METHOD OF DEPOSITING A CAPPING L...
- Publication number 20210233765
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- Naomi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20210233770
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20210125864
- Publication date Apr 29, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILL DEPOSITION PROCESS
- Publication number 20210111067
- Publication date Apr 15, 2021
- Applied Materials, Inc.
- Hao JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR FORMING INTERCONNECTION STRUCTURES
- Publication number 20210104434
- Publication date Apr 8, 2021
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF SELECTIVE DEPOSITION PROCESS
- Publication number 20210074583
- Publication date Mar 11, 2021
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING METAL CONTACTS
- Publication number 20210066064
- Publication date Mar 4, 2021
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION APPROACH FOR SELECTIVE METAL VIA FILL
- Publication number 20200388533
- Publication date Dec 10, 2020
- Applied Materials, Inc.
- SHI YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Aligned Subtractive Processes And Electronic Devices Therefrom
- Publication number 20200350206
- Publication date Nov 5, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMAGE FREE METAL CONDUCTOR FORMATION
- Publication number 20200350178
- Publication date Nov 5, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED COBALT AGGLOMERATION RESISTANCE AND GAP-FILL PERFORMANCE B...
- Publication number 20200235006
- Publication date Jul 23, 2020
- Applied Materials, Inc.
- Zhiyuan WU
- H01 - BASIC ELECTRIC ELEMENTS

Mehul B. NAIK

Person

Patents Grantslast 30 patents

Monolithic complementary field-effect transistors having carbon-dop...

Method of dielectric material fill and treatment

Methods and apparatus for forming backside power rails

Doped selective metal caps to improve copper electromigration with...

Fully aligned subtractive processes and electronic devices therefrom

Method of forming nickel silicide materials

Reverse selective etch stop layer

Subtractive metals and subtractive metal semiconductor structures

Methods and devices for subtractive self-alignment

Method of cleaning a structure and method of depositing a capping l...

Multi-step pre-clean for selective metal gap fill

Methods and apparatus for processing a substrate

Methods for controllable metal and barrier-liner recess

Integrated contact silicide with tunable work functions

Method of dielectric material fill and treatment

Method of forming interconnect for semiconductor device

Fully aligned subtractive processes and electronic devices therefrom

Multi-step pre-clean for selective metal gap fill

Doped selective metal caps to improve copper electromigration with...

Damage free metal conductor formation

Methods and devices for subtractive self-alignment

Methods and apparatuses for forming interconnection structures

Process integration approach for selective metal via fill

Gap fill deposition process

Interconnection structure of selective deposition process

Methods for controllable metal and barrier-liner recess

Enhanced cobalt agglomeration resistance and gap-fill performance b...

Methods for etching a structure for semiconductor applications

Methods for forming a metal silicide interconnection nanowire struc...

Methods of forming metal silicide layers and metal silicide layers...

Patents Applicationslast 30 patents

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

LOW-TEMPERATURE SELECTIVE EPITAXY CONTACT APPROACH

FABRICATION OF HIGH ASPECT RATIO ELECTRONIC DEVICES WITH MINIMAL SI...

SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES

MONOLITHIC COMPLEMENTARY FIELD-EFFECT TRANSISTORS HAVING CARBON-DOP...

METHODS AND APPARATUS FOR FORMING BACKSIDE POWER RAILS

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE

INTEGRATED CONTACT SILICIDE WITH TUNABLE WORK FUNCTIONS

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...

Fully Aligned Subtractive Processes And Electronic Devices Therefrom

SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES

MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL

REVERSE SELECTIVE ETCH STOP LAYER

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

Multi-Step Pre-Clean for Selective Metal Gap Fill

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

Methods For Controllable Metal And Barrier-Liner Recess

METHOD OF CLEANING A STRUCTURE AND METHOD OF DEPOSITING A CAPPING L...

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE

GAP FILL DEPOSITION PROCESS

METHODS AND APPARATUSES FOR FORMING INTERCONNECTION STRUCTURES

INTERCONNECTION STRUCTURE OF SELECTIVE DEPOSITION PROCESS

METHODS AND APPARATUS FOR CLEANING METAL CONTACTS

PROCESS INTEGRATION APPROACH FOR SELECTIVE METAL VIA FILL

Fully Aligned Subtractive Processes And Electronic Devices Therefrom

DAMAGE FREE METAL CONDUCTOR FORMATION

ENHANCED COBALT AGGLOMERATION RESISTANCE AND GAP-FILL PERFORMANCE B...