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Kaohsiung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device package
Patent number
11,888,081
Issue date
Jan 30, 2024
Advanced Semiconductor Engineering, Inc.
Mei-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and a method of manufacturing the same
Patent number
11,784,296
Issue date
Oct 10, 2023
Advanced Semiconductor Engineering, Inc.
Mei-Yi Wu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Lid structure and semiconductor device package including the same
Patent number
11,776,862
Issue date
Oct 3, 2023
Advanced Semiconductor Engineering, Inc.
Chun-Han Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and a method of manufacturing the same
Patent number
11,211,536
Issue date
Dec 28, 2021
Advanced Semiconductor Engineering, Inc.
Mei-Yi Wu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Lid structure and semiconductor device package including the same
Patent number
10,804,173
Issue date
Oct 13, 2020
Advanced Semiconductor Engineering, Inc.
Chun-Han Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical package device
Patent number
10,686,105
Issue date
Jun 16, 2020
Advanced Semiconductor Engineering, Inc.
Mei-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and a method of manufacturing the same
Patent number
10,665,765
Issue date
May 26, 2020
Advanced Semiconductor Engineering, Inc.
Mei-Yi Wu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE
Publication number
20240170603
Publication date
May 23, 2024
Advanced Semiconductor Engineering, Inc.
Mei-Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE
Publication number
20220328713
Publication date
Oct 13, 2022
Advanced Semiconductor Engineering, Inc.
Mei-Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20220123192
Publication date
Apr 21, 2022
Advanced Semiconductor Engineering, Inc.
Mei-Yi WU
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210013375
Publication date
Jan 14, 2021
Advanced Semiconductor Engineering, Inc.
Mei-Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LID STRUCTURE AND SEMICONDUCTOR DEVICE PACKAGE INCLUDING THE SAME
Publication number
20210005522
Publication date
Jan 7, 2021
Advanced Semiconductor Engineering, Inc.
Chun-Han Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20200259058
Publication date
Aug 13, 2020
Advanced Semiconductor Engineering, Inc.
Mei-Yi WU
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
OPTICAL PACKAGE DEVICE
Publication number
20190386187
Publication date
Dec 19, 2019
Advanced Semiconductor Engineering, Inc.
Mei-Yi WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20180233643
Publication date
Aug 16, 2018
Advanced Semiconductor Engineering, Inc.
Mei-Yi WU
B81 - MICRO-STRUCTURAL TECHNOLOGY