Mei Zhu

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Electro chemical mechanical polishing method and device for planari...
- Patent number 7,285,145
- Issue date Oct 23, 2007
- LSI Corporation
- Mei Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electro chemical mechanical polishing method
- Patent number 6,858,531
- Issue date Feb 22, 2005
- LSI Logic Corporation
- Mei Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency electrochemical deposition
- Patent number 6,736,953
- Issue date May 18, 2004
- LSI Logic Corporation
- Mei Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Alkaline copper plating
- Patent number 6,664,633
- Issue date Dec 16, 2003
- LSI Logic Corporation
- Mei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical methods for polishing copper films on semiconductor...
- Patent number 6,402,592
- Issue date Jun 11, 2002
- Steag Cutek Systems, Inc.
- Mei Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR