Meizi JIAO

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 12,087,746
- Issue date Sep 10, 2024
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,721,677
- Issue date Aug 8, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 11,676,891
- Issue date Jun 13, 2023
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographically defined vertical interconnect access (VIA) in diel...
- Patent number 11,640,934
- Issue date May 2, 2023
- Intel Corporation
- Meizi Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,557,579
- Issue date Jan 17, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 11,227,825
- Issue date Jan 18, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 11,088,062
- Issue date Aug 10, 2021
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package power delivery using plane and shaped vias
- Patent number 10,971,416
- Issue date Apr 6, 2021
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a flexible wearable circuit
- Patent number 10,798,817
- Issue date Oct 6, 2020
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package power delivery using plane and shaped vias
- Patent number 10,410,939
- Issue date Sep 10, 2019
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20240088052
- Publication date Mar 14, 2024
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20230238368
- Publication date Jul 27, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
- Publication number 20230187205
- Publication date Jun 15, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20230022714
- Publication date Jan 26, 2023
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS
- Publication number 20220102261
- Publication date Mar 31, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20210327800
- Publication date Oct 21, 2021
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20210111166
- Publication date Apr 15, 2021
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20200312771
- Publication date Oct 1, 2020
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20200212020
- Publication date Jul 2, 2020
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
- Publication number 20200027728
- Publication date Jan 23, 2020
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE POWER DELIVERY USING PLANE AND SHAPED VIAS
- Publication number 20190355636
- Publication date Nov 21, 2019
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHICALLY DEFINED VERTICAL INTERCONNECT ACCESS (VIA) IN DIEL...
- Publication number 20190304889
- Publication date Oct 3, 2019
- Intel Corporation
- Meizi JIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ROUGHENED CU TRACE WITH ANCHORING TO REDUCE INSERTION LOSS OF H...
- Publication number 20190295937
- Publication date Sep 26, 2019
- Intel Corporation
- Chong ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FULLY EMBEDDED MAGNETIC-CORE IN CORE LAYER FOR CUSTOM INDUCTOR IN I...
- Publication number 20190272936
- Publication date Sep 5, 2019
- Intel Corporation
- Chong ZHANG
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20190027431
- Publication date Jan 24, 2019
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WE...
- Publication number 20180376585
- Publication date Dec 27, 2018
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVED PACKAGE POWER DELIVERY USING PLANE AND SHAPED VIAS
- Publication number 20180331003
- Publication date Nov 15, 2018
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS
- Publication number 20180315690
- Publication date Nov 1, 2018
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Microelectronic assemblies having an integrated capacitor

High performance integrated RF passives using dual lithography process

Patternable die attach materials and processes for patterning

Microelectronic assemblies having an integrated capacitor

Method to enable 30 microns pitch EMIB or below

Lithographically defined vertical interconnect access (VIA) in diel...

Microelectronic assemblies having an integrated capacitor

High performance integrated RF passives using dual lithography process

Method to enable 30 microns pitch EMIB or below

Package power delivery using plane and shaped vias

Method for making a flexible wearable circuit

Package power delivery using plane and shaped vias

Patents Applicationslast 30 patents

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

SUBSTRATE PACKAGE WITH GLASS DIELECTRIC

METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

SUBSTRATE PACKAGE WITH GLASS DIELECTRIC

PACKAGE POWER DELIVERY USING PLANE AND SHAPED VIAS

LITHOGRAPHICALLY DEFINED VERTICAL INTERCONNECT ACCESS (VIA) IN DIEL...

NON-ROUGHENED CU TRACE WITH ANCHORING TO REDUCE INSERTION LOSS OF H...

FULLY EMBEDDED MAGNETIC-CORE IN CORE LAYER FOR CUSTOM INDUCTOR IN I...

METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

MULTI-LAYER FLEXIBLE/STRETCHABLE ELECTRONIC PACKAGE FOR ADVANCED WE...

IMPROVED PACKAGE POWER DELIVERY USING PLANE AND SHAPED VIAS

HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS