Meng CHEN

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding method for semiconductor substrate, and bonded semiconducto...
- Patent number 11,393,772
- Issue date Jul 19, 2022
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning bonding interface before bonding
- Patent number 10,618,082
- Issue date Apr 14, 2020
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Annealing method for improving bonding strength
- Patent number 10,529,590
- Issue date Jan 7, 2020
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing substrate with insulated buried layer
- Patent number 10,388,529
- Issue date Aug 20, 2019
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing substrate with carrier trapping center
- Patent number 10,361,114
- Issue date Jul 23, 2019
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387241
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387171
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER
- Publication number 20240096645
- Publication date Mar 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING HOT-DIP GALVANIZED STEEL SHEET, AND STEEL...
- Publication number 20230295758
- Publication date Sep 21, 2023
- Baoshan Iron & Steel Co., Ltd
- Xinyan JIN
- C21 - METALLURGY OF IRON
Information Patent Application
ULTRA-HIGH-STRENGTH STEEL HAVING EXCELLENT PLASTICITY AND METHOD FO...
- Publication number 20230272511
- Publication date Aug 31, 2023
- Baoshan Iron & Steel Co., Ltd
- Mengxiao CHEN
- C21 - METALLURGY OF IRON
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND MANUFACTURE THEREOF
- Publication number 20230178366
- Publication date Jun 8, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT OF SOI WAFER
- Publication number 20230137599
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- C30 - CRYSTAL GROWTH
Information Patent Application
PROCESS OF SURFACE TREATMENT OF SOI WAFER
- Publication number 20230133916
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI STRUCTURED SEMICONDUCTOR SILICON WAFER AND METHOD OF MAKING THE...
- Publication number 20230133092
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER AND METHOD OF FINAL PROCESSING THE SAME
- Publication number 20230134308
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING THE SURFACE ROUGHNESS OF A SILICON-ON-INSULATO...
- Publication number 20230137992
- Publication date May 4, 2023
- Shanghai Institute of Microsystem and Information Technology Chinese Academy...
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATING A WAFER SURFACE
- Publication number 20230138958
- Publication date May 4, 2023
- Shanghai Institute of Microsystem and Information Technology Chinese Academy...
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLANARIZING WAFER SURFACE
- Publication number 20200168501
- Publication date May 28, 2020
- SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLANARIZING WAFER SURFACE
- Publication number 20200168452
- Publication date May 28, 2020
- SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND BONDED SEMICONDUCTO...
- Publication number 20200098703
- Publication date Mar 26, 2020
- SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANNEALING METHOD FOR IMPROVING BONDING STRENGTH
- Publication number 20180330964
- Publication date Nov 15, 2018
- Shanghai Simgui Tehcnology Co., Ltd.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SUBSTRATE WITH INSULATED BURIED LAYER
- Publication number 20180197741
- Publication date Jul 12, 2018
- Shanghai Simgui Tehcnology Co., Ltd.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SUBSTRATE WITH CARRIER TRAPPING CENTER
- Publication number 20180190539
- Publication date Jul 5, 2018
- Shanghai Simgui Tehcnology Co., Ltd.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SUBSTRATE WITH CARRIER TRAPPING CENTER
- Publication number 20180182662
- Publication date Jun 28, 2018
- Shanghai Simgui Tehcnology Co., Ltd.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING BONDING INTERFACE BEFORE BONDING
- Publication number 20180178257
- Publication date Jun 28, 2018
- Shanghai Simgui Tehcnology Co., Ltd.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND MATERIALS FOR HYDROLYZING POLYESTERS
- Publication number 20170113992
- Publication date Apr 27, 2017
- East China University of Science and Technology
- Guiping CAO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD FOR PREPARING LOW-WARPAGE SEMICONDUCTOR SUBSTRATE
- Publication number 20170018454
- Publication date Jan 19, 2017
- Shanghai Simgui Tehcnology Co., Ltd.
- Fei YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR SUBSTRATE WITH SMOOTH EDGES
- Publication number 20160379865
- Publication date Dec 29, 2016
- Shanghai Simgui Tehcnology Co., Ltd.
- Fei YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-WARPAGE SEMICONDUCTOR SUBSTRATE AND METHOD FOR PREPARING SAME
- Publication number 20160372424
- Publication date Dec 22, 2016
- Shanghai Simgui Tehcnology Co., Ltd.
- Fei YE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Bonding method for semiconductor substrate, and bonded semiconducto...

Method for cleaning bonding interface before bonding

Annealing method for improving bonding strength

Method for preparing substrate with insulated buried layer

Method for preparing substrate with carrier trapping center

Patents Applicationslast 30 patents

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

SOI WAFER

METHOD FOR MANUFACTURING HOT-DIP GALVANIZED STEEL SHEET, AND STEEL...

ULTRA-HIGH-STRENGTH STEEL HAVING EXCELLENT PLASTICITY AND METHOD FO...

SEMICONDUCTOR SUBSTRATE AND MANUFACTURE THEREOF

SURFACE TREATMENT OF SOI WAFER

PROCESS OF SURFACE TREATMENT OF SOI WAFER

SOI STRUCTURED SEMICONDUCTOR SILICON WAFER AND METHOD OF MAKING THE...

SOI WAFER AND METHOD OF FINAL PROCESSING THE SAME

METHOD FOR IMPROVING THE SURFACE ROUGHNESS OF A SILICON-ON-INSULATO...

METHOD FOR TREATING A WAFER SURFACE

METHOD FOR PLANARIZING WAFER SURFACE

METHOD FOR PLANARIZING WAFER SURFACE

BONDING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND BONDED SEMICONDUCTO...

ANNEALING METHOD FOR IMPROVING BONDING STRENGTH

METHOD FOR PREPARING SUBSTRATE WITH INSULATED BURIED LAYER

METHOD FOR PREPARING SUBSTRATE WITH CARRIER TRAPPING CENTER

METHOD FOR PREPARING SUBSTRATE WITH CARRIER TRAPPING CENTER

METHOD FOR CLEANING BONDING INTERFACE BEFORE BONDING

METHODS AND MATERIALS FOR HYDROLYZING POLYESTERS

METHOD FOR PREPARING LOW-WARPAGE SEMICONDUCTOR SUBSTRATE

METHOD FOR PREPARING SEMICONDUCTOR SUBSTRATE WITH SMOOTH EDGES

LOW-WARPAGE SEMICONDUCTOR SUBSTRATE AND METHOD FOR PREPARING SAME