Meng-Kai SHIH

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,166,009
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,742,324
- Issue date Aug 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement equipment and method for measuring warpage of a...
- Patent number 11,375,124
- Issue date Jun 28, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,217,502
- Issue date Jan 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having continously formed tapered prot...
- Patent number 11,164,756
- Issue date Nov 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,011,496
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 10,985,085
- Issue date Apr 20, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus and method for measuring warpage
- Patent number 10,861,726
- Issue date Dec 8, 2020
- Advanced Semiconductor Engineering, Inc.
- Chun Hung Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,840,219
- Issue date Nov 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,770,369
- Issue date Sep 8, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,586,716
- Issue date Mar 10, 2020
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,332,862
- Issue date Jun 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated metal pillars and manufacturi...
- Patent number 8,698,307
- Issue date Apr 15, 2014
- Advanced Semiconductor Engineering, Inc.
- Meng-Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250157947
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230411349
- Publication date Dec 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230011464
- Publication date Jan 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210288024
- Publication date Sep 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210134696
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210074676
- Publication date Mar 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200381338
- Publication date Dec 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200381345
- Publication date Dec 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200365485
- Publication date Nov 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200279814
- Publication date Sep 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MEASUREMENT EQUIPMENT AND METHOD FOR MEASURING WARPAGE OF A...
- Publication number 20200275030
- Publication date Aug 27, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming-Han WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200211863
- Publication date Jul 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MEASURING WARPAGE
- Publication number 20200098605
- Publication date Mar 26, 2020
- Advanced Semiconductor Engineering, Inc.
- Chun Hung TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200066612
- Publication date Feb 27, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190287947
- Publication date Sep 19, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...
- Publication number 20190214323
- Publication date Jul 11, 2019
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190074264
- Publication date Mar 7, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180358237
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...
- Publication number 20170141007
- Publication date May 18, 2017
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEPARATION APPARATUSES AND METHODS FOR SEPARATING GLASS SHEETS FROM...
- Publication number 20140138421
- Publication date May 22, 2014
- Corning Incorporated
- Gregory Clifford Gagnon
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTEGRATED METAL PILLARS AND MANUFACTURI...
- Publication number 20120074532
- Publication date Mar 29, 2012
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- MENG-KAI SHIH
- H01 - BASIC ELECTRIC ELEMENTS

Meng-Kai SHIH

Person

Patents Grantslast 30 patents

Semiconductor device packages and methods of manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Optical measurement equipment and method for measuring warpage of a...

Semiconductor device packages and methods of manufacturing the same

Semiconductor device package having continously formed tapered prot...

Semiconductor device packages and methods of manufacturing the same

Semiconductor device package and method for manufacturing the same

Apparatus and method for measuring warpage

Semiconductor package structure and method for manufacturing the same

Semiconductor device package

Semiconductor device package

Semiconductor package structure and method for manufacturing the same

Semiconductor package with integrated metal pillars and manufacturi...

Patents Applicationslast 30 patents

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL MEASUREMENT EQUIPMENT AND METHOD FOR MEASURING WARPAGE OF A...

SEMICONDUCTOR DEVICE PACKAGE

APPARATUS AND METHOD FOR MEASURING WARPAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...

SEPARATION APPARATUSES AND METHODS FOR SEPARATING GLASS SHEETS FROM...

SEMICONDUCTOR PACKAGE WITH INTEGRATED METAL PILLARS AND MANUFACTURI...