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Meng Wu

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  • Shanghai, CN
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Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE PROCESSING METHOD
    • Publication number 20240376625
    • Publication date Nov 14, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Meng Wu
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
    • Publication number 20240044038
    • Publication date Feb 8, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Hui Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR