Mengzhi Pang

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly having multiple substrate segments
- Patent number 12,261,110
- Issue date Mar 25, 2025
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical architecture for a multi-chip module
- Patent number 11,973,004
- Issue date Apr 30, 2024
- Tesla, Inc.
- Robert Yinan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 11,901,310
- Issue date Feb 13, 2024
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,670,548
- Issue date Jun 6, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having multiple substrate segments
- Patent number 11,367,680
- Issue date Jun 21, 2022
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device having imbedded array of components
- Patent number 11,122,678
- Issue date Sep 14, 2021
- Tesla, Inc.
- Vijaykumar Krithivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trimmable banked capacitor
- Patent number 11,069,665
- Issue date Jul 20, 2021
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 10,818,632
- Issue date Oct 27, 2020
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided silicon integrated passive devices
- Patent number 10,103,138
- Issue date Oct 16, 2018
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 9,935,076
- Issue date Apr 3, 2018
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided silicon integrated passive devices
- Patent number 9,748,227
- Issue date Aug 29, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side mounting memory integration in thin low warpage fanout...
- Patent number 9,659,907
- Issue date May 23, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package fan out stacking architecture and process flow
- Patent number 9,633,974
- Issue date Apr 25, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced wafer level fan-out POP package
- Patent number 9,318,474
- Issue date Apr 19, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielded wafer level fan-out pop package
- Patent number 9,236,355
- Issue date Jan 12, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost and high performance flip chip package
- Patent number 8,957,516
- Issue date Feb 17, 2015
- Broadcom Corporation
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced bump pitch scaling
- Patent number 8,508,054
- Issue date Aug 13, 2013
- Broadcom Corporation
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENOUS MULTI-LAYER STRUCTURE
- Publication number 20240357769
- Publication date Oct 24, 2024
- Tesla, Inc.
- Shishuang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE
- Publication number 20240234243
- Publication date Jul 11, 2024
- Tesla, Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...
- Publication number 20240145432
- Publication date May 2, 2024
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Assembly with Improved Thermal Management
- Publication number 20230317689
- Publication date Oct 5, 2023
- Google LLC
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING MULTIPLE SUBSTRATE SEGMENTS
- Publication number 20220392836
- Publication date Dec 8, 2022
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20220051994
- Publication date Feb 17, 2022
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL ARCHITECTURE FOR A MULTI-CHIP MODULE
- Publication number 20210351104
- Publication date Nov 11, 2021
- Tesla, Inc.
- Robert Yinan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20210043511
- Publication date Feb 11, 2021
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING MULTIPLE SUBSTRATE SEGMENTS
- Publication number 20210005546
- Publication date Jan 7, 2021
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE HAVING EMBEDDED ARRAY OF COMPONENTS
- Publication number 20200221568
- Publication date Jul 9, 2020
- Tesla, Inc.
- Jin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIMMABLE BANKED CAPACITOR
- Publication number 20200176427
- Publication date Jun 4, 2020
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SILICON INTEGRATED PASSIVE DEVICES
- Publication number 20170323883
- Publication date Nov 9, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SILICON INTEGRATED PASSIVE DEVICES
- Publication number 20170018546
- Publication date Jan 19, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE MOUNTING MEMORY INTEGRATION IN THIN LOW WARPAGE FANOUT...
- Publication number 20160300813
- Publication date Oct 13, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE FAN OUT STACKING ARCHITECTURE AND PROCESS FLOW
- Publication number 20160260684
- Publication date Sep 8, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MEMORY DIE AND LOGIC DIE INTERCONNECTED IN A FACE-TO-F...
- Publication number 20150380392
- Publication date Dec 31, 2015
- Apple Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELDED WAFER LEVEL FAN-OUT POP PACKAGE
- Publication number 20150303149
- Publication date Oct 22, 2015
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Wafer Level Fan-Out POP Package
- Publication number 20150171063
- Publication date Jun 18, 2015
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST AND HIGH PERFORMANCE FLIP CHIP PACKAGE
- Publication number 20140217573
- Publication date Aug 7, 2014
- BROADCOM CORPORATION
- Mengzhi PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost and High Performance Flip Chip Package
- Publication number 20130187284
- Publication date Jul 25, 2013
- BROADCOM CORPORATION
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Between Integrated Circuit and Package
- Publication number 20130075907
- Publication date Mar 28, 2013
- BROADCOM CORPORATION
- Mengzhi PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Bump Pitch Scaling
- Publication number 20120319269
- Publication date Dec 20, 2012
- BROADCOM CORPORATION
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS

Mengzhi Pang

Person

Patents Grantslast 30 patents

Electronic assembly having multiple substrate segments

Mechanical architecture for a multi-chip module

Structure and method for fabricating a computing system with an int...

Electronic assembly

Structure and method for fabricating a computing system with an int...

Electronic assembly having multiple substrate segments

Packaged device having imbedded array of components

Trimmable banked capacitor

Structure and method for fabricating a computing system with an int...

Dual-sided silicon integrated passive devices

Structure and method for fabricating a computing system with an int...

Dual-sided silicon integrated passive devices

Double side mounting memory integration in thin low warpage fanout...

System in package fan out stacking architecture and process flow

Thermally enhanced wafer level fan-out POP package

EMI shielded wafer level fan-out pop package

Low cost and high performance flip chip package

Enhanced bump pitch scaling

Patents Applicationslast 30 patents

HETEROGENOUS MULTI-LAYER STRUCTURE

Structure and Method for Fabricating a Computing System with an Int...

ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE

COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...

Structure and Method for Fabricating a Computing System with an Int...

Package-on-Package Assembly with Improved Thermal Management

ELECTRONIC ASSEMBLY HAVING MULTIPLE SUBSTRATE SEGMENTS

ELECTRONIC ASSEMBLY

MECHANICAL ARCHITECTURE FOR A MULTI-CHIP MODULE

Structure and Method for Fabricating a Computing System with an Int...

ELECTRONIC ASSEMBLY HAVING MULTIPLE SUBSTRATE SEGMENTS

PACKAGED DEVICE HAVING EMBEDDED ARRAY OF COMPONENTS

TRIMMABLE BANKED CAPACITOR

DUAL-SIDED SILICON INTEGRATED PASSIVE DEVICES

DUAL-SIDED SILICON INTEGRATED PASSIVE DEVICES

DOUBLE SIDE MOUNTING MEMORY INTEGRATION IN THIN LOW WARPAGE FANOUT...

SYSTEM IN PACKAGE FAN OUT STACKING ARCHITECTURE AND PROCESS FLOW

PACKAGE WITH MEMORY DIE AND LOGIC DIE INTERCONNECTED IN A FACE-TO-F...

EMI SHIELDED WAFER LEVEL FAN-OUT POP PACKAGE

Thermally Enhanced Wafer Level Fan-Out POP Package

LOW COST AND HIGH PERFORMANCE FLIP CHIP PACKAGE

Low Cost and High Performance Flip Chip Package

Interconnection Between Integrated Circuit and Package

Enhanced Bump Pitch Scaling