Michael B. Cohn

Person

Berkeley, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS device with integral packaging
- Patent number 8,295,027
- Issue date Oct 23, 2012
- Microassembly Technologies, Inc.
- Michael Bennett Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with integral packaging
- Patent number 8,179,215
- Issue date May 15, 2012
- Microassembly Technologies, Inc.
- Michael Bennett Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems using thermocompression bonding
- Patent number 7,750,462
- Issue date Jul 6, 2010
- Microassembly Technologies, Inc.
- Michael Bennett Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High force MEMS device
- Patent number 7,692,521
- Issue date Apr 6, 2010
- Microassembly Technologies, Inc.
- Michael B. Cohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical systems using thermocompression bonding
- Patent number 7,276,789
- Issue date Oct 2, 2007
- Microassembly Technologies, Inc.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with integral packaging
- Patent number 6,872,902
- Issue date Mar 29, 2005
- Microassembly Technologies, Inc.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems using thermocompression bonding
- Patent number 6,853,067
- Issue date Feb 8, 2005
- Microassembly Technologies, Inc.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-to-wafer transfer of microstructures using break-away tethers
- Patent number 6,142,358
- Issue date Nov 7, 2000
- The Regents of the University of California
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE WITH INTEGRAL PACKAGING
- Publication number 20120193754
- Publication date Aug 2, 2012
- MICROASSEMBLY TECHNOLOGIES, INC.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH INTEGRAL PACKAGING
- Publication number 20080272867
- Publication date Nov 6, 2008
- MICROASSEMBLY TECHNOLOGIES, INC.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS device with integral packaging
- Publication number 20050168306
- Publication date Aug 4, 2005
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS device with integral packaging
- Publication number 20040066258
- Publication date Apr 8, 2004
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Compliant hermetic package
- Publication number 20020179921
- Publication date Dec 5, 2002
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromachined springs for strain relieved electrical connections to...
- Publication number 20020146919
- Publication date Oct 10, 2002
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS device with integral packaging
- Publication number 20020096421
- Publication date Jul 25, 2002
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Michael B. Cohn

Person

Patents Grantslast 30 patents

MEMS device with integral packaging

MEMS device with integral packaging

Microelectromechanical systems using thermocompression bonding

High force MEMS device

Microelectromechanical systems using thermocompression bonding

MEMS device with integral packaging

Microelectromechanical systems using thermocompression bonding

Wafer-to-wafer transfer of microstructures using break-away tethers

Patents Applicationslast 30 patents

MEMS DEVICE WITH INTEGRAL PACKAGING

MEMS DEVICE WITH INTEGRAL PACKAGING

MEMS device with integral packaging

MEMS device with integral packaging

Compliant hermetic package

Micromachined springs for strain relieved electrical connections to...

MEMS device with integral packaging