MICHAEL B. MCSHANE

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical die test interface with separate voltages for adjacent elec...
- Patent number 10,230,458
- Issue date Mar 12, 2019
- NXP USA, INC.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defective die replacement in a die stack
- Patent number 10,177,052
- Issue date Jan 8, 2019
- NXP USA, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack address bus having a programmable width
- Patent number 10,002,653
- Issue date Jun 19, 2018
- NXP USA, INC.
- Perry H. Pelley
- G11 - INFORMATION STORAGE
Information Patent Grant
Optical backplane mirror
- Patent number 9,810,843
- Issue date Nov 7, 2017
- NXP USA, INC.
- Tab A. Stephens
- G02 - OPTICS
Information Patent Grant
Optical redundancy
- Patent number 9,766,409
- Issue date Sep 19, 2017
- NXP USA, INC.
- Perry H. Pelley
- G02 - OPTICS
Information Patent Grant
Thin low profile strip dual in-line memory module
- Patent number 9,480,161
- Issue date Oct 25, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- G11 - INFORMATION STORAGE
Information Patent Grant
Integration of a MEMS beam with optical waveguide and deflection in...
- Patent number 9,435,952
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- G02 - OPTICS
Information Patent Grant
Microelectronic assembly having a heat spreader for a plurality of die
- Patent number 9,431,380
- Issue date Aug 30, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond recess for stacked die
- Patent number 9,318,451
- Issue date Apr 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tim V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical wafer and die probe testing
- Patent number 9,261,556
- Issue date Feb 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. McShane
- G01 - MEASURING TESTING
Information Patent Grant
Techniques for reducing inductance in through-die vias of an electr...
- Patent number 9,099,475
- Issue date Aug 4, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for reducing heat exposure of thermally sens...
- Patent number 9,093,429
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication system die stack
- Patent number 9,091,820
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- G02 - OPTICS
Information Patent Grant
Die stack with optical TSVs
- Patent number 9,094,135
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Edge coupling of semiconductor dies
- Patent number 9,087,702
- Issue date Jul 21, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tim V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices
- Patent number 9,082,757
- Issue date Jul 14, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die with continuous conductive vias
- Patent number 9,076,664
- Issue date Jul 7, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having a heat spreader for a plurality of die
- Patent number 9,070,653
- Issue date Jun 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate security feature
- Patent number 8,980,734
- Issue date Mar 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using an integrated circuit die configuration for package height re...
- Patent number 8,957,510
- Issue date Feb 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tim V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices
- Patent number 8,796,822
- Issue date Aug 5, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with nonconductive vias
- Patent number 8,796,855
- Issue date Aug 5, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for reducing heat exposure of thermally sens...
- Patent number 8,680,674
- Issue date Mar 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 8,501,539
- Issue date Aug 6, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge mounted integrated circuits with heat sink
- Patent number 8,004,080
- Issue date Aug 23, 2011
- Freescale Smeiconductor, Inc.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth cache-to-processing unit communication in a multiple...
- Patent number 7,777,330
- Issue date Aug 17, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flagless semiconductor device
- Patent number 5,521,428
- Issue date May 28, 1996
- Motorola, Inc.
- Tom R. Hollingsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded carrier ring leadframe having a particular resin injecting a...
- Patent number 5,517,056
- Issue date May 14, 1996
- Motorola, Inc.
- Charles G. Bigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid encapsulated ball grid array semiconductor device with fine...
- Patent number 5,468,999
- Issue date Nov 21, 1995
- Motorola, Inc.
- Paul T. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a lead-on-chip semiconductor device having periph...
- Patent number 5,455,200
- Issue date Oct 3, 1995
- Motorola, Inc.
- Charles G. Bigler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE STACK ADDRESS BUS HAVING A PROGRAMMABLE WIDTH
- Publication number 20160118095
- Publication date Apr 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEFECTIVE DIE REPLACEMENT IN A DIE STACK
- Publication number 20150287653
- Publication date Oct 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE
- Publication number 20150214208
- Publication date Jul 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. STEPHENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Low Profile Strip Dual In-Line Memory Module
- Publication number 20150208510
- Publication date Jul 23, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Perry H. Pelley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SEMICONDUCTOR DEVICES
- Publication number 20150115463
- Publication date Apr 30, 2015
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND RECESS FOR STACKED DIE
- Publication number 20150115474
- Publication date Apr 30, 2015
- TIM V. PHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE COUPLING OF SEMICONDUCTOR DIES
- Publication number 20150061097
- Publication date Mar 5, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tim V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING AN INTEGRATED CIRCUIT DIE CONFIGURATION FOR PACKAGE HEIGHT RE...
- Publication number 20150008567
- Publication date Jan 8, 2015
- TIM V. PHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Backplane Mirror
- Publication number 20140363120
- Publication date Dec 11, 2014
- Tab A. Stephens
- G02 - OPTICS
Information Patent Application
Optical Die Test Interface
- Publication number 20140363153
- Publication date Dec 11, 2014
- Michael B. McShane
- G01 - MEASURING TESTING
Information Patent Application
Integration of a MEMS Beam with Optical Waveguide and Deflection in...
- Publication number 20140363119
- Publication date Dec 11, 2014
- Tab A. Stephens
- G02 - OPTICS
Information Patent Application
Optical Redundancy
- Publication number 20140363124
- Publication date Dec 11, 2014
- Perry H. Pelley
- G02 - OPTICS
Information Patent Application
Die Stack with Optical TSVs
- Publication number 20140363172
- Publication date Dec 11, 2014
- Perry H. Pelley
- G02 - OPTICS
Information Patent Application
Optical Wafer and Die Probe Testing
- Publication number 20140363905
- Publication date Dec 11, 2014
- Michael B. McShane
- G02 - OPTICS
Information Patent Application
Communication System Die Stack
- Publication number 20140362425
- Publication date Dec 11, 2014
- Tab A. Stephens
- G02 - OPTICS
Information Patent Application
Gate Security Feature
- Publication number 20140252487
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. Stephens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE
- Publication number 20140197541
- Publication date Jul 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Tab A. STEPHENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR REDUCING INDUCTANCE IN THROUGH-DIE VIAS OF AN ELECTR...
- Publication number 20140071652
- Publication date Mar 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- MICHAEL B. MCSHANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENS...
- Publication number 20140001641
- Publication date Jan 2, 2014
- Michael B. Mcshane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENS...
- Publication number 20130320480
- Publication date Dec 5, 2013
- Michael B. Mcshane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH NONCONDUCTIVE VIAS
- Publication number 20130181350
- Publication date Jul 18, 2013
- Perry H. PELLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICES
- Publication number 20130088255
- Publication date Apr 11, 2013
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICES
- Publication number 20130087926
- Publication date Apr 11, 2013
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-to-package stacking by using interposer with traces, and or...
- Publication number 20120020040
- Publication date Jan 26, 2012
- Paul T. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20110108965
- Publication date May 12, 2011
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE MOUNTED INTEGRATED CIRCUITS WITH HEAT SINK
- Publication number 20110057306
- Publication date Mar 10, 2011
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR PACKAGING MULTIPLE INTEGRATED CIRCUITS
- Publication number 20100117242
- Publication date May 13, 2010
- Gary L. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH CACHE-TO-PROCESSING UNIT COMMUNICATION IN A MULTIPLE...
- Publication number 20090196086
- Publication date Aug 6, 2009
- Perry H. Pelley
- H01 - BASIC ELECTRIC ELEMENTS

MICHAEL B. MCSHANE

Person

Patents Grantslast 30 patents

Optical die test interface with separate voltages for adjacent elec...

Defective die replacement in a die stack

Die stack address bus having a programmable width

Optical backplane mirror

Optical redundancy

Thin low profile strip dual in-line memory module

Integration of a MEMS beam with optical waveguide and deflection in...

Microelectronic assembly having a heat spreader for a plurality of die

Wirebond recess for stacked die

Optical wafer and die probe testing

Techniques for reducing inductance in through-die vias of an electr...

Methods and structures for reducing heat exposure of thermally sens...

Communication system die stack

Die stack with optical TSVs

Edge coupling of semiconductor dies

Stacked semiconductor devices

Stacked semiconductor die with continuous conductive vias

Microelectronic assembly having a heat spreader for a plurality of die

Gate security feature

Using an integrated circuit die configuration for package height re...

Stacked semiconductor devices

Semiconductor devices with nonconductive vias

Methods and structures for reducing heat exposure of thermally sens...

Semiconductor device package

Edge mounted integrated circuits with heat sink

High bandwidth cache-to-processing unit communication in a multiple...

Flagless semiconductor device

Molded carrier ring leadframe having a particular resin injecting a...

Liquid encapsulated ball grid array semiconductor device with fine...

Method for making a lead-on-chip semiconductor device having periph...

Patents Applicationslast 30 patents

DIE STACK ADDRESS BUS HAVING A PROGRAMMABLE WIDTH

DEFECTIVE DIE REPLACEMENT IN A DIE STACK

MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE

Thin Low Profile Strip Dual In-Line Memory Module

STACKED SEMICONDUCTOR DEVICES

WIREBOND RECESS FOR STACKED DIE

EDGE COUPLING OF SEMICONDUCTOR DIES

USING AN INTEGRATED CIRCUIT DIE CONFIGURATION FOR PACKAGE HEIGHT RE...

Optical Backplane Mirror

Optical Die Test Interface

Integration of a MEMS Beam with Optical Waveguide and Deflection in...

Optical Redundancy

Die Stack with Optical TSVs

Optical Wafer and Die Probe Testing

Communication System Die Stack

Gate Security Feature

MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE

TECHNIQUES FOR REDUCING INDUCTANCE IN THROUGH-DIE VIAS OF AN ELECTR...

METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENS...

METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENS...

SEMICONDUCTOR DEVICES WITH NONCONDUCTIVE VIAS

STACKED SEMICONDUCTOR DEVICES

STACKED SEMICONDUCTOR DEVICES

Package-to-package stacking by using interposer with traces, and or...

SEMICONDUCTOR DEVICE PACKAGE

EDGE MOUNTED INTEGRATED CIRCUITS WITH HEAT SINK

TECHNIQUE FOR PACKAGING MULTIPLE INTEGRATED CIRCUITS

HIGH BANDWIDTH CACHE-TO-PROCESSING UNIT COMMUNICATION IN A MULTIPLE...