Michael C. Ayukawa

Follow

Person

Ecublens, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Routing under bond pad for the replacement of an interconnect layer
- Patent number 8,319,343
- Issue date Nov 27, 2012
- Agere Systems LLC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20070063352
- Publication date Mar 22, 2007
- Agere Systems Inc.
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS