Michael C. Loo

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Redistribution layer for wafer-level chip scale package and method...
- Patent number 7,709,954
- Issue date May 4, 2010
- NXP B.V.
- Michael C. Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for low cost and ultra thin chip scale package
- Patent number 6,191,483
- Issue date Feb 20, 2001
- Philips Electronics North America Corporation
- Mike C. Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die metal layout for flip chip packaging
- Patent number 6,118,180
- Issue date Sep 12, 2000
- LSI Logic Corporation
- Mike C. Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a flip-chip
- Patent number 5,784,780
- Issue date Jul 28, 1998
- LSI Logic Corporation
- Mike C. Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Upgradable multi-chip module
- Patent number 5,648,893
- Issue date Jul 15, 1997
- Sun Microsystems, Inc.
- Mike C. Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Upgradable multi-chip module
- Patent number 5,648,890
- Issue date Jul 15, 1997
- Sun Microsystems, Inc.
- Mike C. Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High contact density ball grid array package for flip-chips
- Patent number 5,637,920
- Issue date Jun 10, 1997
- LSI Logic Corporation
- Mike C. Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tab semiconductor package with cushioned land grid array outer lead...
- Patent number 5,394,009
- Issue date Feb 28, 1995
- Sun Microsystems, Inc.
- Mike C. Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip cooling module and method
- Patent number 5,380,956
- Issue date Jan 10, 1995
- Sun Microsystems, Inc.
- Mike C. Loo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION LAYER FOR WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD...
- Publication number 20090072397
- Publication date Mar 19, 2009
- NXP B.V.
- Michael C. Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Increasing a Routing Density For a Circuit Board and Suc...
- Publication number 20080251286
- Publication date Oct 16, 2008
- Koninklijke Philips Electronics N.V.
- Lily Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optimum power and ground bump pad and bump patterns for flip chip p...
- Publication number 20030102159
- Publication date Jun 5, 2003
- Mike C. Loo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit boards and printed circuit board based substrates s...
- Publication number 20030031830
- Publication date Feb 13, 2003
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS

Michael C. Loo

Person

Patents Grantslast 30 patents

Redistribution layer for wafer-level chip scale package and method...

Package structure for low cost and ultra thin chip scale package

Semiconductor die metal layout for flip chip packaging

Method of mounting a flip-chip

Upgradable multi-chip module

Upgradable multi-chip module

High contact density ball grid array package for flip-chips

Tab semiconductor package with cushioned land grid array outer lead...

Multi-chip cooling module and method

Patents Applicationslast 30 patents

REDISTRIBUTION LAYER FOR WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD...

Method For Increasing a Routing Density For a Circuit Board and Suc...

Optimum power and ground bump pad and bump patterns for flip chip p...

Printed circuit boards and printed circuit board based substrates s...