Michael F. Lofaro

Person

Brookfield, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
MRAM structure with T-shaped bottom electrode to overcome galvanic...
- Patent number 10,944,044
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Pouya Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined CMP and RIE contact scheme for MRAM applications
- Patent number 10,644,233
- Issue date May 5, 2020
- International Business Machines Corporation
- Michael F. Lofaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded noble metal electrodes in microfluidics
- Patent number 10,247,700
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Huan Hu
- G01 - MEASURING TESTING
Information Patent Grant
Combined CMP and RIE contact scheme for MRAM applications
- Patent number 10,236,443
- Issue date Mar 19, 2019
- International Business Machines Corporation
- Michael F. Lofaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film interconnects with large grains
- Patent number 10,170,361
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Robert L Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined CMP and RIE contact scheme for MRAM applications
- Patent number 10,014,464
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Michael F. Lofaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanogap structure for micro/nanofluidic systems formed by sacrifici...
- Patent number 9,914,118
- Issue date Mar 13, 2018
- International Business Machines Corporation
- Yann A. Astier
- B24 - GRINDING POLISHING
Information Patent Grant
Embedded noble metal electrodes in microfluidics
- Patent number 9,804,122
- Issue date Oct 31, 2017
- International Business Machines Corporation
- Huan Hu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Nanogap structure for micro/nanofluidic systems formed by sacrifici...
- Patent number 9,782,773
- Issue date Oct 10, 2017
- International Business Machines Corporation
- Yann A. Astier
- B24 - GRINDING POLISHING
Information Patent Grant
Nanogap in-between noble metals
- Patent number 9,012,329
- Issue date Apr 21, 2015
- International Business Machines Corporation
- Yann Astier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-generational carrier platform
- Patent number 8,807,318
- Issue date Aug 19, 2014
- International Business Machines Corporation
- Michael F. Lofaro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-generational carrier platform
- Patent number 8,794,427
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Michael F. Lofaro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-spindle chemical mechanical planarization tool
- Patent number 8,591,289
- Issue date Nov 26, 2013
- International Business Machines Corporation
- Michael A. Cobb
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-spindle chemical mechanical planarization tool
- Patent number 8,535,118
- Issue date Sep 17, 2013
- International Business Machines Corporation
- Michael A. Cobb
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization with overburden mask
- Patent number 8,524,606
- Issue date Sep 3, 2013
- International Business Machines Corporation
- Leslie Charns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical planarization processes for fabrication of FinF...
- Patent number 8,513,127
- Issue date Aug 20, 2013
- International Business Machines Corporation
- Josephine B. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of replacement metal gate devices
- Patent number 8,507,383
- Issue date Aug 13, 2013
- International Business Machines Corporation
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench isolation chemical mechanical planarization
- Patent number 8,497,210
- Issue date Jul 30, 2013
- International Business Machines Corporation
- Leslie Charns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a self-aligned bit line for PCRAM and self-align...
- Patent number 8,445,313
- Issue date May 21, 2013
- International Business Machines Corporatoin
- Matthew J. Breitwisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a self-aligned bit line for PCRAM and self-align...
- Patent number 8,273,598
- Issue date Sep 25, 2012
- International Business Machines Corporation
- Matthew J. Breitwisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-yield method of exposing and contacting through-silicon vias
- Patent number 8,263,497
- Issue date Sep 11, 2012
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass mold polishing method and structure
- Patent number 7,955,160
- Issue date Jun 7, 2011
- International Business Machines Corporation
- Michael A. Cobb
- B24 - GRINDING POLISHING
Information Patent Grant
Structure and method for formation of cladded interconnects for MRAMs
- Patent number 7,442,647
- Issue date Oct 28, 2008
- International Business Machines Corporation
- Sivananda Kanakasabapathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer cap structure including HDP/bHDP films for conductive metal...
- Patent number 7,179,760
- Issue date Feb 20, 2007
- International Buisness Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 7,064,064
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication of MIMCAP and resistor at same level
- Patent number 7,022,246
- Issue date Apr 4, 2006
- International Business Machines Corporation
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 6,975,032
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for mechanical polishing (CMP) of metals and use thereof
- Patent number 6,812,193
- Issue date Nov 2, 2004
- International Business Machines Corporation
- Michael Todd Brigham
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Apparatus and method for wafer cleaning
- Patent number 6,648,979
- Issue date Nov 18, 2003
- International Business Machines Corporation
- Michael F. Lofaro
- B08 - CLEANING
Information Patent Grant
Multi-wafer polishing tool
- Patent number 6,478,665
- Issue date Nov 12, 2002
- International Business Machines Corporation
- Michael Francis Lofaro
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION SLURRIES AND PROCESSES FOR PLATIN...
- Publication number 20220277964
- Publication date Sep 1, 2022
- International Business Machines Corporation
- Mahadevaiyer Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM STRUCTURE WITH T-SHAPED BOTTOM ELECTRODE TO OVERCOME GALVANIC...
- Publication number 20210043827
- Publication date Feb 11, 2021
- International Business Machines Corporation
- Pouya Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED CMP AND RIE CONTACT SCHEME FOR MRAM APPLICATIONS
- Publication number 20180254410
- Publication date Sep 6, 2018
- International Business Machines Corporation
- Michael F. Lofaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED CMP AND RIE CONTACT SCHEME FOR MRAM APPLICATIONS
- Publication number 20180254411
- Publication date Sep 6, 2018
- International Business Machines Corporation
- Michael F. Lofaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED NOBLE METAL ELECTRODES IN MICROFLUIDICS
- Publication number 20170120246
- Publication date May 4, 2017
- International Business Machines Corporation
- Huan Hu
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDED NOBLE METAL ELECTRODES IN MICROFLUIDICS
- Publication number 20170122903
- Publication date May 4, 2017
- International Business Machines Corporation
- Huan Hu
- G01 - MEASURING TESTING
Information Patent Application
NANOGAP STRUCTURE FOR MICRO/NANOFLUIDIC SYSTEMS FORMED BY SACRIFICI...
- Publication number 20170045475
- Publication date Feb 16, 2017
- International Business Machines Corporation
- Yann A. Astier
- G01 - MEASURING TESTING
Information Patent Application
NANOGAP STRUCTURE FOR MICRO/NANOFLUIDIC SYSTEMS FORMED BY SACRIFICI...
- Publication number 20170043339
- Publication date Feb 16, 2017
- International Business Machines Corporation
- Yann A. Astier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN FILM INTERCONNECTS WITH LARGE GRAINS
- Publication number 20150348832
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Robert L. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanogap in-between noble metals
- Publication number 20140302675
- Publication date Oct 9, 2014
- International Business Machines Corporation
- Yann Astier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-SPINDLE CHEMICAL MECHANICAL PLANARIZATION TOOL
- Publication number 20130316623
- Publication date Nov 28, 2013
- International Business Machines Corporation
- Michael A. Cobb
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-SPINDLE CHEMICAL MECHANICAL PLANARIZATION TOOL
- Publication number 20130072092
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Michael F. Lofaro
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-SPINDLE CHEMICAL MECHANICAL PLANARIZATION TOOL
- Publication number 20130072089
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Michael F. Lofaro
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-GENERATIONAL CARRIER PLATFORM
- Publication number 20130068588
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Michael F. Lofaro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-GENERATIONAL CARRIER PLATFORM
- Publication number 20130068592
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Michael F. Lofaro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A SELF-ALIGNED BIT LINE FOR PCRAM AND SELF-ALIGN...
- Publication number 20120276688
- Publication date Nov 1, 2012
- Macronix International Co., Ltd.
- Matthew J. Breitwisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SELF-ALIGNED BIT LINE FOR PCRAM AND SELF-ALIGN...
- Publication number 20120202333
- Publication date Aug 9, 2012
- Macronix International Co., Ltd.
- Matthew J. Breitwisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Planarization Processes For Fabrication of FINF...
- Publication number 20120083123
- Publication date Apr 5, 2012
- JSR Corporation
- Josephine B. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shallow Trench Isolation Chemical Mechanical Planarization
- Publication number 20120083122
- Publication date Apr 5, 2012
- JSR Corporation
- Leslie Charns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of Replacement Metal Gate Devices
- Publication number 20120083121
- Publication date Apr 5, 2012
- JSR Corporation
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-YIELD METHOD OF EXPOSING AND CONTACTING THROUGH-SILICON VIAS
- Publication number 20100178766
- Publication date Jul 15, 2010
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS MOLD POLISHING METHOD AND STRUCTURE
- Publication number 20090305616
- Publication date Dec 10, 2009
- Michael A. Cobb
- B24 - GRINDING POLISHING
Information Patent Application
Homogeneous Copper Interconnects for BEOL
- Publication number 20080156636
- Publication date Jul 3, 2008
- International Business Machines Corporation
- Kevin S. Petrarca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METAL...
- Publication number 20060270245
- Publication date Nov 30, 2006
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Homogeneous Copper Interconnects for BEOL
- Publication number 20060071338
- Publication date Apr 6, 2006
- International Business Machines Corporation
- Kevin S. Petrarca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20050158985
- Publication date Jul 21, 2005
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabrication of MIMCAP and resistor at same level
- Publication number 20040130434
- Publication date Jul 8, 2004
- International Business Machines Corporation
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20040113279
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry for mechanical polishing (CMP) of metals and use thereof
- Publication number 20030073593
- Publication date Apr 17, 2003
- Michael Todd Brigham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for wafer cleaning
- Publication number 20020096191
- Publication date Jul 25, 2002
- International Business Machines Corporation
- Michael F. Lofaro
- H01 - BASIC ELECTRIC ELEMENTS

Michael F. Lofaro

Person

Patents Grantslast 30 patents

MRAM structure with T-shaped bottom electrode to overcome galvanic...

Combined CMP and RIE contact scheme for MRAM applications

Embedded noble metal electrodes in microfluidics

Combined CMP and RIE contact scheme for MRAM applications

Thin film interconnects with large grains

Combined CMP and RIE contact scheme for MRAM applications

Nanogap structure for micro/nanofluidic systems formed by sacrifici...

Embedded noble metal electrodes in microfluidics

Nanogap structure for micro/nanofluidic systems formed by sacrifici...

Nanogap in-between noble metals

Multi-generational carrier platform

Multi-generational carrier platform

Multi-spindle chemical mechanical planarization tool

Multi-spindle chemical mechanical planarization tool

Chemical mechanical planarization with overburden mask

Chemical mechanical planarization processes for fabrication of FinF...

Fabrication of replacement metal gate devices

Shallow trench isolation chemical mechanical planarization

Method for forming a self-aligned bit line for PCRAM and self-align...

Method for forming a self-aligned bit line for PCRAM and self-align...

High-yield method of exposing and contacting through-silicon vias

Glass mold polishing method and structure

Structure and method for formation of cladded interconnects for MRAMs

Bilayer cap structure including HDP/bHDP films for conductive metal...

Copper recess process with application to selective capping and ele...

Method of fabrication of MIMCAP and resistor at same level

Copper recess process with application to selective capping and ele...

Slurry for mechanical polishing (CMP) of metals and use thereof

Apparatus and method for wafer cleaning

Multi-wafer polishing tool

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL PLANARIZATION SLURRIES AND PROCESSES FOR PLATIN...

MRAM STRUCTURE WITH T-SHAPED BOTTOM ELECTRODE TO OVERCOME GALVANIC...

COMBINED CMP AND RIE CONTACT SCHEME FOR MRAM APPLICATIONS

COMBINED CMP AND RIE CONTACT SCHEME FOR MRAM APPLICATIONS

EMBEDDED NOBLE METAL ELECTRODES IN MICROFLUIDICS

EMBEDDED NOBLE METAL ELECTRODES IN MICROFLUIDICS

NANOGAP STRUCTURE FOR MICRO/NANOFLUIDIC SYSTEMS FORMED BY SACRIFICI...

NANOGAP STRUCTURE FOR MICRO/NANOFLUIDIC SYSTEMS FORMED BY SACRIFICI...

THIN FILM INTERCONNECTS WITH LARGE GRAINS

Nanogap in-between noble metals

MULTI-SPINDLE CHEMICAL MECHANICAL PLANARIZATION TOOL

MULTI-SPINDLE CHEMICAL MECHANICAL PLANARIZATION TOOL

MULTI-SPINDLE CHEMICAL MECHANICAL PLANARIZATION TOOL

MULTI-GENERATIONAL CARRIER PLATFORM

MULTI-GENERATIONAL CARRIER PLATFORM

METHOD FOR FORMING A SELF-ALIGNED BIT LINE FOR PCRAM AND SELF-ALIGN...

METHOD FOR FORMING A SELF-ALIGNED BIT LINE FOR PCRAM AND SELF-ALIGN...

Chemical Mechanical Planarization Processes For Fabrication of FINF...

Shallow Trench Isolation Chemical Mechanical Planarization

Fabrication of Replacement Metal Gate Devices

HIGH-YIELD METHOD OF EXPOSING AND CONTACTING THROUGH-SILICON VIAS

GLASS MOLD POLISHING METHOD AND STRUCTURE

Homogeneous Copper Interconnects for BEOL

BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METAL...

Homogeneous Copper Interconnects for BEOL

Copper recess process with application to selective capping and ele...

Method of fabrication of MIMCAP and resistor at same level

Copper recess process with application to selective capping and ele...

Slurry for mechanical polishing (CMP) of metals and use thereof

Apparatus and method for wafer cleaning