Michael G. Shlepr

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Palm Bay, FL, US

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Patents Grantslast 30 patents

Information Patent Grant
Bonded substrate for an integrated circuit containing a planar intr...
- Patent number 7,052,973
- Issue date May 30, 2006
- Intersil Americas Inc.
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded substrate for an integrated circuit containing a planar intr...
- Patent number 6,825,532
- Issue date Nov 30, 2004
- Intersil Americas Inc.
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a bonded substrate containing a planar intrinsic...
- Patent number 6,255,195
- Issue date Jul 3, 2001
- Intersil Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device containing sample preparation sites for transmission electro...
- Patent number 6,140,652
- Issue date Oct 31, 2000
- Intersil Corporation
- Mike G. Shlepr
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Bonded substrate for an integrated circuit containing a planar intr...
- Publication number 20040180512
- Publication date Sep 16, 2004
- INTERSIL AMERICAS INC.
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a bonded substrate containing a planar intrinsic...
- Publication number 20010016399
- Publication date Aug 23, 2001
- HARRIS CORPORATION
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS