Michael Gaynes

Person

Armonk, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit card attachment for enhanced robustness of thermal performance
- Patent number 11,224,927
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Michael Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using in situ capacitance measurements to monitor the stability of...
- Patent number 10,908,110
- Issue date Feb 2, 2021
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,750,615
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package for two-phase cooling and assembly process thereof
- Patent number 10,607,963
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface adhesion for transfer molded electronic components
- Patent number 10,548,228
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Timothy J. Chainer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 10,535,618
- Issue date Jan 14, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 10,535,619
- Issue date Jan 14, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,368,441
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using in situ capacitance measurements to monitor the stability of...
- Patent number 10,338,024
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Timothy J. Chainer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Tamper-proof electronic packages formed with stressed glass
- Patent number 10,257,924
- Issue date Apr 9, 2019
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Underfill dispensing using funnels
- Patent number 10,249,516
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface solution with reduced adhesion force
- Patent number 10,194,522
- Issue date Jan 29, 2019
- International Business Machines Corporation
- Timothy J. Chainer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 10,177,102
- Issue date Jan 8, 2019
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Water soluble low alpha particle emission electrically-conductive c...
- Patent number 10,168,436
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Direct injection molded solder process for forming solder bumps on...
- Patent number 10,147,694
- Issue date Dec 4, 2018
- GLOBALFOUNDRIES Inc.
- Bing Dang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tamper-respondent assemblies with trace regions of increased suscep...
- Patent number 9,999,124
- Issue date Jun 12, 2018
- International Business Machines Corporation
- James A. Busby
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,974,179
- Issue date May 15, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper-proof electronic packages formed with stressed glass
- Patent number 9,913,370
- Issue date Mar 6, 2018
- International Business Machines Corporation
- James A. Busby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-proof electronic packages with stressed glass component subs...
- Patent number 9,881,880
- Issue date Jan 30, 2018
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Underfill dispensing using funnels
- Patent number 9,852,960
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using in situ capacitance measurements to monitor the stability of...
- Patent number 9,714,911
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface solution with reduced adhesion force
- Patent number 9,686,853
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Timothy J. Chainer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,627,784
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Volumetric integrated circuit and volumetric integrated circuit man...
- Patent number 9,583,410
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin, flexible microsystem with integrated energy source
- Patent number 9,472,789
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Paul S. Andry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Thermal receiver for high power solar concentrators and method of a...
- Patent number 9,412,891
- Issue date Aug 9, 2016
- International Business Machines Corporation
- Michael A. Gaynes
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
No flow underfill or wafer level underfill and solder columns
- Patent number 9,343,423
- Issue date May 17, 2016
- International Business Machines Corporation
- Claudius Ferger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of die stacking using pre-applied underfill
- Patent number 9,330,946
- Issue date May 3, 2016
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal receiver for high power solar concentrators and method of a...
- Patent number 9,324,896
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Michael A. Gaynes
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Injection of a filler material with homogeneous distribution of ani...
- Patent number 9,321,245
- Issue date Apr 26, 2016
- GLOBALFOUNDRIES Inc.
- Michael A. Gaynes
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
USING IN SITU CAPACITANCE MEASUREMENTS TO MONITOR THE STABILITY OF...
- Publication number 20190323983
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...
- Publication number 20180358311
- Publication date Dec 13, 2018
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...
- Publication number 20180350757
- Publication date Dec 6, 2018
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20180213645
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH TRACE REGIONS OF INCREASED SUSCEP...
- Publication number 20180124915
- Publication date May 3, 2018
- International Business Machines Corporation
- James A. BUSBY
- G01 - MEASURING TESTING
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...
- Publication number 20180102329
- Publication date Apr 12, 2018
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES FORMED WITH STRESSED GLASS
- Publication number 20180098424
- Publication date Apr 5, 2018
- International Business Machines Corporation
- James A. BUSBY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF
- Publication number 20180076113
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...
- Publication number 20170330844
- Publication date Nov 16, 2017
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Water Soluble Low Alpha Particle Emission Electrically-Conductive C...
- Publication number 20170329020
- Publication date Nov 16, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES FORMED WITH STRESSED GLASS
- Publication number 20170332485
- Publication date Nov 16, 2017
- International Business Machines Corporation
- James A. BUSBY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDERFILL DISPENSING USING FUNNELS
- Publication number 20170309538
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING IN SITU CAPACITANCE MEASUREMENTS TO MONITOR THE STABILITY OF...
- Publication number 20170307558
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Timothy J. Chainer
- G01 - MEASURING TESTING
Information Patent Application
UNDERFILL DISPENSING USING FUNNELS
- Publication number 20170271232
- Publication date Sep 21, 2017
- International Business Machines Corporation
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE ADHESION FOR TRANSFER MOLDED ELECTRONIC COMPONENTS
- Publication number 20170257977
- Publication date Sep 7, 2017
- International Business Machines Corporation
- Timothy J. Chainer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POROUS UNDERFILL ENABLING REWORK
- Publication number 20170200659
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Michael Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20170196089
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Solution with Reduced Adhesion Force
- Publication number 20170181267
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Timothy J. Chainer
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit Card Attachment for Enhanced Robustness of Thermal Performance
- Publication number 20170148758
- Publication date May 25, 2017
- International Business Machines Corporation
- Michael Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON...
- Publication number 20160118358
- Publication date Apr 28, 2016
- GLOBALFOUNDRIES INC.
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH REWORK CAPABILITY
- Publication number 20160042979
- Publication date Feb 11, 2016
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Solution with Reduced Adhesion Force
- Publication number 20150359108
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Timothy J. Chainer
- B32 - LAYERED PRODUCTS
Information Patent Application
THIN, FLEXIBLE MICROSYSTEM WITH INTEGRATED ENERGY SOURCE
- Publication number 20150287960
- Publication date Oct 8, 2015
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
VOLUMETRIC INTEGRATED CIRCUIT AND VOLUMETRIC INTEGRATED CIRCUIT MAN...
- Publication number 20150270246
- Publication date Sep 24, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS
- Publication number 20150147851
- Publication date May 28, 2015
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS
- Publication number 20150147846
- Publication date May 28, 2015
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Solution With Reduced Adhesion Force
- Publication number 20150092352
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION OF A FILLER MATERIAL WITH HOMOGENEOUS DISTRIBUTION OF ANI...
- Publication number 20140377572
- Publication date Dec 25, 2014
- International Business Machines Corporation
- Michael A. Gaynes
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
INJECTION OF A FILLER MATERIAL WITH HOMOGENEOUS DISTRIBUTION OF ANI...
- Publication number 20140377571
- Publication date Dec 25, 2014
- Michael A. Gaynes
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Michael Gaynes

Person

Patents Grantslast 30 patents

Circuit card attachment for enhanced robustness of thermal performance

Using in situ capacitance measurements to monitor the stability of...

Method and apparatus for strain relieving surface mount attached co...

Chip package for two-phase cooling and assembly process thereof

Thermal interface adhesion for transfer molded electronic components

Tamper-proof electronic packages with stressed glass component subs...

Tamper-proof electronic packages with stressed glass component subs...

Method and apparatus for strain relieving surface mount attached co...

Using in situ capacitance measurements to monitor the stability of...

Tamper-proof electronic packages formed with stressed glass

Underfill dispensing using funnels

Thermal interface solution with reduced adhesion force

Tamper-proof electronic packages with stressed glass component subs...

Water soluble low alpha particle emission electrically-conductive c...

Direct injection molded solder process for forming solder bumps on...

Tamper-respondent assemblies with trace regions of increased suscep...

Method and apparatus for strain relieving surface mount attached co...

Tamper-proof electronic packages formed with stressed glass

Tamper-proof electronic packages with stressed glass component subs...

Underfill dispensing using funnels

Using in situ capacitance measurements to monitor the stability of...

Thermal interface solution with reduced adhesion force

Method and apparatus for strain relieving surface mount attached co...

Volumetric integrated circuit and volumetric integrated circuit man...

Thin, flexible microsystem with integrated energy source

Thermal receiver for high power solar concentrators and method of a...

No flow underfill or wafer level underfill and solder columns

Method and structure of die stacking using pre-applied underfill

Thermal receiver for high power solar concentrators and method of a...

Injection of a filler material with homogeneous distribution of ani...

Patents Applicationslast 30 patents

USING IN SITU CAPACITANCE MEASUREMENTS TO MONITOR THE STABILITY OF...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...

TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

TAMPER-RESPONDENT ASSEMBLIES WITH TRACE REGIONS OF INCREASED SUSCEP...

TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...

TAMPER-PROOF ELECTRONIC PACKAGES FORMED WITH STRESSED GLASS

CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF

TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBS...

Water Soluble Low Alpha Particle Emission Electrically-Conductive C...

TAMPER-PROOF ELECTRONIC PACKAGES FORMED WITH STRESSED GLASS

UNDERFILL DISPENSING USING FUNNELS

USING IN SITU CAPACITANCE MEASUREMENTS TO MONITOR THE STABILITY OF...

UNDERFILL DISPENSING USING FUNNELS

THERMAL INTERFACE ADHESION FOR TRANSFER MOLDED ELECTRONIC COMPONENTS

POROUS UNDERFILL ENABLING REWORK

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

Thermal Interface Solution with Reduced Adhesion Force

Circuit Card Attachment for Enhanced Robustness of Thermal Performance

DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON...

MULTI-CHIP MODULE WITH REWORK CAPABILITY

Thermal Interface Solution with Reduced Adhesion Force

THIN, FLEXIBLE MICROSYSTEM WITH INTEGRATED ENERGY SOURCE

VOLUMETRIC INTEGRATED CIRCUIT AND VOLUMETRIC INTEGRATED CIRCUIT MAN...

NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS

NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS

Thermal Interface Solution With Reduced Adhesion Force

INJECTION OF A FILLER MATERIAL WITH HOMOGENEOUS DISTRIBUTION OF ANI...

INJECTION OF A FILLER MATERIAL WITH HOMOGENEOUS DISTRIBUTION OF ANI...