Michael John Spaulding

Person

Essexvill, MI, US

People

Patents Grantslast 30 patents

Information Patent Grant
High modulus, low dielectric constant coatings
- Patent number 6,759,133
- Issue date Jul 6, 2004
- Dow Corning Corporation
- Ivan Louis Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High modulus, low dielectric constant coatings
- Patent number 6,576,300
- Issue date Jun 10, 2003
- Dow Corning Corporation
- Ivan Louis Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma curing process for porous silica thin film
- Patent number 6,558,755
- Issue date May 6, 2003
- Dow Corning Corporation
- Ivan L. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming coatings
- Patent number 6,231,989
- Issue date May 15, 2001
- Dow Corning Corporation
- Kyuha Chung
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Thermally stable dielectric coatings
- Patent number 6,210,749
- Issue date Apr 3, 2001
- Dow Corning, Corporation
- Jeffrey Nicholas Bremmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing thick crack-free coatings from hydrogen silses...
- Patent number 6,022,625
- Issue date Feb 8, 2000
- Dow Corning Corporation
- Jeffrey Nicholas Bremmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing thick crack-free coating from hydrogen silsequ...
- Patent number 5,866,197
- Issue date Feb 2, 1999
- Dow Corning Corporation
- Jeffrey Nicholas Bremmer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of curing hydrogen silsesquioxane and densification in nano-...
- Publication number 20090032901
- Publication date Feb 5, 2009
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High modulus, low dielectric constant coatings
- Publication number 20030203217
- Publication date Oct 30, 2003
- Ivan Louis Berry
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Plasma curing process for porous silica thin film
- Publication number 20030175535
- Publication date Sep 18, 2003
- Ivan L. Berry
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Plasma curing process for porous silica thin film
- Publication number 20010038919
- Publication date Nov 8, 2001
- Ivan L. Berry
- C01 - INORGANIC CHEMISTRY

Michael John Spaulding

Person

Patents Grantslast 30 patents

High modulus, low dielectric constant coatings

High modulus, low dielectric constant coatings

Plasma curing process for porous silica thin film

Method of forming coatings

Thermally stable dielectric coatings

Method for producing thick crack-free coatings from hydrogen silses...

Method for producing thick crack-free coating from hydrogen silsequ...

Patents Applicationslast 30 patents

Method of curing hydrogen silsesquioxane and densification in nano-...

High modulus, low dielectric constant coatings

Plasma curing process for porous silica thin film

Plasma curing process for porous silica thin film