Michael P. Brownell

Person

Los Gatos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of assembling a multi-chip device
- Patent number 6,782,611
- Issue date Aug 31, 2004
- Intel Corporation
- William A. Samaras
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting bracket for integrated circuit device
- Patent number 6,506,073
- Issue date Jan 14, 2003
- Intel Corporation
- Dan R. McCutchan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package ejector
- Patent number 6,490,167
- Issue date Dec 3, 2002
- Intel Corporation
- Michael Philip Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixed position ZIF (zero insertion force) socket system
- Patent number 6,443,749
- Issue date Sep 3, 2002
- Intel Corporation
- Michael P. Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatpipesink having integrated heat pipe and heat sink
- Patent number 6,410,982
- Issue date Jun 25, 2002
- Intel Corporation
- Michael Philip Brownell
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Controlled bondline thickness attachment mechanism
- Patent number 6,349,465
- Issue date Feb 26, 2002
- Intel Corporation
- Michael Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero insertion force socket and method for employing same to mount...
- Patent number 6,164,999
- Issue date Dec 26, 2000
- Intel Corporation
- Dan R. McCutchan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit cartridge
- Patent number 6,166,908
- Issue date Dec 26, 2000
- Intel Corporation
- Bill Samaras
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip land grid array carrier
- Patent number 6,097,611
- Issue date Aug 1, 2000
- Intel Corporation
- William A. Samaras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal grease insertion and retention
- Patent number 6,016,006
- Issue date Jan 18, 2000
- Intel Corporation
- Frank Kolman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board mounting assembly and a method for mounting a...
- Patent number 6,002,591
- Issue date Dec 14, 1999
- Intel Corporation
- Dan R. McCutchan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip land grid array carrier
- Patent number 5,991,161
- Issue date Nov 23, 1999
- Intel Corporation
- William A. Samaras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for attaching a heat sink to the back side of a flip chip...
- Patent number 5,990,552
- Issue date Nov 23, 1999
- Intel Corporation
- Hong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded thermal interface system
- Patent number 5,956,229
- Issue date Sep 21, 1999
- Intel Corporation
- Michael Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe to baseplate attachment method
- Patent number 5,949,647
- Issue date Sep 7, 1999
- Intel Corporation
- Frank Kolman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emulative lid/heatspreader for processor die attached to an organic...
- Patent number 5,903,436
- Issue date May 11, 1999
- Intel Corporation
- Michael P. Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled bondline thickness attachment mechanism
- Patent number 5,802,707
- Issue date Sep 8, 1998
- Intel Corporation
- Michael Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe to baseplate attachment method
- Patent number 5,699,227
- Issue date Dec 16, 1997
- Intel Corporation
- Frank Kolman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant hinge clip attachment
- Patent number 5,699,229
- Issue date Dec 16, 1997
- Intel Corporation
- Michael P. Brownell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEATPIPESINK HAVING INTEGRATED HEAT PIPE AND HEAT SINK
- Publication number 20020056908
- Publication date May 16, 2002
- MICHAEL PHILIP BROWNELL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Fixed position ZIF (zero insertion force) socket system
- Publication number 20020013100
- Publication date Jan 31, 2002
- Michael P. Brownell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP LAND GRID ARRAY CARRIER
- Publication number 20010047882
- Publication date Dec 6, 2001
- WILLIAM A. SAMARAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING BRACKET FOR INTEGRATED CIRCUIT DEVICE
- Publication number 20010040795
- Publication date Nov 15, 2001
- DAN R. MCCUTCHAN
- H01 - BASIC ELECTRIC ELEMENTS

Michael P. Brownell

Person

Patents Grantslast 30 patents

Method of assembling a multi-chip device

Mounting bracket for integrated circuit device

Semiconductor package ejector

Fixed position ZIF (zero insertion force) socket system

Heatpipesink having integrated heat pipe and heat sink

Controlled bondline thickness attachment mechanism

Zero insertion force socket and method for employing same to mount...

Integrated circuit cartridge

Multi-chip land grid array carrier

Thermal grease insertion and retention

Printed circuit board mounting assembly and a method for mounting a...

Multi-chip land grid array carrier

Apparatus for attaching a heat sink to the back side of a flip chip...

Injection molded thermal interface system

Heat pipe to baseplate attachment method

Emulative lid/heatspreader for processor die attached to an organic...

Controlled bondline thickness attachment mechanism

Heat pipe to baseplate attachment method

Compliant hinge clip attachment

Patents Applicationslast 30 patents

HEATPIPESINK HAVING INTEGRATED HEAT PIPE AND HEAT SINK

Fixed position ZIF (zero insertion force) socket system

MULTI-CHIP LAND GRID ARRAY CARRIER

MOUNTING BRACKET FOR INTEGRATED CIRCUIT DEVICE