Michael R. Vogtmann

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods of processing substrates
- Patent number 9,393,669
- Issue date Jul 19, 2016
- Strasbaugh
- William J. Kalenian
- B24 - GRINDING POLISHING
Information Patent Grant
Systems and methods of wafer grinding
- Patent number 8,968,052
- Issue date Mar 3, 2015
- Strasbaugh
- Thomas A. Walsh
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for cleaning grinding work chuck using a vacuum
- Patent number 8,915,771
- Issue date Dec 23, 2014
- Strasbaugh, Inc.
- Michael Vogtmann
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for in situ monitoring of top wafer thickness in...
- Patent number 8,520,222
- Issue date Aug 27, 2013
- Strasbaugh
- Frederic Anthony Schraub
- G01 - MEASURING TESTING
Information Patent Grant
Grinding apparatus having an extendable wheel mount
- Patent number 8,133,093
- Issue date Mar 13, 2012
- Strasbaugh, Inc.
- Michael Vogtmann
- B24 - GRINDING POLISHING
Information Patent Grant
Sensing the presence of a wafer
- Patent number 6,796,881
- Issue date Sep 28, 2004
- Lam Research Corporation
- Michael R. Vogtmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Eccentric abrasive wheel for wafer processing
- Patent number 6,672,943
- Issue date Jan 6, 2004
- Wafer Solutions, Inc.
- Michael Vogtmann
- B24 - GRINDING POLISHING
Information Patent Grant
Conditioning mechanism in a chemical mechanical polishing apparatus...
- Patent number 6,645,046
- Issue date Nov 11, 2003
- Lam Research Corporation
- Michael Vogtmann
- B24 - GRINDING POLISHING
Information Patent Grant
Mixing manifold for multiple inlet chemistry fluids
- Patent number 6,632,012
- Issue date Oct 14, 2003
- Wafer Solutions, Inc.
- Michael R. Vogtmann
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Lifting and rinsing a wafer
- Patent number 6,505,635
- Issue date Jan 14, 2003
- Lam Research Corporation
- Michael R. Vogtmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accurate positioning of a wafer
- Patent number 6,405,740
- Issue date Jun 18, 2002
- Lam Research Corporation
- Michael R. Vogtmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-contacting support for a wafer
- Patent number 6,283,827
- Issue date Sep 4, 2001
- Lam Research Corporation
- Michael R. Vogtmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensing the presence of a wafer
- Patent number 6,267,642
- Issue date Jul 31, 2001
- Lam Research Corporation
- Michael R. Vogtmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accurate positioning of a wafer
- Patent number 6,131,589
- Issue date Oct 17, 2000
- Strasbaugh, Inc.
- Michael R. Vogtmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lifting and rinsing a wafer
- Patent number 6,102,057
- Issue date Aug 15, 2000
- Strasbaugh
- Michael R. Vogtmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for cleaning grinding work chuck using a scraper
- Publication number 20140202491
- Publication date Jul 24, 2014
- Michael Vogtmann
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for cleaning grinding work chuck using a vacuum
- Publication number 20140187128
- Publication date Jul 3, 2014
- Michael Vogtmann
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEMS AND METHODS OF PROCESSING SUBSTRATES
- Publication number 20130130593
- Publication date May 23, 2013
- Strasbaugh
- William J. Kalenian
- B24 - GRINDING POLISHING
Information Patent Application
System and Method for In Situ Monitoring of Top Wafer Thickness in...
- Publication number 20130114090
- Publication date May 9, 2013
- Strasbaugh
- Frederic Anthony Schraub
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS OF WAFER GRINDING
- Publication number 20130102227
- Publication date Apr 25, 2013
- Strasbaugh
- Thomas A. Walsh
- B24 - GRINDING POLISHING
Information Patent Application
Grinding apparatus having an extendable wheel mount
- Publication number 20100093264
- Publication date Apr 15, 2010
- Strasbaugh, Inc.
- Michael Vogtmann
- B24 - GRINDING POLISHING
Information Patent Application
Mixing manifold for multiple inlet chemistry fluids
- Publication number 20020141284
- Publication date Oct 3, 2002
- Michael R. Vogtmann
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Eccentric abrasive wheel for wafer processing
- Publication number 20020102920
- Publication date Aug 1, 2002
- Wafer Solutions, Inc.
- Michael Vogtmann
- B24 - GRINDING POLISHING

Michael R. Vogtmann

Person

Patents Grantslast 30 patents

Systems and methods of processing substrates

Systems and methods of wafer grinding

Method and apparatus for cleaning grinding work chuck using a vacuum

System and method for in situ monitoring of top wafer thickness in...

Grinding apparatus having an extendable wheel mount

Sensing the presence of a wafer

Eccentric abrasive wheel for wafer processing

Conditioning mechanism in a chemical mechanical polishing apparatus...

Mixing manifold for multiple inlet chemistry fluids

Lifting and rinsing a wafer

Accurate positioning of a wafer

Non-contacting support for a wafer

Sensing the presence of a wafer

Accurate positioning of a wafer

Lifting and rinsing a wafer

Patents Applicationslast 30 patents

Method and apparatus for cleaning grinding work chuck using a scraper

Method and apparatus for cleaning grinding work chuck using a vacuum

SYSTEMS AND METHODS OF PROCESSING SUBSTRATES

System and Method for In Situ Monitoring of Top Wafer Thickness in...

SYSTEMS AND METHODS OF WAFER GRINDING

Grinding apparatus having an extendable wheel mount

Mixing manifold for multiple inlet chemistry fluids

Eccentric abrasive wheel for wafer processing