Michael Roesner

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Component and method of manufacturing a component using an ultrathi...
- Patent number 11,367,654
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide devices and methods for manufacturing the same
- Patent number 11,282,805
- Issue date Mar 22, 2022
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a silicon-insulator layer and semiconductor devi...
- Patent number 11,195,713
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a silicon carbide containing crystalline subst...
- Patent number 11,077,525
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Michael Roesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices including a metal silicide layer and methods...
- Patent number 11,063,014
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 10,672,716
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic phase change material for heat dissipation
- Patent number 10,643,917
- Issue date May 5, 2020
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented edge protection shield
- Patent number 10,622,218
- Issue date Apr 14, 2020
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a porous conductive structure in connection to...
- Patent number 10,373,868
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method of manufacturing a component using an ultrathi...
- Patent number 10,186,458
- Issue date Jan 22, 2019
- Infineon Technologies AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor workpiece
- Patent number 10,157,765
- Issue date Dec 18, 2018
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma dicing of silicon carbide
- Patent number 10,032,670
- Issue date Jul 24, 2018
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 10,020,264
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneous structuring and chip singulation
- Patent number 10,005,659
- Issue date Jun 26, 2018
- Infineon Technologies AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,911,686
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented edge protection shield
- Patent number 9,793,129
- Issue date Oct 17, 2017
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a wafer
- Patent number 9,704,748
- Issue date Jul 11, 2017
- Infineon Technologies AG
- Joerg Ortner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for processing a semiconductor substrate and a method for pr...
- Patent number 9,673,096
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier system for processing semiconductor substrates, and methods...
- Patent number 9,640,419
- Issue date May 2, 2017
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneous structuring and chip singulation
- Patent number 9,610,543
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip with structured sidewalls
- Patent number 9,496,193
- Issue date Nov 15, 2016
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Kerf preparation for backside metallization
- Patent number 9,455,192
- Issue date Sep 27, 2016
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation of semiconductor dies with contact metallization by ele...
- Patent number 9,449,876
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Michael Roesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Source down semiconductor devices and methods of formation thereof
- Patent number 9,368,436
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor wafer
- Patent number 9,059,273
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Petra Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 8,815,706
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER
- Publication number 20230317666
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Gregor Langer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20220246475
- Publication date Aug 4, 2022
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming a Silicon-Insulator Layer and Semiconductor Devi...
- Publication number 20190385842
- Publication date Dec 19, 2019
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including a Metal Silicide Layer and Methods...
- Publication number 20190355691
- Publication date Nov 21, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Processing a Silicon Carbide Containing Crystalline Subst...
- Publication number 20190308274
- Publication date Oct 10, 2019
- Michael Roesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Carbide Devices and Methods for Manufacturing the Same
- Publication number 20190295981
- Publication date Sep 26, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20190148233
- Publication date May 16, 2019
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Phase Change Material for Heat Dissipation
- Publication number 20190096780
- Publication date Mar 28, 2019
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Substrate and Method for Manufacturing the Same
- Publication number 20180315713
- Publication date Nov 1, 2018
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTED EDGE PROTECTION SHIELD
- Publication number 20180005838
- Publication date Jan 4, 2018
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICING OF SILICON CARBIDE
- Publication number 20170358494
- Publication date Dec 14, 2017
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE
- Publication number 20170207123
- Publication date Jul 20, 2017
- Infineon Technologies Austria AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Simultaneous Structuring and Chip Singulation
- Publication number 20170158493
- Publication date Jun 8, 2017
- INFINEON TECHNOLOGIES AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20170076970
- Publication date Mar 16, 2017
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Dicing a Wafer
- Publication number 20160379884
- Publication date Dec 29, 2016
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Segmented Edge Protection Shield
- Publication number 20160343574
- Publication date Nov 24, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Substrate and Method for Manufacturing the Same
- Publication number 20160322306
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Source Down Semiconductor Devices and Methods of Formation Thereof
- Publication number 20160260658
- Publication date Sep 8, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embrittlement device, pick-up system and method of picking up chips
- Publication number 20160204017
- Publication date Jul 14, 2016
- Infineon Technologies Austria AG
- Michael Roesner
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...
- Publication number 20160141208
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Hirschler Joachim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier System For Processing Semiconductor Substrates, and Methods...
- Publication number 20160035560
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Kerf Preparation for Backside Metallization
- Publication number 20150279740
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Simultaneous Structuring and Chip Singulation
- Publication number 20150217997
- Publication date Aug 6, 2015
- INFINEON TECHNOLOGIES AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Singulation of Semiconductor Dies with Contact Metallization by Ele...
- Publication number 20150206802
- Publication date Jul 23, 2015
- INFINEON TECHNOLOGIES AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20150147850
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20150064877
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Petra Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20140008805
- Publication date Jan 9, 2014
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Devices
- Publication number 20130189830
- Publication date Jul 25, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS

Michael Roesner

Person

Patents Grantslast 30 patents

Component and method of manufacturing a component using an ultrathi...

Silicon carbide devices and methods for manufacturing the same

Methods of forming a silicon-insulator layer and semiconductor devi...

Method of processing a silicon carbide containing crystalline subst...

Semiconductor devices including a metal silicide layer and methods...

Integrated circuit substrate and method for manufacturing the same

Magnetic phase change material for heat dissipation

Segmented edge protection shield

Method of processing a porous conductive structure in connection to...

Component and method of manufacturing a component using an ultrathi...

Methods for processing a semiconductor workpiece

Plasma dicing of silicon carbide

Integrated circuit substrate and method for manufacturing the same

Method for simultaneous structuring and chip singulation

Source down semiconductor devices and methods of formation thereof

Segmented edge protection shield

Method of dicing a wafer

Method for processing a semiconductor substrate and a method for pr...

Carrier system for processing semiconductor substrates, and methods...

Method for simultaneous structuring and chip singulation

Semiconductor chip with structured sidewalls

Kerf preparation for backside metallization

Singulation of semiconductor dies with contact metallization by ele...

Source down semiconductor devices and methods of formation thereof

Methods for processing a semiconductor wafer

Methods of forming semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER

Component and Method of Manufacturing a Component Using an Ultrathi...

Methods of Forming a Silicon-Insulator Layer and Semiconductor Devi...

Semiconductor Devices Including a Metal Silicide Layer and Methods...

Method of Processing a Silicon Carbide Containing Crystalline Subst...

Silicon Carbide Devices and Methods for Manufacturing the Same

Component and Method of Manufacturing a Component Using an Ultrathi...

Magnetic Phase Change Material for Heat Dissipation

Integrated Circuit Substrate and Method for Manufacturing the Same

SEGMENTED EDGE PROTECTION SHIELD

PLASMA DICING OF SILICON CARBIDE

METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE

Method for Simultaneous Structuring and Chip Singulation

METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE

Method of Dicing a Wafer

Segmented Edge Protection Shield

Integrated Circuit Substrate and Method for Manufacturing the Same

Source Down Semiconductor Devices and Methods of Formation Thereof

Embrittlement device, pick-up system and method of picking up chips

METHOD FOR PROCESSING A SEMICONDUCTOR SUBSTRATE AND A METHOD FOR PR...

Carrier System For Processing Semiconductor Substrates, and Methods...

Kerf Preparation for Backside Metallization

Method for Simultaneous Structuring and Chip Singulation

Singulation of Semiconductor Dies with Contact Metallization by Ele...

METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE

METHODS FOR PROCESSING A SEMICONDUCTOR WAFER

Component and Method of Manufacturing a Component Using an Ultrathi...

Methods of Forming Semiconductor Devices