Michael Ryan Ng

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Burlingame, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of reducing solder wicking on a substrate
- Patent number 9,089,063
- Issue date Jul 21, 2015
- Flextronics AP, LLC
- Glen C. Shepherd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of reducing solder wicking on a substrate
- Patent number 8,378,222
- Issue date Feb 19, 2013
- Flextronics AP, LLC
- Glen C. Shepherd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with via and pad structures
- Patent number 7,645,940
- Issue date Jan 12, 2010
- Solectron Corporation
- Glen C. Shepherd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of Reducing Solder Wicking on a Substrate
- Publication number 20130221075
- Publication date Aug 29, 2013
- Flextronics AP, LLC
- Glen C. Shepherd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of reducing solder wicking on a substrate
- Publication number 20100094607
- Publication date Apr 15, 2010
- Glen C. Shepherd
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Substrate with via and pad structures
- Publication number 20050173151
- Publication date Aug 11, 2005
- Glen C. Shepherd
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...