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Michael Ryan Ng
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Burlingame, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of reducing solder wicking on a substrate
Patent number
9,089,063
Issue date
Jul 21, 2015
Flextronics AP, LLC
Glen C. Shepherd
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of reducing solder wicking on a substrate
Patent number
8,378,222
Issue date
Feb 19, 2013
Flextronics AP, LLC
Glen C. Shepherd
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate with via and pad structures
Patent number
7,645,940
Issue date
Jan 12, 2010
Solectron Corporation
Glen C. Shepherd
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Method of Reducing Solder Wicking on a Substrate
Publication number
20130221075
Publication date
Aug 29, 2013
Flextronics AP, LLC
Glen C. Shepherd
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of reducing solder wicking on a substrate
Publication number
20100094607
Publication date
Apr 15, 2010
Glen C. Shepherd
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Substrate with via and pad structures
Publication number
20050173151
Publication date
Aug 11, 2005
Glen C. Shepherd
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...