Michael W. Lane

Person

Glade Spring, VA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chips including passivation layer trench structure
- Patent number 8,803,318
- Issue date Aug 12, 2014
- International Business Machines Corporation
- Deepak Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips including passivation layer trench structure
- Patent number 8,440,505
- Issue date May 14, 2013
- International Business Machines Corporation
- Deepak Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 8,343,868
- Issue date Jan 1, 2013
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Reducing effective dielectric constant in semiconductor devices
- Patent number 8,129,286
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of fabricating a SiCOH dielectric material with improved tou...
- Patent number 8,101,236
- Issue date Jan 24, 2012
- International Business Machines Corporation
- Daniel C. Edelstein
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure for inhibiting back end of line damage from dicing and ch...
- Patent number 8,076,756
- Issue date Dec 13, 2011
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using crack arrestor for inhibiting damage from dicing and chip pac...
- Patent number 7,955,955
- Issue date Jun 7, 2011
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiCOH dielectric material with improved toughness and improved Si-C...
- Patent number 7,892,648
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 7,892,940
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Grant
BEOL interconnect structures with improved resistance to stress
- Patent number 7,847,402
- Issue date Dec 7, 2010
- International Business Machines Corporation
- Darryl D. Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of aligned capped metal lines and interconnections in mul...
- Patent number 7,825,516
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to improve adhesion between top CVD low-K dielectric and...
- Patent number 7,820,559
- Issue date Oct 26, 2010
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene interconnect structures having different materials f...
- Patent number 7,704,876
- Issue date Apr 27, 2010
- International Business Machines Corporation
- Jeffrey Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strengthening of a structure by infiltration
- Patent number 7,678,673
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Elbert Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 7,592,685
- Issue date Sep 22, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack trapping and arrest in thin film structures
- Patent number 7,573,130
- Issue date Aug 11, 2009
- Internatonal Business Machines Corporation
- Thomas M Shaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to enhance temperature/humidity/bias performan...
- Patent number 7,517,790
- Issue date Apr 14, 2009
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capped copper interconnect
- Patent number 7,495,338
- Issue date Feb 24, 2009
- International Business Machines Corporation
- Michael Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming crack trapping and arrest in thin film structures
- Patent number 7,491,578
- Issue date Feb 17, 2009
- International Business Machines Corporation
- Thomas M Shaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardmask for improved reliability of silicon based dielectrics
- Patent number 7,485,582
- Issue date Feb 3, 2009
- International Business Machines Corporation
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiCOH dielectric material with improved toughness and improved Si-C...
- Patent number 7,479,306
- Issue date Jan 20, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 7,405,147
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to improve adhesion between top CVD low-k dielectric and...
- Patent number 7,402,532
- Issue date Jul 22, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultralow dielectric constant layer with controlled biaxial stress
- Patent number 7,357,977
- Issue date Apr 15, 2008
- International Business Machines Corporation
- Christos Dimitrios Dimitrakopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hardmask for reliability of silicon based dielectrics
- Patent number 7,335,980
- Issue date Feb 26, 2008
- International Business Machines Corporation
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene interconnect structures having different materials f...
- Patent number 7,300,867
- Issue date Nov 27, 2007
- International Business Machines Corporation
- Jeffrey Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon chip carrier with conductive through-vias and method for fa...
- Patent number 7,276,787
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlevel dielectric layer and metal layer sealing
- Patent number 7,214,608
- Issue date May 8, 2007
- International Business Machines Corporation
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper conductor
- Patent number 7,119,018
- Issue date Oct 10, 2006
- International Buisness Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crackstop with release layer for crack control in semiconductors
- Patent number 7,109,093
- Issue date Sep 19, 2006
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIPS INCLUDING PASSIVATION LAYER TRENCH STRUCTURE
- Publication number 20130207263
- Publication date Aug 15, 2013
- International Business Machines Corporation
- Deepak Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR INHIBITING BACK END OF LINE DAMAGE FROM DICING AND CH...
- Publication number 20110140245
- Publication date Jun 16, 2011
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20110111590
- Publication date May 12, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Application
SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C...
- Publication number 20110101489
- Publication date May 5, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS INCLUDING PASSIVATION LAYER TRENCH STRUCTURE
- Publication number 20100187689
- Publication date Jul 29, 2010
- International Business Machines Corporation
- Deepak Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRALOW DIELECTRIC CONSTANT LAYER WITH CONTROLLED BIAXIAL STRESS
- Publication number 20090304951
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Christos Dimitrios Dimitrakopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C...
- Publication number 20090181178
- Publication date Jul 16, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRENGTHENING OF A STRUCTURE BY INFILTRATION
- Publication number 20090035480
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Elbert Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRALOW DIELECTRIC CONSTANT LAYER WITH CONTROLLED BIAXIAL STRESS
- Publication number 20080286494
- Publication date Nov 20, 2008
- International Business Machines Corporation
- Christos Dimitrios Dimitrakopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INHIBITING DAMAGE FROM DICING AND CHIP PACKAGING INTERACTION FAILU...
- Publication number 20080277765
- Publication date Nov 13, 2008
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20080254630
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- B82 - NANO-TECHNOLOGY
Information Patent Application
STRUCTURE TO IMPROVE ADHESION BETWEEN TOP CVD LOW-K DIELECTRIC AND...
- Publication number 20080254643
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL INTERCONNECT STRUCTURES WITH IMPROVED RESISTANCE TO STRESS
- Publication number 20080197513
- Publication date Aug 21, 2008
- International Business Machines Corporation
- Darryl D. Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK FOR IMPROVED RELIABILITY OF SILICON BASED DIELECTRICS
- Publication number 20080132055
- Publication date Jun 5, 2008
- International Business Machines Corporation
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK FOR IMPROVED RELIABILITY OF SILICON BASED DIELECTRICS
- Publication number 20080118717
- Publication date May 22, 2008
- International Business Machines Corporation
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMAN...
- Publication number 20080079176
- Publication date Apr 3, 2008
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRALOW DIELECTRIC CONSTANT LAYER WITH CONTROLLED BIAXIAL STRESS
- Publication number 20080044668
- Publication date Feb 21, 2008
- International Business Machines Corporation
- Christos Dimitrios Dimitrakopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20080038915
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20080038923
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Application
DUAL DAMASCENE INTERCONNECT STRUCTURES HAVING DIFFERENT MATERIALS F...
- Publication number 20080026566
- Publication date Jan 31, 2008
- International Business Machines Corporation
- Jeffrey Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure to improve adhesion between top CVD low-k dielectric and...
- Publication number 20070148958
- Publication date Jun 28, 2007
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARK WITH IMPROVED RESISTANCE TO DICING INDUCED CRACKING...
- Publication number 20070108638
- Publication date May 17, 2007
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line level air gaps
- Publication number 20060264036
- Publication date Nov 23, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiCOH dielectric material with improved toughness and improved Si-C...
- Publication number 20060165891
- Publication date Jul 27, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal capped copper interconnect
- Publication number 20060157857
- Publication date Jul 20, 2006
- International Business Machines Corporation
- Michael Lane
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Hardmask for improved reliability of silicon based dielectrics
- Publication number 20060091559
- Publication date May 4, 2006
- International Business Machines Corporation
- Son Van Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20060027934
- Publication date Feb 9, 2006
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLEVEL DIELECTRIC LAYER AND METAL LAYER SEALING
- Publication number 20060024961
- Publication date Feb 2, 2006
- Matthew S. Angyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliability of low-k dielectric devices with energy dissipative layer
- Publication number 20060012014
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Shyng-Tsong T. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20060014376
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS

Michael W. Lane

Person

Patents Grantslast 30 patents

Semiconductor chips including passivation layer trench structure

Semiconductor chips including passivation layer trench structure

Device and methodology for reducing effective dielectric constant i...

Reducing effective dielectric constant in semiconductor devices

Method of fabricating a SiCOH dielectric material with improved tou...

Structure for inhibiting back end of line damage from dicing and ch...

Using crack arrestor for inhibiting damage from dicing and chip pac...

SiCOH dielectric material with improved toughness and improved Si-C...

Device and methodology for reducing effective dielectric constant i...

BEOL interconnect structures with improved resistance to stress

Formation of aligned capped metal lines and interconnections in mul...

Structure to improve adhesion between top CVD low-K dielectric and...

Dual damascene interconnect structures having different materials f...

Strengthening of a structure by infiltration

Device and methodology for reducing effective dielectric constant i...

Crack trapping and arrest in thin film structures

Method and structure to enhance temperature/humidity/bias performan...

Metal capped copper interconnect

Method of forming crack trapping and arrest in thin film structures

Hardmask for improved reliability of silicon based dielectrics

SiCOH dielectric material with improved toughness and improved Si-C...

Device and methodology for reducing effective dielectric constant i...

Structure to improve adhesion between top CVD low-k dielectric and...

Ultralow dielectric constant layer with controlled biaxial stress

Hardmask for reliability of silicon based dielectrics

Dual damascene interconnect structures having different materials f...

Silicon chip carrier with conductive through-vias and method for fa...

Interlevel dielectric layer and metal layer sealing

Copper conductor

Crackstop with release layer for crack control in semiconductors

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIPS INCLUDING PASSIVATION LAYER TRENCH STRUCTURE

STRUCTURE FOR INHIBITING BACK END OF LINE DAMAGE FROM DICING AND CH...

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C...

SEMICONDUCTOR CHIPS INCLUDING PASSIVATION LAYER TRENCH STRUCTURE

ULTRALOW DIELECTRIC CONSTANT LAYER WITH CONTROLLED BIAXIAL STRESS

SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C...

STRENGTHENING OF A STRUCTURE BY INFILTRATION

ULTRALOW DIELECTRIC CONSTANT LAYER WITH CONTROLLED BIAXIAL STRESS

INHIBITING DAMAGE FROM DICING AND CHIP PACKAGING INTERACTION FAILU...

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

STRUCTURE TO IMPROVE ADHESION BETWEEN TOP CVD LOW-K DIELECTRIC AND...

BEOL INTERCONNECT STRUCTURES WITH IMPROVED RESISTANCE TO STRESS

HARDMASK FOR IMPROVED RELIABILITY OF SILICON BASED DIELECTRICS

HARDMASK FOR IMPROVED RELIABILITY OF SILICON BASED DIELECTRICS

METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMAN...

ULTRALOW DIELECTRIC CONSTANT LAYER WITH CONTROLLED BIAXIAL STRESS

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

DUAL DAMASCENE INTERCONNECT STRUCTURES HAVING DIFFERENT MATERIALS F...

Structure to improve adhesion between top CVD low-k dielectric and...

ALIGNMENT MARK WITH IMPROVED RESISTANCE TO DICING INDUCED CRACKING...

Line level air gaps

SiCOH dielectric material with improved toughness and improved Si-C...

Metal capped copper interconnect

Hardmask for improved reliability of silicon based dielectrics

Silicon chip carrier with conductive through-vias and method for fa...

INTERLEVEL DIELECTRIC LAYER AND METAL LAYER SEALING

Reliability of low-k dielectric devices with energy dissipative layer

Stacked via-stud with improved reliability in copper metallurgy