Michael Windham

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Kalispell, MT, US

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Patents Grantslast 30 patents

Information Patent Grant
Electroplating system
- Patent number 11,982,008
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,578,422
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,268,208
- Issue date Mar 8, 2022
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer electroplating chuck assembly
- Patent number 10,174,437
- Issue date Jan 8, 2019
- Applied Materials, Inc.
- Randy A. Harris
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20230167573
- Publication date Jun 1, 2023
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20220145489
- Publication date May 12, 2022
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20210348296
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER ELECTROPLATING CHUCK ASSEMBLY
- Publication number 20170009367
- Publication date Jan 12, 2017
- Applied Materials, Inc.
- Randy A. Harris
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR