Michiharu Honda

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of making the devices
- Patent number 6,861,294
- Issue date Mar 1, 2005
- Renesas Technology Corp.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device a ball grid array pa...
- Patent number 6,686,226
- Issue date Feb 3, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump forming method and apparatus therefor
- Patent number 6,460,755
- Issue date Oct 8, 2002
- Hitachi, Ltd.
- Kosuke Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device-mounting construction and inspection method th...
- Patent number 6,448,646
- Issue date Sep 10, 2002
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device-mounted on a printed circuit board having sold...
- Patent number 6,122,177
- Issue date Sep 19, 2000
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a ball grid a...
- Patent number 6,114,192
- Issue date Sep 5, 2000
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a ball grid array package structure usi...
- Patent number 5,914,531
- Issue date Jun 22, 1999
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier package
- Patent number 5,390,079
- Issue date Feb 14, 1995
- Hitachi, Ltd.
- Kokichi Aomori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor memory device and semiconductor memory module...
- Patent number 5,334,875
- Issue date Aug 2, 1994
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor apparatus of module installing type
- Patent number 5,315,482
- Issue date May 24, 1994
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stacked device
- Patent number 5,198,888
- Issue date Mar 30, 1993
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and semiconductor module with a plurality of s...
- Patent number 5,028,986
- Issue date Jul 2, 1991
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor devices and methods of making the devices
- Publication number 20040063272
- Publication date Apr 1, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS

Michiharu Honda

Person

Patents Grantslast 30 patents

Semiconductor devices and methods of making the devices

Method of manufacturing a semiconductor device a ball grid array pa...

Bump forming method and apparatus therefor

Semiconductor device-mounting construction and inspection method th...

Semiconductor device-mounted on a printed circuit board having sold...

Method of manufacturing a semiconductor device having a ball grid a...

Semiconductor device having a ball grid array package structure usi...

Tape carrier package

Stacked semiconductor memory device and semiconductor memory module...

Semiconductor apparatus of module installing type

Semiconductor stacked device

Semiconductor device and semiconductor module with a plurality of s...

Patents Applicationslast 30 patents

Semiconductor devices and methods of making the devices