Michio Mashino

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive sheet for semiconductor, and dicing tape integrated adhesi...
- Patent number 9,969,909
- Issue date May 15, 2018
- Hitachi Chemical Company, Ltd.
- Masaki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flap in an adhesive tape for semiconductor manufacturing
- Patent number D804435
- Issue date Dec 5, 2017
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Tape for processing wafer, method for manufacturing tape for proces...
- Patent number 9,190,309
- Issue date Nov 17, 2015
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for processing wafer, method for manufacturing tape for proces...
- Patent number 9,076,833
- Issue date Jul 7, 2015
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer processing tape, method of manufacturing wafer processing tap...
- Patent number 9,076,832
- Issue date Jul 7, 2015
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Adhesive sheet, dicing tape integrated type adhesive sheet, and met...
- Patent number 8,617,930
- Issue date Dec 31, 2013
- Hitachi Chemical Co., Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D690278
- Issue date Sep 24, 2013
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D689831
- Issue date Sep 17, 2013
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive sheet and method for manufacturing the same, semiconductor...
- Patent number 8,470,115
- Issue date Jun 25, 2013
- Hitachi Chemical Company, Ltd.
- Maiko Tanaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive sheet and method for manufacturing the same, semiconductor...
- Patent number 8,465,615
- Issue date Jun 18, 2013
- Hitachi Chemical Company, Ltd.
- Maiko Tanaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D680505
- Issue date Apr 23, 2013
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D664511
- Issue date Jul 31, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D664512
- Issue date Jul 31, 2012
- Hitachi Chemical Comapany, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D656909
- Issue date Apr 3, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive tape for semiconductor manufacturing
- Patent number D656910
- Issue date Apr 3, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei Taniguchi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Adhesive sheet, semiconductor device, and process for producing sem...
- Patent number 8,017,444
- Issue date Sep 13, 2011
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing tape laminated with adhesive sheet of polymer, thermosetting...
- Patent number 7,968,194
- Issue date Jun 28, 2011
- Hitachi Chemical Co., Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing tape laminated with adhesive sheet of polymer, epoxy resin a...
- Patent number 7,968,195
- Issue date Jun 28, 2011
- Hitachi Chemical Co., Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding semiconductor wafer stuck on dicing tape laminated adhesive...
- Patent number 7,875,500
- Issue date Jan 25, 2011
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...
- Publication number 20150279717
- Publication date Oct 1, 2015
- HITACHI CHEMICAL COMPANY, LTD.
- Kouhei Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20130302570
- Publication date Nov 14, 2013
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20130295314
- Publication date Nov 7, 2013
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...
- Publication number 20130273718
- Publication date Oct 17, 2013
- HITACHI CHEMICAL COMPANY, LTD.
- Kouhei TANIGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...
- Publication number 20130224932
- Publication date Aug 29, 2013
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...
- Publication number 20130045585
- Publication date Feb 21, 2013
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20120135176
- Publication date May 31, 2012
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING TAPE, METHOD OF MANUFACTURING WAFER PROCESSING TAP...
- Publication number 20120094471
- Publication date Apr 19, 2012
- Hitachi Chemical Company, Ltd.
- Kouhei TANIGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20120073743
- Publication date Mar 29, 2012
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20120068312
- Publication date Mar 22, 2012
- Maikoi TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEM...
- Publication number 20110287250
- Publication date Nov 24, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR SEMICONDUCTOR, AND DICING TAPE INTEGRATED ADHESI...
- Publication number 20100266842
- Publication date Oct 21, 2010
- Masaki Yamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive sheet, dicing tape integrated type adhesive sheet, and met...
- Publication number 20090186216
- Publication date Jul 23, 2009
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive sheet, dicing tape integrated type adhesive sheet, and met...
- Publication number 20080305583
- Publication date Dec 11, 2008
- Teichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive sheet, dicing tape integrated type adhesive sheet, and met...
- Publication number 20080286594
- Publication date Nov 20, 2008
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Sheet and Method for Manufacturing the Same, Semiconductor...
- Publication number 20080261039
- Publication date Oct 23, 2008
- Maiko Tanaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...
- Publication number 20080171187
- Publication date Jul 17, 2008
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Sheet, Semiconductor Device, and Process for Producing Sem...
- Publication number 20070241434
- Publication date Oct 18, 2007
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive sheet, dicing tape intergrated type adhesive sheet, and se...
- Publication number 20060128065
- Publication date Jun 15, 2006
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Michio Mashino

Person

Patents Grantslast 30 patents

Adhesive sheet for semiconductor, and dicing tape integrated adhesi...

Flap in an adhesive tape for semiconductor manufacturing

Tape for processing wafer, method for manufacturing tape for proces...

Tape for processing wafer, method for manufacturing tape for proces...

Wafer processing tape, method of manufacturing wafer processing tap...

Adhesive sheet, dicing tape integrated type adhesive sheet, and met...

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive sheet and method for manufacturing the same, semiconductor...

Adhesive sheet and method for manufacturing the same, semiconductor...

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive tape for semiconductor manufacturing

Adhesive sheet, semiconductor device, and process for producing sem...

Dicing tape laminated with adhesive sheet of polymer, thermosetting...

Dicing tape laminated with adhesive sheet of polymer, epoxy resin a...

Bonding semiconductor wafer stuck on dicing tape laminated adhesive...

Patents Applicationslast 30 patents

TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCES...

ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...

ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

WAFER PROCESSING TAPE, METHOD OF MANUFACTURING WAFER PROCESSING TAP...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEM...

ADHESIVE SHEET FOR SEMICONDUCTOR, AND DICING TAPE INTEGRATED ADHESI...

Adhesive sheet, dicing tape integrated type adhesive sheet, and met...

Adhesive sheet, dicing tape integrated type adhesive sheet, and met...

Adhesive sheet, dicing tape integrated type adhesive sheet, and met...

Adhesive Sheet and Method for Manufacturing the Same, Semiconductor...

ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND MET...

Adhesive Sheet, Semiconductor Device, and Process for Producing Sem...

Adhesive sheet, dicing tape intergrated type adhesive sheet, and se...