Michio Sono

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bump-forming method using two plates and electronic device
- Patent number 6,528,346
- Issue date Mar 4, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating solder bumps by forming solder balls with a...
- Patent number 6,025,258
- Issue date Feb 15, 2000
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a semiconductor device, base member for semico...
- Patent number 6,022,759
- Issue date Feb 8, 2000
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the device
- Patent number 5,920,117
- Issue date Jul 6, 1999
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for surface mounting
- Patent number 5,861,669
- Issue date Jan 19, 1999
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for surface mounting
- Patent number 5,831,332
- Issue date Nov 3, 1998
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a packaged semiconductor having a divided...
- Patent number 5,804,468
- Issue date Sep 8, 1998
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device unit for a stack arra...
- Patent number 5,801,439
- Issue date Sep 1, 1998
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device unit
- Patent number 5,786,985
- Issue date Jul 28, 1998
- Fujitsu Limited
- Norio Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inner lead extending over a central...
- Patent number 5,760,471
- Issue date Jun 2, 1998
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, base member for semiconductor device and semi...
- Patent number 5,747,874
- Issue date May 5, 1998
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and method of producing the...
- Patent number 5,703,398
- Issue date Dec 30, 1997
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device unit having holder
- Patent number 5,684,675
- Issue date Nov 4, 1997
- Fujitsu, Ltd.
- Norio Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiator structure
- Patent number 5,659,200
- Issue date Aug 19, 1997
- Fujitsu, Ltd.
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming solder balls on a plate having apertures using...
- Patent number 5,643,831
- Issue date Jul 1, 1997
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package for surface mounting with reinforcing members...
- Patent number 5,574,310
- Issue date Nov 12, 1996
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved leads comprising palladium pla...
- Patent number 5,521,432
- Issue date May 28, 1996
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame therefore
- Patent number 5,497,032
- Issue date Mar 5, 1996
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with surface mount package adapted for vertica...
- Patent number 5,451,815
- Issue date Sep 19, 1995
- Fujitsu Limited
- Norio Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for encapsulating a semiconductor package having a heat sin...
- Patent number 5,444,025
- Issue date Aug 22, 1995
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor device having radiation part made...
- Patent number 5,424,251
- Issue date Jun 13, 1995
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor integrated circuit device havin...
- Patent number 5,361,970
- Issue date Nov 8, 1994
- Fujitsu Limited
- Junichi Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a process for making same having improved...
- Patent number 5,343,615
- Issue date Sep 6, 1994
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device having terminal members pro...
- Patent number 5,309,016
- Issue date May 3, 1994
- Fujitsu Limited
- Junichi Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mounting type semiconductor package having an improved effi...
- Patent number 5,305,179
- Issue date Apr 19, 1994
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a semiconductor device having a radiation...
- Patent number 5,296,740
- Issue date Mar 22, 1994
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing semiconductor device
- Patent number 4,788,583
- Issue date Nov 29, 1988
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed radiation shield for a semiconductor device
- Patent number 4,661,837
- Issue date Apr 28, 1987
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bump-forming method using two plates and electronic device
- Publication number 20010018263
- Publication date Aug 30, 2001
- Masayuki Ochiai
- H01 - BASIC ELECTRIC ELEMENTS

Michio Sono

Person

Patents Grantslast 30 patents

Bump-forming method using two plates and electronic device

Method for fabricating solder bumps by forming solder balls with a...

Method for producing a semiconductor device, base member for semico...

Semiconductor device and method of forming the device

Semiconductor package for surface mounting

Semiconductor package for surface mounting

Process for manufacturing a packaged semiconductor having a divided...

Semiconductor device and semiconductor device unit for a stack arra...

Semiconductor device and semiconductor device unit

Semiconductor device having an inner lead extending over a central...

Semiconductor device, base member for semiconductor device and semi...

Semiconductor integrated circuit device and method of producing the...

Semiconductor device unit having holder

Semiconductor device having radiator structure

Process for forming solder balls on a plate having apertures using...

Semiconductor package for surface mounting with reinforcing members...

Semiconductor device having improved leads comprising palladium pla...

Semiconductor device and lead frame therefore

Semiconductor device with surface mount package adapted for vertica...

Process for encapsulating a semiconductor package having a heat sin...

Method of producing semiconductor device having radiation part made...

Method of producing a semiconductor integrated circuit device havin...

Semiconductor device and a process for making same having improved...

Semiconductor integrated circuit device having terminal members pro...

Surface-mounting type semiconductor package having an improved effi...

Method and apparatus for a semiconductor device having a radiation...

Semiconductor device and method of producing semiconductor device

Resin-sealed radiation shield for a semiconductor device

Patents Applicationslast 30 patents

Bump-forming method using two plates and electronic device