Michirou YOSHINO

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Coating apparatus with base material height changing device configu...
- Patent number 10,933,438
- Issue date Mar 2, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Motoi Hatanaka
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wafer separating apparatus and wafer separating method
- Patent number 9,190,301
- Issue date Nov 17, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Michirou Yoshino
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and device for peeling off silicon wafers
- Patent number 8,992,726
- Issue date Mar 31, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Koso Matsuno
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
COATING METHOD AND COATING APPARATUS
- Publication number 20190232328
- Publication date Aug 1, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- MOTOI HATANAKA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WAFER SEPARATING APPARATUS AND WAFER SEPARATING METHOD
- Publication number 20140130986
- Publication date May 15, 2014
- PANASONIC CORPORATION
- MICHIROU YOSHINO
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND DEVICE FOR PEELING OFF SILICON WAFERS
- Publication number 20130319619
- Publication date Dec 5, 2013
- PANASONIC CORPORATION
- Koso MATSUNO
- B32 - LAYERED PRODUCTS