Mie Matsuo

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,355,441
- Issue date Jun 7, 2022
- Kabushiki Kaisha Toshiba
- Kazushiro Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,189,554
- Issue date Nov 30, 2021
- NuFlare Technology, Inc.
- Shiro Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device that includes dividin...
- Patent number 9,633,902
- Issue date Apr 25, 2017
- Kabushiki Kaisha Toshiba
- Satoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical waveguide sensor chip, optical waveguide sensor, and method...
- Patent number 8,837,871
- Issue date Sep 16, 2014
- Kabushiki Kaisha Toshiba
- Mika Fujii
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 8,748,316
- Issue date Jun 10, 2014
- Kabushiki Kaisha Toshiba
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,580,652
- Issue date Nov 12, 2013
- Kabushiki Kaisha Toshiba
- Atsuko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor device, chip therefor and method of formati...
- Patent number 8,283,755
- Issue date Oct 9, 2012
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment composition, surface treatment method, and method...
- Patent number 8,257,504
- Issue date Sep 4, 2012
- JSR Corporation
- Yasumasa Mori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device, through hole having expansion portion and thi...
- Patent number 8,237,285
- Issue date Aug 7, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and camera module
- Patent number 8,228,426
- Issue date Jul 24, 2012
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and semiconductor memory tester
- Patent number 8,179,730
- Issue date May 15, 2012
- Kabushiki Kaisha Toshiba
- Yuui Shimizu
- G11 - INFORMATION STORAGE
Information Patent Grant
Multichip semiconductor device, chip therefor and method of formati...
- Patent number 8,174,093
- Issue date May 8, 2012
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-illuminated type solid-state image pickup apparatus with perip...
- Patent number 8,098,312
- Issue date Jan 17, 2012
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and semiconductor memory tester
- Patent number 7,869,240
- Issue date Jan 11, 2011
- Kabushiki Kaisha Toshiba
- Yuui Shimizu
- G11 - INFORMATION STORAGE
Information Patent Grant
Back-illuminated type solid-state image pickup device and camera mo...
- Patent number 7,859,073
- Issue date Dec 28, 2010
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multichip semiconductor device, chip therefor and method of formati...
- Patent number 7,829,975
- Issue date Nov 9, 2010
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including through-hole electrode and light-tr...
- Patent number 7,808,064
- Issue date Oct 5, 2010
- Kabushiki Kaisha Toshiba
- Atsuko Kawasaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,608,537
- Issue date Oct 27, 2009
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having power semiconductor elements
- Patent number 7,531,876
- Issue date May 12, 2009
- Kabushiki Kaisha Toshiba
- Ichiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,521,352
- Issue date Apr 21, 2009
- Kabushiki Kaisha Toshiba
- Hideo Shinomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a localize SOI in bulk silicon substrate inc...
- Patent number 7,507,634
- Issue date Mar 24, 2009
- Kabushiki Kaisha Toshiba
- Tsutomu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having micro-electrical mechanical system
- Patent number 7,482,194
- Issue date Jan 27, 2009
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having actuator
- Patent number 7,427,797
- Issue date Sep 23, 2008
- Kabushiki Kaisha Toshiba
- Tatsuya Ohguro
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 7,402,903
- Issue date Jul 22, 2008
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor device, chip therefor and method of formati...
- Patent number 7,335,517
- Issue date Feb 26, 2008
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating element movement bonding method for semiconductor components
- Patent number 7,238,919
- Issue date Jul 3, 2007
- Kabushiki Kaisha Toshiba
- Hisashi Kaneko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making empty space in silicon
- Patent number 7,235,456
- Issue date Jun 26, 2007
- Kabushiki Kaisha Toshiba
- Tsutomu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable-capacitance element, variable-capacitance device, and port...
- Patent number 7,177,134
- Issue date Feb 13, 2007
- Kabushiki Kaisha Toshiba
- Tamio Ikehashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package member, and semiconduct...
- Patent number 7,095,112
- Issue date Aug 22, 2006
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,067,897
- Issue date Jun 27, 2006
- Kabushiki Kaisha Toshiba
- Masaaki Hatano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200091056
- Publication date Mar 19, 2020
- NuFlare Technology, Inc.
- Shiro Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190295954
- Publication date Sep 26, 2019
- Kabushiki Kaisha Toshiba
- Kazushiro NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20190096763
- Publication date Mar 28, 2019
- Kabushiki Kaisha Toshiba
- Mie MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTU...
- Publication number 20170221705
- Publication date Aug 3, 2017
- Kabushiki Kaisha Toshiba
- Mie MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING SAME...
- Publication number 20160276532
- Publication date Sep 22, 2016
- KABUSHIKI KAISHA TOSHIBA
- Kentaro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160268164
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Satoshi MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160268165
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Satoshi MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160079493
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Mie MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE SENSOR CHIP, OPTICAL WAVEGUIDE SENSOR, AND METHOD...
- Publication number 20120014638
- Publication date Jan 19, 2012
- Kabushiki Kaisha Toshiba
- Mika FUJII
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
- Publication number 20110317050
- Publication date Dec 29, 2011
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENT, OPTICAL ELEMENT MANUFACTURING METHOD, AND CAMERA M...
- Publication number 20110216238
- Publication date Sep 8, 2011
- Mika FUJII
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multichip semiconductor device, chip therefor and method of formati...
- Publication number 20110215443
- Publication date Sep 8, 2011
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip semiconductor device, chip therefor and method of formati...
- Publication number 20110101522
- Publication date May 5, 2011
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY TESTER
- Publication number 20110074494
- Publication date Mar 31, 2011
- KABUSHIKI KAISHA TOSHIBA
- Yuui SHIMIZU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110068476
- Publication date Mar 24, 2011
- Atsuko KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEM...
- Publication number 20100321544
- Publication date Dec 23, 2010
- Kabushiki Kaisha Toshiba
- Mie MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT COMPOSITION, SURFACE TREATMENT METHOD, AND METHOD...
- Publication number 20100311630
- Publication date Dec 9, 2010
- JSR Corporation
- Yasumasa MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20100025860
- Publication date Feb 4, 2010
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP APPARATUS AND CAMERA MODULE
- Publication number 20090295979
- Publication date Dec 3, 2009
- Kabushiki Kaisha Toshiba
- Mie MATSUO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING THROUGH-HOLE ELECTRODE AND LIGHT-TR...
- Publication number 20090283847
- Publication date Nov 19, 2009
- Atsuko KAWASAKI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND CAMERA MODULE
- Publication number 20090284631
- Publication date Nov 19, 2009
- Mie MATSUO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BACK-ILLUMINATED TYPE SOLID-STATE IMAGE PICKUP DEVICE AND CAMERA MO...
- Publication number 20090014762
- Publication date Jan 15, 2009
- Mie MATSUO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY TESTER
- Publication number 20090003103
- Publication date Jan 1, 2009
- Kabushiki Kaisha Toshiba
- Yuui SHIMIZU
- G11 - INFORMATION STORAGE
Information Patent Application
Multichip semiconductor device, chip therefor and method of formati...
- Publication number 20080237888
- Publication date Oct 2, 2008
- Kabushiki Kaisha Toshiba
- Nobuo Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Semiconductor Device
- Publication number 20080081466
- Publication date Apr 3, 2008
- Mie MATSUO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor substrate and its fabrication method
- Publication number 20080003771
- Publication date Jan 3, 2008
- Kabushiki Kaisha Toshiba
- Tsutomu Sato
- G02 - OPTICS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20070254474
- Publication date Nov 1, 2007
- Hideo Shinomiya
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Bonding method and bonding apparatus
- Publication number 20060207985
- Publication date Sep 21, 2006
- Kabushiki Kaisha Toshiba
- Hisashi Kaneko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Variable-capacitance element, variable-capacitance device, and port...
- Publication number 20060209491
- Publication date Sep 21, 2006
- KABUSHIKI KAISHA TOSHIBA
- Tamio Ikehashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component having micro-electrical mechanical system
- Publication number 20060157808
- Publication date Jul 20, 2006
- Kabushiki Kaisha Toshiba
- Mie Matsuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Method for manufacturing semiconductor device that includes dividin...

Optical waveguide sensor chip, optical waveguide sensor, and method...

Method of manufacturing semiconductor device, semiconductor device,...

Semiconductor device and manufacturing method thereof

Multichip semiconductor device, chip therefor and method of formati...

Surface treatment composition, surface treatment method, and method...

Semiconductor device, through hole having expansion portion and thi...

Semiconductor package and camera module

Semiconductor device and semiconductor memory tester

Multichip semiconductor device, chip therefor and method of formati...

Back-illuminated type solid-state image pickup apparatus with perip...

Semiconductor device and semiconductor memory tester

Back-illuminated type solid-state image pickup device and camera mo...

Multichip semiconductor device, chip therefor and method of formati...

Semiconductor package including through-hole electrode and light-tr...

Method for fabricating semiconductor device

Semiconductor device having power semiconductor elements

Method for manufacturing a semiconductor device

Method for fabricating a localize SOI in bulk silicon substrate inc...

Electronic component having micro-electrical mechanical system

Semiconductor device having actuator

Semiconductor device

Multichip semiconductor device, chip therefor and method of formati...

Heating element movement bonding method for semiconductor components

Method of making empty space in silicon

Variable-capacitance element, variable-capacitance device, and port...

Semiconductor device, semiconductor package member, and semiconduct...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

LASER PROCESSING METHOD

COMPOSITE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTU...

SEMICONDUCTOR LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING SAME...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

OPTICAL WAVEGUIDE SENSOR CHIP, OPTICAL WAVEGUIDE SENSOR, AND METHOD...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...

OPTICAL ELEMENT, OPTICAL ELEMENT MANUFACTURING METHOD, AND CAMERA M...

Multichip semiconductor device, chip therefor and method of formati...

Multichip semiconductor device, chip therefor and method of formati...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY TESTER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEM...

SURFACE TREATMENT COMPOSITION, SURFACE TREATMENT METHOD, AND METHOD...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SOLID-STATE IMAGE PICKUP APPARATUS AND CAMERA MODULE

SEMICONDUCTOR PACKAGE INCLUDING THROUGH-HOLE ELECTRODE AND LIGHT-TR...

SEMICONDUCTOR PACKAGE AND CAMERA MODULE

BACK-ILLUMINATED TYPE SOLID-STATE IMAGE PICKUP DEVICE AND CAMERA MO...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY TESTER

Multichip semiconductor device, chip therefor and method of formati...

Method for Fabricating Semiconductor Device

Semiconductor substrate and its fabrication method

Method for manufacturing a semiconductor device

Bonding method and bonding apparatus

Variable-capacitance element, variable-capacitance device, and port...

Electronic component having micro-electrical mechanical system