Mihalis Kolios Michael

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertically structured pad system
- Patent number 11,296,019
- Issue date Apr 5, 2022
- Maxim Integrated Products, Inc.
- Kwang Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADED PACKAGE USING ROUTING LAYER FOR INTEGRATED CIRCUIT DIE
- Publication number 20250140665
- Publication date May 1, 2025
- Infineon Technologies Canada Inc.
- Mihalis MICHAEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE
- Publication number 20250140674
- Publication date May 1, 2025
- Infineon Technologies Canada Inc.
- Marco A. ZUNIGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED LAYERS FOR ENCAPSULATION AND REDISTRIBUTION IN SOLID STATE...
- Publication number 20250140916
- Publication date May 1, 2025
- Ensurge Micropower ASA
- Arvind KAMATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESIVE FOR HIGH VOLUMETRIC ENERGY DENSITY IN SOLID STATE...
- Publication number 20250140896
- Publication date May 1, 2025
- Ensurge Micropower ASA
- Arvind KAMATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYLINDRICAL SOLID-STATE BATTERY, AND METHODS OF MAKING AND USING TH...
- Publication number 20240113341
- Publication date Apr 4, 2024
- Ensurge Micropower ASA
- Richard VAN DER LINDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ENERGY-DENSITY SOLID-STATE BATTERY, AND METHOD(S) OF MAKING TH...
- Publication number 20230420731
- Publication date Dec 28, 2023
- Ensurge Micropower ASA
- Khanh TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION/ENCAPSULATION LAYER, VIA AND DISTRIBUTION LAYER, SOLID-...
- Publication number 20230378606
- Publication date Nov 23, 2023
- Ensurge Micropower ASA
- Khanh TRAN
- H01 - BASIC ELECTRIC ELEMENTS

Mihalis Kolios Michael

Person

Patents Grantslast 30 patents

Vertically structured pad system

Patents Applicationslast 30 patents

LEADED PACKAGE USING ROUTING LAYER FOR INTEGRATED CIRCUIT DIE

MULTI-DIE PACKAGE

PRINTED LAYERS FOR ENCAPSULATION AND REDISTRIBUTION IN SOLID STATE...

PRINTED ADHESIVE FOR HIGH VOLUMETRIC ENERGY DENSITY IN SOLID STATE...

CYLINDRICAL SOLID-STATE BATTERY, AND METHODS OF MAKING AND USING TH...

HIGH ENERGY-DENSITY SOLID-STATE BATTERY, AND METHOD(S) OF MAKING TH...

PASSIVATION/ENCAPSULATION LAYER, VIA AND DISTRIBUTION LAYER, SOLID-...