Miki Mori

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic bonding apparatus
- Patent number 8,997,815
- Issue date Apr 7, 2015
- Kabushiki Kaisha Toshiba
- Takahiro Aizawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electron emitter and associated display
- Patent number 6,626,724
- Issue date Sep 30, 2003
- Kabushiki Kaisha Toshiba
- Masahiko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field emission type display
- Patent number 6,603,256
- Issue date Aug 5, 2003
- Kabushiki Kaisha Toshiba
- Goh Itoh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electron emission element having resistance layer of particular par...
- Patent number 6,563,260
- Issue date May 13, 2003
- Kabushiki Kaisha Toshiba
- Masahiko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film magnetic head having an improved heat dispersion and magn...
- Patent number 6,256,171
- Issue date Jul 3, 2001
- Kabushiki Kaisha Toshiba
- Hiroaki Yoda
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Reflective liquid crystal display device
- Patent number 6,094,244
- Issue date Jul 25, 2000
- Kabushiki Kaisha Toshiba
- Yasushi Kawata
- G02 - OPTICS
Information Patent Grant
Multipanel liquid crystal display device having a groove on the edg...
- Patent number 6,057,898
- Issue date May 2, 2000
- Kabushiki Kaisha Toshiba
- Goh Itoh
- G02 - OPTICS
Information Patent Grant
Liquid crystal display device
- Patent number 6,014,193
- Issue date Jan 11, 2000
- Kabushiki Kaisha Toshiba
- Kazuki Taira
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with improved encapsulating resin
- Patent number 5,959,363
- Issue date Sep 28, 1999
- Kabushiki Kaisha Toshiba
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved encapsulating resin
- Patent number 5,864,178
- Issue date Jan 26, 1999
- Kabushiki Kaisha Toshiba
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 5,821,627
- Issue date Oct 13, 1998
- Kabushiki Kaisha Toshiba
- Miki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image display apparatus includes an opposite board sandwiched by ar...
- Patent number 5,801,797
- Issue date Sep 1, 1998
- Kabushiki Kaisha Toshiba
- Atsuko Iida
- G02 - OPTICS
Information Patent Grant
Display device having driving circuits at the periphery of a substrate
- Patent number 5,712,493
- Issue date Jan 27, 1998
- Kabushiki Kaisha Toshiba
- Miki Mori
- G02 - OPTICS
Information Patent Grant
Electronic circuit device
- Patent number 5,684,677
- Issue date Nov 4, 1997
- Kabushiki Kaisha Toshiba
- Tatsuro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminograph and inspection and repair device using the same
- Patent number 5,594,768
- Issue date Jan 14, 1997
- Kabushiki Kaisha Toshiba
- Masashi Fujii
- G01 - MEASURING TESTING
Information Patent Grant
Liquid crystal display device with acrylic polymer spacers and meth...
- Patent number 5,499,128
- Issue date Mar 12, 1996
- Kabushiki Kaisha Toshiba
- Rei Hasegawa
- G02 - OPTICS
Information Patent Grant
Integrated circuit device with internal inspection circuitry
- Patent number 5,453,991
- Issue date Sep 26, 1995
- Kabushiki Kaisha Toshiba
- Kouhei Suzuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device utilizing a face-down bonding and a method for...
- Patent number 5,071,787
- Issue date Dec 10, 1991
- Kabushiki Kaisha Toshiba
- Miki Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bump electrode and electronic circuit device
- Patent number 4,857,482
- Issue date Aug 15, 1989
- Kabushiki Kaisha Toshiba
- Masayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRASONIC BONDING APPARATUS
- Publication number 20140283996
- Publication date Sep 25, 2014
- SHIBAURA MECHATRONICS CORPORATION
- Takahiro AIZAWA
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
MOBILE APPARATUS AND MOBILE PHONE
- Publication number 20090197654
- Publication date Aug 6, 2009
- Kabushiki Kaisha Toshiba
- Masao TESHIMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE
- Publication number 20070080351
- Publication date Apr 12, 2007
- Miki MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20070080624
- Publication date Apr 12, 2007
- Kaoru Koiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATOR, LED ILLUMINATOR, AND IMAGING DEVICE WITH ILLUMINATOR
- Publication number 20070041199
- Publication date Feb 22, 2007
- Naotada OKADA
- G02 - OPTICS
Information Patent Application
Electron emission element, method of manufacturing the same, displa...
- Publication number 20030001490
- Publication date Jan 2, 2003
- KABUSHIKI KAISHA TOSHIBA
- Masahiko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Ultrasonic bonding apparatus

Method of manufacturing electron emitter and associated display

Field emission type display

Electron emission element having resistance layer of particular par...

Thin film magnetic head having an improved heat dispersion and magn...

Reflective liquid crystal display device

Multipanel liquid crystal display device having a groove on the edg...

Liquid crystal display device

Semiconductor device with improved encapsulating resin

Semiconductor device with improved encapsulating resin

Electronic circuit device

Image display apparatus includes an opposite board sandwiched by ar...

Display device having driving circuits at the periphery of a substrate

Electronic circuit device

Laminograph and inspection and repair device using the same

Liquid crystal display device with acrylic polymer spacers and meth...

Integrated circuit device with internal inspection circuitry

Semiconductor device utilizing a face-down bonding and a method for...

Method of forming bump electrode and electronic circuit device

Patents Applicationslast 30 patents

ULTRASONIC BONDING APPARATUS

MOBILE APPARATUS AND MOBILE PHONE

DISPLAY DEVICE

DISPLAY DEVICE

ILLUMINATOR, LED ILLUMINATOR, AND IMAGING DEVICE WITH ILLUMINATOR

Electron emission element, method of manufacturing the same, displa...