Claims
- 1. An electronic circuit device comprising:
- a printed wiring board having a major surface and pads provided on the major surfaces;
- a leadless component located above the major surface of said printing wiring board and having a major surface opposing the major surface of said printed wiring board;
- a plurality of electrodes which are each provided on at least a part of the major surface of said leadless component and one side of said leadless component;
- a plurality of bumps electrically connecting said pads to said plurality of electrodes, respectively, so as to provide a distance between opposing ones of said plurality of electrodes of said pads;
- a plurality of electrically conductive members integral with said bumps, each one of said plurality of electrically conductive members extending from one of said bumps onto a region of one of said plurality of electrodes that is provided on a side of said leadless component; and
- a spacer located in a gap between the major surface of said leadless component and the major surface of said printed wiring board,
- wherein the outermost part of each one of said plurality of bumps is located above outside an outer edge of a corresponding one of said pads, as said leadless component is viewed from above.
- 2. The electric circuit device according to claim 1, wherein each of said pads has an outer edge substantially aligned with an outer edge of that portion of the corresponding electrode which is provided on the major surface of said leadless component.
- 3. The electric circuit device according to claim 1, wherein an outer surface of each of said bumps and an inner surface of the pad connected to the bump define a contact angle of at least 90.degree..
- 4. The electric circuit device according to claim 1, wherein an outer surface of each of said bumps and an inner surface of the pad connected to the bump define a contact angle of at most 90.degree., and the outer surface of the bump is bent by an angle greater than the contact angle.
- 5. The electric circuit device according to claim 1, wherein a part of each of said bumps looks bulging from the side of said leadless component, as said leadless component is viewed from above.
- 6. The electric circuit device according to claim 1, wherein an outermost part of each of said bumps looks located substantially at a midpoint on the side of said leadless component, as said leadless component is viewed from above.
- 7. The electric circuit device according to claim 1, wherein said leadless component is a multi-terminal surface-mount component.
- 8. The electric circuit device according to claim 1, wherein said leadless component is a two-terminal chip component.
Priority Claims (2)
Number |
Date |
Country |
Kind |
5-153150 |
Jun 1993 |
JPX |
|
6-077367 |
Apr 1994 |
JPX |
|
Parent Case Info
This application is a Division of application Ser. No. 08/558,222, filed on Nov. 17, 1995 now abandoned, which is a Continuation of application Ser. No. 08/265,102, filed on Jun. 24, 1994, now abandoned.
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Divisions (1)
|
Number |
Date |
Country |
Parent |
558222 |
Nov 1995 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
265102 |
Jun 1994 |
|