Mikio Nishihara

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
High density thin film circuit board and method of production thereof
- Patent number 6,485,814
- Issue date Nov 26, 2002
- Fujitsu Limited
- Kiyokazu Moriizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit arrangement for multilayer printed circuit board
- Patent number 5,496,971
- Issue date Mar 5, 1996
- Fujitsu Limited
- Kiyokazu Moriizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a connector using frangible contact parts
- Patent number 5,475,922
- Issue date Dec 19, 1995
- Fujitsu Ltd.
- Akira Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method of assembling the same
- Patent number 5,354,209
- Issue date Oct 11, 1994
- Fujitsu Limited
- Akira Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an engineering change to a printed wiring board
- Patent number 5,181,317
- Issue date Jan 26, 1993
- Fujitsu Limited
- Mikio Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure of termination circuit
- Patent number 4,785,141
- Issue date Nov 15, 1988
- Fujitsu Limited
- Mikio Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board
- Patent number 4,692,843
- Issue date Sep 8, 1987
- Fujitsu Limited
- Masaru Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density multilayer printed circuit board
- Patent number 4,675,789
- Issue date Jun 23, 1987
- Fujitsu Limited
- Kiyoshi Kuwabara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board
- Patent number 4,298,770
- Issue date Nov 3, 1981
- Fujitsu Limited
- Mikio Nishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 4,159,508
- Issue date Jun 26, 1979
- Fujitsu Limited
- Masahiro Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board
- Patent number 4,150,421
- Issue date Apr 17, 1979
- Fujitsu Limited
- Mikio Nishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mikio Nishihara

Person

Patents Grantslast 30 patents

High density thin film circuit board and method of production thereof

Circuit arrangement for multilayer printed circuit board

Method of assembling a connector using frangible contact parts

Connector and method of assembling the same

Method of making an engineering change to a printed wiring board

Wiring structure of termination circuit

Multilayer printed wiring board

High density multilayer printed circuit board

Printed board

Multilayer printed wiring board

Multi-layer printed circuit board