Number | Date | Country | Kind |
---|---|---|---|
59-253562 | Nov 1984 | JPX |
This application is a continuation of U.S. application Ser. No. 893,318, filed July 29, 1986, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
3898370 | Davy et al. | Aug 1975 | |
4150421 | Nishihara et al. | Apr 1979 | |
4371744 | Badet et al. | Feb 1983 | |
4546413 | Feinberg et al. | Oct 1985 | |
4562513 | Arnold et al. | Dec 1985 | |
4613924 | Brault | Sep 1986 | |
4620264 | Ushifusa et al. | Oct 1986 |
Entry |
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IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-3, No. 4, Dec. 1980, "A Multilayer Ceramic Multichip Module", by A. J. Blodgett, Jr., pp. 634-637. |
IBM Technical Disclosure Bulletin, vol. 22, No. 5, Oct. 1979, "Multilayer Ceramic Fixed Layer Substrate Design", Johnson et al., pp. 1841-1842. |
Elektronik, vol. 29, No. 21, Oct. 1980, "Bessere Leiterplattenausnutzung mit neuem Mehrchip-IC-Gehause", H. Krumm, pp. 125-128. |
Number | Date | Country | |
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Parent | 893318 | Jul 1986 |