Mill-Jer Wang

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Antenna testing device for high frequency antennas
- Patent number 12,105,131
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Chang Lai
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,062,586
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming probe head structure
- Patent number 12,019,097
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- G01 - MEASURING TESTING
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,906,573
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Test circuit and method
- Patent number 11,852,672
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTORMANUFACTURING COMPANY LIMITED
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,855,066
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shielding during wafer stage testing
- Patent number 11,726,112
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Nen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna testing device and method for high frequency antennas
- Patent number 11,726,122
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Chang Lai
- G01 - MEASURING TESTING
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,693,045
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 11,631,621
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probing structure
- Patent number 11,585,831
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,585,846
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Testing holders for chip unit and die package
- Patent number 11,579,190
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Test circuit and method
- Patent number 11,467,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing holders for chip unit and die package
- Patent number 11,340,291
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,335,672
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for semiconductor device testing
- Patent number 11,293,974
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Devices for high-density probing techniques and method of implement...
- Patent number 11,249,112
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Alignment testing for tiered semiconductor structure
- Patent number 11,231,453
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Three dimensional integrated circuit electrostatic discharge protec...
- Patent number 11,229,109
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Probe head structure of probe card and testing method
- Patent number 11,199,576
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Cheng Hsu
- G01 - MEASURING TESTING
Information Patent Grant
Testing apparatus and testing method
- Patent number 11,199,578
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tang-Jung Chiu
- G01 - MEASURING TESTING
Information Patent Grant
Universal test mechanism for semiconductor device
- Patent number 11,029,331
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device structure with magnetic element in testing region
- Patent number 11,018,065
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probing structure
- Patent number 10,782,318
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,741,537
- Issue date Aug 11, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING COOMPANY LTD.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit and method
- Patent number 10,725,090
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Devices for high-density probing techniques and method of implement...
- Patent number 10,718,790
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Testing holders for chip unit and die package
- Patent number 10,698,026
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Three dimensional integrated circuit electrostatic discharge protec...
- Patent number 10,652,987
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...
- Publication number 20250062202
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yi Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA TESTING DEVICE FOR HIGH FREQUENCY ANTENNAS
- Publication number 20240377446
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chang LAI
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD STRUCTURE
- Publication number 20240302410
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- G01 - MEASURING TESTING
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20240133942
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088124
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION APPARATUS AND METHOD
- Publication number 20240027514
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hong Lin
- G01 - MEASURING TESTING
Information Patent Application
ANTENNA TESTING DEVICE FOR HIGH FREQUENCY ANTENNAS
- Publication number 20230333150
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chang LAI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230253273
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mill-Jer WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20230168296
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
PROBE HEAD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230065443
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- G01 - MEASURING TESTING
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20220381817
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
TEST CIRCUIT AND METHOD
- Publication number 20220357389
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Mill-Jer WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE
- Publication number 20220283221
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220271024
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA TESTING DEVICE AND METHOD FOR HIGH FREQUENCY ANTENNAS
- Publication number 20210405102
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Chang LAI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20210280477
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mill-Jer WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SEMICONDUCTOR DEVICE TESTING
- Publication number 20210096173
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMAGNETIC SHIELDING DURING WAFER STAGE TESTING
- Publication number 20210080487
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Nen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20210063471
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT IN TESTING REGION
- Publication number 20210057293
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PROBING STRUCTURE
- Publication number 20200379013
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Mill-Jer WANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200357785
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CIRCUIT AND METHOD
- Publication number 20200355737
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Application
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENT...
- Publication number 20200348341
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Mill-Jer WANG
- G01 - MEASURING TESTING
Information Patent Application
TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE
- Publication number 20200326370
- Publication date Oct 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer WANG
- G01 - MEASURING TESTING
Information Patent Application
ALIGNMENT TESTING FOR TIERED SEMICONDUCTOR STRUCTURE
- Publication number 20200264227
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Application
TESTING APPARATUS AND TESTING METHOD
- Publication number 20200256918
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tang-Jung Chiu
- G01 - MEASURING TESTING
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT ELECTROSTATIC DISCHARGE PROTEC...
- Publication number 20200245439
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Application
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENT...
- Publication number 20190302146
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Mill-Jer WANG
- G01 - MEASURING TESTING

Mill-Jer Wang

Person

Patents Grantslast 30 patents

Antenna testing device for high frequency antennas

Semiconductor device structure with magnetic element

Method for forming probe head structure

Testing module and testing method using the same

Test circuit and method

Semiconductor structure and manufacturing method thereof

Electromagnetic shielding during wafer stage testing

Antenna testing device and method for high frequency antennas

Testing module and testing method using the same

Semiconductor device structure with magnetic element

Test probing structure

Testing module and testing method using the same

Testing holders for chip unit and die package

Test circuit and method

Testing holders for chip unit and die package

Semiconductor structure and manufacturing method thereof

System and method for semiconductor device testing

Devices for high-density probing techniques and method of implement...

Alignment testing for tiered semiconductor structure

Three dimensional integrated circuit electrostatic discharge protec...

Probe head structure of probe card and testing method

Testing apparatus and testing method

Universal test mechanism for semiconductor device

Semiconductor device structure with magnetic element in testing region

Test probing structure

Semiconductor structure and manufacturing method thereof

Test circuit and method

Devices for high-density probing techniques and method of implement...

Testing holders for chip unit and die package

Three dimensional integrated circuit electrostatic discharge protec...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...

Semiconductor Device and Method

ANTENNA TESTING DEVICE FOR HIGH FREQUENCY ANTENNAS

PROBE HEAD STRUCTURE

TESTING MODULE AND TESTING METHOD USING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INSPECTION APPARATUS AND METHOD

ANTENNA TESTING DEVICE FOR HIGH FREQUENCY ANTENNAS

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

A TESTING MODULE AND TESTING METHOD USING THE SAME

PROBE HEAD STRUCTURE AND METHOD FOR FORMING THE SAME

TESTING MODULE AND TESTING METHOD USING THE SAME

TEST CIRCUIT AND METHOD

TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ANTENNA TESTING DEVICE AND METHOD FOR HIGH FREQUENCY ANTENNAS

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

SYSTEM AND METHOD FOR SEMICONDUCTOR DEVICE TESTING

ELECTROMAGNETIC SHIELDING DURING WAFER STAGE TESTING

TESTING MODULE AND TESTING METHOD USING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT IN TESTING REGION

TEST PROBING STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

TEST CIRCUIT AND METHOD

DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENT...

TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE

ALIGNMENT TESTING FOR TIERED SEMICONDUCTOR STRUCTURE

TESTING APPARATUS AND TESTING METHOD

THREE DIMENSIONAL INTEGRATED CIRCUIT ELECTROSTATIC DISCHARGE PROTEC...

DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENT...