Min Chie Jeng

Person

Keelung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor package transmission lines with mic...
- Patent number 11,978,712
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter and capacitor using redistribution layer and micro bump layer
- Patent number 11,410,952
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,145,767
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact vertical inductors extending in vertical planes
- Patent number 10,971,296
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for integrated circuit design with on-chip variat...
- Patent number 10,860,769
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Katherine Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatus for transmission lines in packages
- Patent number 10,840,201
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter and capacitor using redistribution layer and micro bump layer
- Patent number 10,714,441
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact vertical inductors extending in vertical planes
- Patent number 10,665,380
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,629,756
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for integrated circuit design with on-chip variat...
- Patent number 10,521,538
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Katherine Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compact vertical inductors extending in vertical planes
- Patent number 10,276,295
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for transmission lines in packages
- Patent number 10,269,746
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for establishing aging model of device and analyzing aging s...
- Patent number 10,216,879
- Issue date Feb 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Shun Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Simulation scheme including self heating effect
- Patent number 10,019,545
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company
- Min-Chie Jeng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Filter and capacitor using redistribution layer and micro bump layer
- Patent number 9,960,133
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 9,923,101
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a package
- Patent number 9,653,531
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for a high-K transformer with capacitive coupling
- Patent number 9,633,940
- Issue date Apr 25, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact vertical inductors extending in vertical planes
- Patent number 9,559,053
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
4 port L-2L de-embedding method
- Patent number 9,530,705
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor
- Patent number 9,472,612
- Issue date Oct 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an inductor with magnetic material
- Patent number 9,449,917
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter and capacitor using redistribution layer and micro bump layer
- Patent number 9,449,945
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential MOSCAP device
- Patent number 9,385,246
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor
- Patent number 9,331,013
- Issue date May 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna using through-silicon via
- Patent number 9,203,146
- Issue date Dec 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatus for transmission lines in packages
- Patent number 9,171,798
- Issue date Oct 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ling Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Transmission line characterization using EM calibration
- Patent number 9,147,020
- Issue date Sep 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ying Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit device reliability simulation system
- Patent number 9,141,735
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Lin Lo
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and methods for de-embedding through substrate vias
- Patent number 9,121,891
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
- Publication number 20200335465
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compact Vertical Inductors Extending in Vertical Planes
- Publication number 20200258672
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200227572
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- HSIAO-TSUNG YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Integrated Circuit Design With On-Chip Variat...
- Publication number 20200125782
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Katherine Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Methods and Apparatus for Transmission Lines in Packages
- Publication number 20190244921
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compact Vertical Inductors Extending in Vertical Planes
- Publication number 20190228898
- Publication date Jul 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ESTABLISHING AGING MODEL OF DEVICE AND ANALYZING AGING S...
- Publication number 20190065648
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shun HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
- Publication number 20180233471
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20180204958
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- HSIAO-TSUNG YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Integrated Circuit Design With On-Chip Variat...
- Publication number 20170316138
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Katherine Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Compact Vertical Inductors Extending in Vertical Planes
- Publication number 20170140867
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
- Publication number 20160358871
- Publication date Dec 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Capacitor
- Publication number 20160197137
- Publication date Jul 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Transmission Lines in Packages
- Publication number 20160027750
- Publication date Jan 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Simulation Scheme Including Self Heating Effect
- Publication number 20150363526
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Chie Jeng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Structure And Method For A High-K Transformer With Capacitive Coupling
- Publication number 20150325517
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductor With Magnetic Material
- Publication number 20150255391
- Publication date Sep 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL MOSCAP DEVICE
- Publication number 20150123244
- Publication date May 7, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING A PACKAGE
- Publication number 20150031184
- Publication date Jan 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for De-Embedding Through Substrate Vias
- Publication number 20140327005
- Publication date Nov 6, 2014
- Hsiao-Tsung Yen
- G01 - MEASURING TESTING
Information Patent Application
4 Port L-2L De-Embedding Method
- Publication number 20140278197
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Hsiao-Tsung Yen
- G01 - MEASURING TESTING
Information Patent Application
Inductor With Magnetic Material
- Publication number 20140264734
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Capacitor
- Publication number 20140264742
- Publication date Sep 18, 2014
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission Line Formed Adjacent Seal Ring
- Publication number 20140264745
- Publication date Sep 18, 2014
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
- Publication number 20140252548
- Publication date Sep 11, 2014
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELICAL SPIRAL INDUCTOR BETWEEN STACKING DIE
- Publication number 20140217546
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Transmission Lines in Packages
- Publication number 20140211438
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Inductors and Transformers in Packages
- Publication number 20140203397
- Publication date Jul 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA USING THROUGH-SILICON VIA
- Publication number 20140152512
- Publication date Jun 5, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung YEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIFFERENTIAL MOSCAP DEVICE
- Publication number 20140117501
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS

Min Chie Jeng

Person

Patents Grantslast 30 patents

Method of forming semiconductor package transmission lines with mic...

Filter and capacitor using redistribution layer and micro bump layer

Semiconductor structure

Compact vertical inductors extending in vertical planes

Method and system for integrated circuit design with on-chip variat...

Methods and apparatus for transmission lines in packages

Filter and capacitor using redistribution layer and micro bump layer

Compact vertical inductors extending in vertical planes

Semiconductor structure

Method and system for integrated circuit design with on-chip variat...

Compact vertical inductors extending in vertical planes

Methods and apparatus for transmission lines in packages

Method for establishing aging model of device and analyzing aging s...

Simulation scheme including self heating effect

Filter and capacitor using redistribution layer and micro bump layer

Semiconductor structure

Methods of manufacturing a package

Structure and method for a high-K transformer with capacitive coupling

Compact vertical inductors extending in vertical planes

4 port L-2L de-embedding method

Integrated capacitor

Method of forming an inductor with magnetic material

Filter and capacitor using redistribution layer and micro bump layer

Differential MOSCAP device

Integrated capacitor

Antenna using through-silicon via

Methods and apparatus for transmission lines in packages

Transmission line characterization using EM calibration

Circuit device reliability simulation system

Apparatus and methods for de-embedding through substrate vias

Patents Applicationslast 30 patents

Filter and Capacitor Using Redistribution Layer and Micro Bump Layer

Compact Vertical Inductors Extending in Vertical Planes

SEMICONDUCTOR STRUCTURE

Method and System for Integrated Circuit Design With On-Chip Variat...

Methods and Apparatus for Transmission Lines in Packages

Compact Vertical Inductors Extending in Vertical Planes

METHOD FOR ESTABLISHING AGING MODEL OF DEVICE AND ANALYZING AGING S...

Filter and Capacitor Using Redistribution Layer and Micro Bump Layer

SEMICONDUCTOR STRUCTURE

Method and System for Integrated Circuit Design With On-Chip Variat...

Compact Vertical Inductors Extending in Vertical Planes

Filter and Capacitor Using Redistribution Layer and Micro Bump Layer

Integrated Capacitor

Methods and Apparatus for Transmission Lines in Packages

Simulation Scheme Including Self Heating Effect

Structure And Method For A High-K Transformer With Capacitive Coupling

Inductor With Magnetic Material

DIFFERENTIAL MOSCAP DEVICE

METHODS OF MANUFACTURING A PACKAGE

Apparatus and Methods for De-Embedding Through Substrate Vias

4 Port L-2L De-Embedding Method

Inductor With Magnetic Material

Integrated Capacitor

Transmission Line Formed Adjacent Seal Ring

Filter and Capacitor Using Redistribution Layer and Micro Bump Layer

HELICAL SPIRAL INDUCTOR BETWEEN STACKING DIE

Methods and Apparatus for Transmission Lines in Packages

Methods and Apparatus for Inductors and Transformers in Packages

ANTENNA USING THROUGH-SILICON VIA

DIFFERENTIAL MOSCAP DEVICE