Min-Ho O

Person

Daegu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package embedded in substrate, system including the s...
- Patent number 7,888,785
- Issue date Feb 15, 2011
- Samsung Electronics Co., Ltd.
- Eun-Chul Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package using chip-embedded interposer substrate
- Patent number 7,626,254
- Issue date Dec 1, 2009
- Samsung Electronics Co., Ltd.
- Min-Ho O
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITION, ANTI-OXIDE FILM INCLUDING THE SAME, ELECTRONIC COMPONE...
- Publication number 20140048318
- Publication date Feb 20, 2014
- Samsung Electronics Co., Ltd.
- Jung Seok HAHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composition, anti-oxide film including the same, electronic compone...
- Publication number 20090197090
- Publication date Aug 6, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Jung Seok Hahn
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090115069
- Publication date May 7, 2009
- Samsung Electronics Co., Ltd.
- Young-Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package embedded in substrate, system including the s...
- Publication number 20090065920
- Publication date Mar 12, 2009
- Eun-Chul Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR PACKAGE INCLUDING SEMICON...
- Publication number 20080308935
- Publication date Dec 18, 2008
- Samsung Electronics Co., Ltd.
- Young-Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CHIP-EMBEDDED INTERPOSER SUBSTRATE
- Publication number 20080283996
- Publication date Nov 20, 2008
- Samsung Electronics Co., Ltd.
- Min-Ho O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE
- Publication number 20080265432
- Publication date Oct 30, 2008
- Samsung Electronics Co., Ltd.
- Min-Ho O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BO...
- Publication number 20080124547
- Publication date May 29, 2008
- Samsung Electronics Co., Ltd.
- Min-Ho O
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package embedded in substrate, system including the s...

Semiconductor package using chip-embedded interposer substrate

Patents Applicationslast 30 patents

COMPOSITION, ANTI-OXIDE FILM INCLUDING THE SAME, ELECTRONIC COMPONE...

Composition, anti-oxide film including the same, electronic compone...

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package embedded in substrate, system including the s...

SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR PACKAGE INCLUDING SEMICON...

SEMICONDUCTOR PACKAGE USING CHIP-EMBEDDED INTERPOSER SUBSTRATE

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE

PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BO...