Min Suet Lim

Person

Simpang Ampat, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic interference shielding enclosure with thermal condu...
- Patent number 12,167,530
- Issue date Dec 10, 2024
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible vapor chamber with shape memory material
- Patent number 12,146,476
- Issue date Nov 19, 2024
- Intel Corporation
- Jeff Ku
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Grant
Computer-assisted or autonomous driving assisted by roadway navigat...
- Patent number 12,066,833
- Issue date Aug 20, 2024
- Intel Corporation
- Rajashree Baskaran
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device and crosstalk mitigating substrate
- Patent number 12,033,953
- Issue date Jul 9, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with flexible portion
- Patent number 11,942,412
- Issue date Mar 26, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-use package architecture
- Patent number 11,929,295
- Issue date Mar 12, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die stacks with power management
- Patent number 11,822,410
- Issue date Nov 21, 2023
- Intel Corporation
- Rajashree Baskaran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and apparatuses for implementing a pad on solder mask (POSM...
- Patent number 11,823,994
- Issue date Nov 21, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for signal integrity protection technique
- Patent number 11,798,894
- Issue date Oct 24, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to improve data training of a machine learnin...
- Patent number 11,710,029
- Issue date Jul 25, 2023
- Intel Corporation
- Kooi Chi Ooi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wrappable EMI shields
- Patent number 11,699,664
- Issue date Jul 11, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical embedded component in a printed circuit board blind hole
- Patent number 11,696,409
- Issue date Jul 4, 2023
- Intel Corporation
- Tin Poay Chuah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reverse-bridge multi-die interconnect for integrated-circuit packages
- Patent number 11,664,317
- Issue date May 30, 2023
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFI free picture frame metal stiffener
- Patent number 11,658,127
- Issue date May 23, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disaggregated die interconnection with on-silicon cavity bridge
- Patent number 11,652,057
- Issue date May 16, 2023
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-hinge for an electronic device
- Patent number 11,639,623
- Issue date May 2, 2023
- Intel Corporation
- Bok Eng Cheah
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Integrated voltage regulator for high performance devices
- Patent number 11,596,052
- Issue date Feb 28, 2023
- Intel Corporation
- Wei Cheang Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package dual connector
- Patent number 11,589,460
- Issue date Feb 21, 2023
- Intel Corporation
- Tin Poay Chuah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device package on package (POP)
- Patent number 11,587,844
- Issue date Feb 21, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for allocating a workload to an accelerator u...
- Patent number 11,586,473
- Issue date Feb 21, 2023
- Intel Corporation
- Divya Vijayaraghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Diagonal printed circuit boards systems
- Patent number 11,556,157
- Issue date Jan 17, 2023
- Intel Corporation
- Min Suet Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Slot antenna on a printed circuit board (PCB)
- Patent number 11,552,403
- Issue date Jan 10, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination stiffener and capacitor
- Patent number 11,538,633
- Issue date Dec 27, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated docking station for different mobile devices
- Patent number 11,487,326
- Issue date Nov 1, 2022
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System for dual displays
- Patent number 11,481,001
- Issue date Oct 25, 2022
- Intel Corporation
- Chee Chun Yee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chassis interconnect for an electronic device
- Patent number 11,445,608
- Issue date Sep 13, 2022
- Intel Corporation
- Chee How Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating-bridge interconnects and methods of assembling same
- Patent number 11,393,760
- Issue date Jul 19, 2022
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die packages with efficient memory storage
- Patent number 11,348,909
- Issue date May 31, 2022
- Intel Corporation
- Maruti Gupta Hyde
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked scalable voltage regulator module for platform area miniatu...
- Patent number 11,343,906
- Issue date May 24, 2022
- Intel Corporation
- Tai Loong Wong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-die stacks with power management
- Patent number 11,320,883
- Issue date May 3, 2022
- Intel Corporation
- Rajashree Baskaran
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DEFLECTION SPRING COMPRESSION MOUNTING
- Publication number 20250008661
- Publication date Jan 2, 2025
- Intel Corporation
- Arturo Navarro Alvarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FAN MODULES FOR ELECTRONIC DEVICES
- Publication number 20250008685
- Publication date Jan 2, 2025
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL MANAGEMENT SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS
- Publication number 20250008680
- Publication date Jan 2, 2025
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REMOVABLE FAN CARTRIDGES FOR ELECTRONIC DEVICES
- Publication number 20240397662
- Publication date Nov 28, 2024
- Intel Corporation
- Jeff Ku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIR...
- Publication number 20240334600
- Publication date Oct 3, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION
- Publication number 20240332251
- Publication date Oct 3, 2024
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HINGES FOR ELECTRONIC DEVICES
- Publication number 20240310881
- Publication date Sep 19, 2024
- Intel Corporation
- Jeffrey Ho
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240314921
- Publication date Sep 19, 2024
- Intel Corporation
- Jeff Ku
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240312869
- Publication date Sep 19, 2024
- Intel Corporation
- Tongyan Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMICALLY CONTROLLING ELECTRONIC DEVICE OPEN AIR PATIO (OAR) USIN...
- Publication number 20240244772
- Publication date Jul 18, 2024
- Intel Corporation
- Smit Kapila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI DEVICE MEDIA MANAGEMENT
- Publication number 20240241730
- Publication date Jul 18, 2024
- Intel Corporation
- ABHISHEK SRIVASTAV
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240234234
- Publication date Jul 11, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
- Publication number 20240234303
- Publication date Jul 11, 2024
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY
- Publication number 20240186206
- Publication date Jun 6, 2024
- Intel Corporation
- Satish PRATHABAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240136243
- Publication date Apr 25, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
- Publication number 20240136279
- Publication date Apr 25, 2024
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC SWITCH FOR MEMORY DEVICES
- Publication number 20240028531
- Publication date Jan 25, 2024
- Intel Corporation
- John R. DREW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES
- Publication number 20240006338
- Publication date Jan 4, 2024
- Intel Corporation
- Poh Boon KHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD TO REDUCE SUBSTRATE ELECTROMAGNETIC INTERFERENCE AND WARPAGE
- Publication number 20240006336
- Publication date Jan 4, 2024
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE
- Publication number 20230420354
- Publication date Dec 28, 2023
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SE...
- Publication number 20230420350
- Publication date Dec 28, 2023
- Intel Corporation
- Kavitha NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE
- Publication number 20230420384
- Publication date Dec 28, 2023
- Intel Corporation
- Kavitha NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE
- Publication number 20230420342
- Publication date Dec 28, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES
- Publication number 20230420345
- Publication date Dec 28, 2023
- Intel Corporation
- Kavitha NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-ORIENTATION DISPLAY DEVICE
- Publication number 20230409084
- Publication date Dec 21, 2023
- Intel Corporation
- Chee Chun Yee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY ON PACKAGE (MOP) ARCHITECTURE
- Publication number 20230395576
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS
- Publication number 20230395480
- Publication date Dec 7, 2023
- Intel Corporation
- Tin Poay Chuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON PACKAGE INTERCONNECT ARCHITECTURE FOR HIGH-SPEED MEMORY
- Publication number 20230395493
- Publication date Dec 7, 2023
- Intel Corporation
- Jooi Wah WONG
- G11 - INFORMATION STORAGE
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
- Publication number 20230397333
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Min Suet Lim

Person

Patents Grantslast 30 patents

Electromagnetic interference shielding enclosure with thermal condu...

Flexible vapor chamber with shape memory material

Computer-assisted or autonomous driving assisted by roadway navigat...

Electronic device and crosstalk mitigating substrate

Interposer with flexible portion

Multi-use package architecture

Multi-die stacks with power management

Systems and apparatuses for implementing a pad on solder mask (POSM...

Devices and methods for signal integrity protection technique

Methods and apparatus to improve data training of a machine learnin...

Wrappable EMI shields

Vertical embedded component in a printed circuit board blind hole

Reverse-bridge multi-die interconnect for integrated-circuit packages

RFI free picture frame metal stiffener

Disaggregated die interconnection with on-silicon cavity bridge

Micro-hinge for an electronic device

Integrated voltage regulator for high performance devices

System in package dual connector

Electronic device package on package (POP)

Methods and apparatus for allocating a workload to an accelerator u...

Diagonal printed circuit boards systems

Slot antenna on a printed circuit board (PCB)

Combination stiffener and capacitor

Elevated docking station for different mobile devices

System for dual displays

Chassis interconnect for an electronic device

Floating-bridge interconnects and methods of assembling same

Multi-die packages with efficient memory storage

Stacked scalable voltage regulator module for platform area miniatu...

Multi-die stacks with power management

Patents Applicationslast 30 patents

DEFLECTION SPRING COMPRESSION MOUNTING

FAN MODULES FOR ELECTRONIC DEVICES

THERMAL MANAGEMENT SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS

REMOVABLE FAN CARTRIDGES FOR ELECTRONIC DEVICES

PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIR...

DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION

HINGES FOR ELECTRONIC DEVICES

THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES

MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE

DYNAMICALLY CONTROLLING ELECTRONIC DEVICE OPEN AIR PATIO (OAR) USIN...

MULTI DEVICE MEDIA MANAGEMENT

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

INTEGRATED INDUCTOR OVER TRANSISTOR LAYER

INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

INTEGRATED INDUCTOR OVER TRANSISTOR LAYER

DYNAMIC SWITCH FOR MEMORY DEVICES

SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES

SHIELD TO REDUCE SUBSTRATE ELECTROMAGNETIC INTERFERENCE AND WARPAGE

ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE

HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SE...

SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE

ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE

COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES

MULTI-ORIENTATION DISPLAY DEVICE

MEMORY ON PACKAGE (MOP) ARCHITECTURE

SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS

ON PACKAGE INTERCONNECT ARCHITECTURE FOR HIGH-SPEED MEMORY

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT