Ming-Chih Yew

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating semiconductor package
- Patent number 12,132,021
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device package having dummy...
- Patent number 12,125,822
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,113,033
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,100,666
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with curved conductive lines and method of for...
- Patent number 12,100,664
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing package using reinforcing patches
- Patent number 12,094,810
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with multiple gap-filling layers and fabrica...
- Patent number 12,057,363
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including intra-die structural reinforcement str...
- Patent number 12,040,267
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with reinforcing str...
- Patent number 12,040,285
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 12,033,947
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,033,928
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,021,045
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,014,969
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with buffer layer embedded in lid layer
- Patent number 12,009,278
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal bonding pads for underfill application in semiconductor...
- Patent number 11,997,842
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,984,381
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for molding compound crack suppression in semico...
- Patent number 11,908,757
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive patterns of redistribution...
- Patent number 11,862,549
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,855,004
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 11,854,837
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization structure and package structure
- Patent number 11,830,800
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,784,148
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with warpage control structure
- Patent number 11,764,169
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,756,873
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with curved conductive lines and method of for...
- Patent number 11,749,644
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package having stress release structure
- Patent number 11,742,322
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing package using reinforcing patches
- Patent number 11,728,256
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,728,284
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,721,643
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387472
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240387335
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240387405
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...
- Publication number 20240381605
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20240379496
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379577
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES
- Publication number 20240371829
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...
- Publication number 20240371783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reinforcing Package Using Reinforcing Patches
- Publication number 20240363511
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...
- Publication number 20240347407
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240332197
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCING STRUCTURES
- Publication number 20240332214
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT A...
- Publication number 20240321758
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Min-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...
- Publication number 20240321717
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312887
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240304572
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240297089
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER
- Publication number 20240290682
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240258193
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240096822
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PA...
- Publication number 20240088095
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-PIECE TYPE STIFFENER STRUCTURE WITH BEVELED SURFACE FOR DELAMIN...
- Publication number 20240071949
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240063208
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014180
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STRESS BUFFERS AND METHODS OF FORMI...
- Publication number 20240006340
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20230402402
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER STRUCTURE WITH BEVELED SIDEWALL FOR FOOTPRINT REDUCTION A...
- Publication number 20230402404
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE NON-ACTIVE DIES IN A MULTI-DIE PACKAGE
- Publication number 20230395563
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Chih Yew

Person

Patents Grantslast 30 patents

Method for fabricating semiconductor package

Method of manufacturing a semiconductor device package having dummy...

Chip package structure

Method for forming chip package structure

Semiconductor device with curved conductive lines and method of for...

Reinforcing package using reinforcing patches

Chip package structure with multiple gap-filling layers and fabrica...

Organic interposer including intra-die structural reinforcement str...

Structure and formation method of chip package with reinforcing str...

Semiconductor package structure and method for forming the same

Manufacturing method of semiconductor package

Semiconductor package with stress reduction design and method for f...

Semiconductor device and method of manufacture

Package structure and method for forming the same

Package structure with buffer layer embedded in lid layer

Dummy metal bonding pads for underfill application in semiconductor...

Semiconductor package structure and method for forming the same

Die corner removal for molding compound crack suppression in semico...

Semiconductor packages having conductive patterns of redistribution...

Package structure

Semiconductor devices and methods of manufacturing

Metallization structure and package structure

Semiconductor package

Semiconductor device package with warpage control structure

Semiconductor package and manufacturing method thereof

Semiconductor device with curved conductive lines and method of for...

Integrated fan-out package having stress release structure

Reinforcing package using reinforcing patches

Chip package structure and method for forming the same

Package structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

CHIP PACKAGE STRUCTURE

DUMMY METAL BONDING PADS FOR UNDERFILL APPLICATION IN SEMICONDUCTOR...

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE HAVING DUMMY DIES

SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...

Reinforcing Package Using Reinforcing Patches

METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE WITH REINFORCING STRUCTURES

DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT A...

ORGANIC INTERPOSER INCLUDING INTRA-DIE STRUCTURAL REINFORCEMENT STR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER

METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE

FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PA...

TWO-PIECE TYPE STIFFENER STRUCTURE WITH BEVELED SURFACE FOR DELAMIN...

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING STRESS BUFFERS AND METHODS OF FORMI...

Semiconductor Package and Method

STIFFENER STRUCTURE WITH BEVELED SIDEWALL FOR FOOTPRINT REDUCTION A...

MULTIPLE NON-ACTIVE DIES IN A MULTI-DIE PACKAGE