Ming-Chung Sung

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package structure and methods for forming the same
- Patent number 9,985,013
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure and methods for forming the same
- Patent number 9,165,876
- Issue date Oct 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotating curing
- Patent number 9,147,584
- Issue date Sep 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing Ruei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Looped interconnect structure
- Patent number 8,927,877
- Issue date Jan 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-An Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 8,823,180
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming uniform rigid interconnect structures
- Patent number 8,796,132
- Issue date Aug 5, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for alignment in flip chip bonding
- Patent number 8,664,039
- Issue date Mar 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for die assembly
- Patent number 8,652,939
- Issue date Feb 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for wafer-level flip-chip assembly
- Patent number 8,232,183
- Issue date Jul 31, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level flip-chip assembly methods
- Patent number 7,977,155
- Issue date Jul 12, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Performing die-to-wafer stacking by filling gaps between dies
- Patent number 7,951,647
- Issue date May 31, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chip comprising an integrated circuit chip a...
- Patent number 7,642,631
- Issue date Jan 5, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cutting integrated circuit chips from wafer by ablating w...
- Patent number 7,265,034
- Issue date Sep 4, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package-on-Package Structure and Methods for Forming the Same
- Publication number 20160013175
- Publication date Jan 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure and Methods for Forming the Same
- Publication number 20140252609
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Looped Interconnect Structure
- Publication number 20140041918
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-An Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Forming Uniform Rigid Interconnect Structures
- Publication number 20140004660
- Publication date Jan 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20130168856
- Publication date Jul 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rotating Curing
- Publication number 20130119565
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing Ruei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus For Alignment In Flip Chip Bonding
- Publication number 20130095607
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Die Assembly
- Publication number 20130093094
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Performing Die-to-Wafer Stacking by Filling Gaps Between Dies
- Publication number 20090311829
- Publication date Dec 17, 2009
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and apparatus for wafer-level flip-chip assembly
- Publication number 20080274592
- Publication date Nov 6, 2008
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level flip-chip assembly methods
- Publication number 20080274589
- Publication date Nov 6, 2008
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Chip Comprising An Integrated Circuit Chip A...
- Publication number 20070257365
- Publication date Nov 8, 2007
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of cutting integrated circuit chips from wafer by ablating w...
- Publication number 20060189099
- Publication date Aug 24, 2006
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip scale package and method of fabricating the same
- Publication number 20030071354
- Publication date Apr 17, 2003
- Chin-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Chung Sung

Person

Patents Grantslast 30 patents

Package-on-package structure and methods for forming the same

Package-on-package structure and methods for forming the same

Rotating curing

Looped interconnect structure

Package on package devices and methods of packaging semiconductor dies

System and method for forming uniform rigid interconnect structures

Methods and apparatus for alignment in flip chip bonding

Method and apparatus for die assembly

Process and apparatus for wafer-level flip-chip assembly

Wafer-level flip-chip assembly methods

Performing die-to-wafer stacking by filling gaps between dies

Packaged semiconductor chip comprising an integrated circuit chip a...

Method of cutting integrated circuit chips from wafer by ablating w...

Patents Applicationslast 30 patents

Package-on-Package Structure and Methods for Forming the Same

Package-on-Package Structure and Methods for Forming the Same

Looped Interconnect Structure

System and Method for Forming Uniform Rigid Interconnect Structures

Package on Package Devices and Methods of Packaging Semiconductor Dies

Rotating Curing

Methods and Apparatus For Alignment In Flip Chip Bonding

Method and Apparatus for Die Assembly

Performing Die-to-Wafer Stacking by Filling Gaps Between Dies

Process and apparatus for wafer-level flip-chip assembly

Wafer-level flip-chip assembly methods

Packaged Semiconductor Chip Comprising An Integrated Circuit Chip A...

Method of cutting integrated circuit chips from wafer by ablating w...

Wafer level chip scale package and method of fabricating the same