Ming-En Ho

Person

New Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Heat equalization plate
- Patent number 12,369,275
- Issue date Jul 22, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit package and method
- Patent number 12,347,791
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,341,072
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illumination image sensor and method of manufacturing the...
- Patent number 12,336,313
- Issue date Jun 17, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chih-Ping Chung
Information Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
- Patent number 12,322,682
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,288,729
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated image sensor and manufacturing method thereof
- Patent number 12,284,837
- Issue date Apr 22, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Jun-Ming Su
Information Patent Grant
Semiconductor package
- Patent number 12,191,203
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,183,691
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,131,986
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out (InFO) package structure
- Patent number 12,094,830
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method thereof
- Patent number 12,094,905
- Issue date Sep 17, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Chih-Ping Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covering film, and circuit board and manufacturing method
- Patent number 12,048,084
- Issue date Jul 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside illuminated image sensor and manufacturing method therefore
- Patent number 12,040,343
- Issue date Jul 16, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Jun-Ming Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 11,991,838
- Issue date May 21, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with heat dissipation structure and method for manufa...
- Patent number 11,979,977
- Issue date May 7, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fastener and housing device including the fastener
- Patent number 11,953,052
- Issue date Apr 9, 2024
- Pegatron Corporation
- Jian-Hua Chen
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package and method
- Patent number 11,935,804
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and method for manufacturing the same
- Patent number 11,902,644
- Issue date Feb 13, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Jun Dai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,901,230
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit package including an integra...
- Patent number 11,842,955
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,823,981
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and display method
- Patent number 11,775,063
- Issue date Oct 3, 2023
- AmTRAN TECHNOLOGY Co., Ltd
- Ming Che Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board with embedded electronic component and method for man...
- Patent number 11,778,752
- Issue date Oct 3, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR PREDICTING COLLISION DETECTION OF MOVING PATH...
- Publication number 20250181052
- Publication date Jun 5, 2025
- Industrial Technology Research Institute
- CHAO-CHUANG MAI
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD FOR MACHINE LEARNING MODEL VERIFICATION AND TRANSACTION
- Publication number 20250165967
- Publication date May 22, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Yu Te KU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPERANT, COMPOSITION, AND PRESSURE-SENSITIVE FILM
- Publication number 20250122400
- Publication date Apr 17, 2025
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250096044
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPERATING SYSTEM AND METHOD OF A FULLY HOMOMORPHIC ENCRYPTION NEURA...
- Publication number 20250086437
- Publication date Mar 13, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Tzu-Li LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250079341
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379519
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240371778
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240290815
- Publication date Aug 29, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Jun-Ming Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREDICTING ETCHING RECIPE AND SYSTEM THEREOF
- Publication number 20240281676
- Publication date Aug 22, 2024
- United Microelectronics Corp.
- Ming-I HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240250036
- Publication date Jul 25, 2024
- TAIWAN SEMICODUCTOR MANUFACTURING CO., LTD.
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240203899
- Publication date Jun 20, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURI...
- Publication number 20240194495
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240178091
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOL MACHINING LOAD MONITORING METHOD
- Publication number 20240173812
- Publication date May 30, 2024
- Industrial Technology Research Institute
- MING-CHUN HO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACK SIDE ILLUMINATION IMAGE SENSOR AND METHOD OF MANUFACTURING THE...
- Publication number 20240170526
- Publication date May 23, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Chih-Ping Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128122
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240130050
- Publication date Apr 18, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...
- Publication number 20240096849
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CMOS IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240072083
- Publication date Feb 29, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Chih-Ping Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063101
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING COMPOSITE SEED-BARRIER LAYER AND METHO...
- Publication number 20240047308
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL ASSEMBLY METHOD FOR PERMANENT MAGNET MOTOR
- Publication number 20240014716
- Publication date Jan 11, 2024
- TECO Electric & Machinery Co., Ltd.
- Lian-Shin HUNG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRESSURE SENSOR, PRESSURE-SENSITIVE CIRCUIT BOARD, AND MANUFACTURIN...
- Publication number 20230408349
- Publication date Dec 21, 2023
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- G01 - MEASURING TESTING
Information Patent Application
DISPLAY DEVICE AND DISPLAY METHOD
- Publication number 20230288984
- Publication date Sep 14, 2023
- AmTRAN TECHNOLOGY CO., LTD
- Ming Che HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260885
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20230245939
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Heat equalization plate

Integrated circuit package and method

Manufacturing method of semiconductor package

Back side illumination image sensor and method of manufacturing the...

Semiconductor package having composite seed-barrier layer and metho...

Package structure and method of fabricating the same

Integrated circuit package and method

Backside illuminated image sensor and manufacturing method thereof

Semiconductor package

Semiconductor structure and method of forming the same

Manufacturing method of semiconductor package

Embedded circuit board and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Integrated fan-out (InFO) package structure

Image sensor and manufacturing method thereof

Covering film, and circuit board and manufacturing method

Backside illuminated image sensor and manufacturing method therefore

Embedded circuit board and manufacturing method thereof

Circuit board with heat dissipation structure and method for manufa...

Fastener and housing device including the fastener

Semiconductor package and method

Circuit board for transmitting high-frequency signal and method for...

Integrated circuit package and method

Camera module and method for manufacturing the same

Semiconductor package and manufacturing method thereof

Semiconductor device and method

Method of making an integrated circuit package including an integra...

Semiconductor package and manufacturing method thereof

Display device and display method

Circuit board with embedded electronic component and method for man...

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR PREDICTING COLLISION DETECTION OF MOVING PATH...

METHOD FOR MACHINE LEARNING MODEL VERIFICATION AND TRANSACTION

DISPERANT, COMPOSITION, AND PRESSURE-SENSITIVE FILM

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

OPERATING SYSTEM AND METHOD OF A FULLY HOMOMORPHIC ENCRYPTION NEURA...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

Circuit board

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

BACKSIDE ILLUMINATED IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

METHOD FOR PREDICTING ETCHING RECIPE AND SYSTEM THEREOF

SEMICONDUCTOR PACKAGE AND METHOD

SYSTEM-IN-PACKAGE MODULE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURI...

Integrated Circuit Package and Method

TOOL MACHINING LOAD MONITORING METHOD

BACK SIDE ILLUMINATION IMAGE SENSOR AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR PACKAGE

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...

3D CMOS IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING COMPOSITE SEED-BARRIER LAYER AND METHO...

HORIZONTAL ASSEMBLY METHOD FOR PERMANENT MAGNET MOTOR

PRESSURE SENSOR, PRESSURE-SENSITIVE CIRCUIT BOARD, AND MANUFACTURIN...

DISPLAY DEVICE AND DISPLAY METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Package and Method