Ming Fang

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Technique to prevent tin contamination of mirrors and electrodes in...
- Patent number 7,567,379
- Issue date Jul 28, 2009
- Intel Corporation
- Robert Bristol
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for constructing contact formations
- Patent number 7,442,634
- Issue date Oct 28, 2008
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a barrier layer in interconnect joints and structures forme...
- Patent number 7,416,980
- Issue date Aug 26, 2008
- Intel Corporation
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping copper bumps
- Patent number 7,391,112
- Issue date Jun 24, 2008
- Intel Corporation
- Jianxing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin deposition
- Patent number 7,314,543
- Issue date Jan 1, 2008
- Intel Corporation
- Ming Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large bumps for optical flip chips
- Patent number 7,279,720
- Issue date Oct 9, 2007
- Intel Corporation
- Ming Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under bump metallization layer to enable use of high tin content so...
- Patent number 7,064,446
- Issue date Jun 20, 2006
- Intel Corporation
- John P. Barnak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for filling interlayer vias on ferroelectric p...
- Patent number 7,001,782
- Issue date Feb 21, 2006
- Intel Corporation
- Daniel C. Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large bumps for optical flip chips
- Patent number 6,933,171
- Issue date Aug 23, 2005
- Intel Corporation
- Ming Fang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of corrosion prevention and cleaning of copper structures
- Publication number 20080152812
- Publication date Jun 26, 2008
- Ming Fang
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
FORMING A BARRIER LAYER IN JOINT STRUCTURES
- Publication number 20070123025
- Publication date May 31, 2007
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cleaning liquid and cleaning method
- Publication number 20070099810
- Publication date May 3, 2007
- Hiroshi Matsunaga
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Capping copper bumps
- Publication number 20060276022
- Publication date Dec 7, 2006
- Jianxing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a barrier layer in interconnect joints and structures forme...
- Publication number 20060205234
- Publication date Sep 14, 2006
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-oxidized protective layer for lithography
- Publication number 20060175616
- Publication date Aug 10, 2006
- Manish Chandhok
- G02 - OPTICS
Information Patent Application
Method for constructing contact formations
- Publication number 20060134902
- Publication date Jun 22, 2006
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Forming a capping layer for a EUV mask and structures formed thereby
- Publication number 20060127780
- Publication date Jun 15, 2006
- Manish Chandhok
- B82 - NANO-TECHNOLOGY
Information Patent Application
Compliant interconnect and method of formation
- Publication number 20050277281
- Publication date Dec 15, 2005
- Valery M. Dubin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Under bump metallization layer to enable use of high tin content so...
- Publication number 20050250323
- Publication date Nov 10, 2005
- John P. Barnak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique to prevent tin contamination of mirrors and electrodes in...
- Publication number 20050244572
- Publication date Nov 3, 2005
- Robert Bristol
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
UNDER BUMP METALLIZATION LAYER TO ENABLE USE OF HIGH TIN CONTENT SO...
- Publication number 20050212133
- Publication date Sep 29, 2005
- John P. Barnak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Large bumps for optical flip chips
- Publication number 20050082551
- Publication date Apr 21, 2005
- Ming Fang
- G02 - OPTICS
Information Patent Application
Large bumps for optical flip chips
- Publication number 20050082552
- Publication date Apr 21, 2005
- Ming Fang
- G02 - OPTICS
Information Patent Application
Tin deposition
- Publication number 20050077082
- Publication date Apr 14, 2005
- Ming Fang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

Technique to prevent tin contamination of mirrors and electrodes in...

Method for constructing contact formations

Forming a barrier layer in interconnect joints and structures forme...

Capping copper bumps

Tin deposition

Large bumps for optical flip chips

Under bump metallization layer to enable use of high tin content so...

Method and apparatus for filling interlayer vias on ferroelectric p...

Large bumps for optical flip chips

Patents Applicationslast 30 patents

Methods of corrosion prevention and cleaning of copper structures

FORMING A BARRIER LAYER IN JOINT STRUCTURES

Cleaning liquid and cleaning method

Capping copper bumps

Forming a barrier layer in interconnect joints and structures forme...

Pre-oxidized protective layer for lithography

Method for constructing contact formations

Forming a capping layer for a EUV mask and structures formed thereby

Compliant interconnect and method of formation

Under bump metallization layer to enable use of high tin content so...

Technique to prevent tin contamination of mirrors and electrodes in...

UNDER BUMP METALLIZATION LAYER TO ENABLE USE OF HIGH TIN CONTENT SO...

Large bumps for optical flip chips

Large bumps for optical flip chips

Tin deposition