Ming-Hui Liu

Person

Yonghe City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Through-substrate via formation to enlarge electrochemical plating...
- Patent number 12,176,266
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor on insulator having a semiconductor layer with differ...
- Patent number 12,170,284
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unequal CMOS image sensor pixel size to boost quantum efficiency
- Patent number 12,159,886
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,159,870
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hung-Shu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,148,735
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backlight module and display apparatus
- Patent number 12,147,121
- Issue date Nov 19, 2024
- Nano Precision (SuZhou) CO., LTD.
- Wen-Yen Chiu
- G02 - OPTICS
Information Patent Grant
Formation of a two-layer via structure to mitigate damage to a disp...
- Patent number 12,127,421
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chang Chang
Information Patent Grant
Fan management system and method
- Patent number 12,120,843
- Issue date Oct 15, 2024
- Delta Electronics, Inc.
- Chia-Feng Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,095,464
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dielectric sidewall structure for quality improvement in Ge and SiG...
- Patent number 12,094,989
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Ming Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 12,068,313
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with absorption enhancement structure
- Patent number 12,062,727
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with increased thickness for metal pads
- Patent number 12,057,418
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Shu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
By-site-compensated etch back for local planarization/topography ad...
- Patent number 12,046,477
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for operating mirrored content under mirror mode and compute...
- Patent number 12,019,944
- Issue date Jun 25, 2024
- HTC Corporation
- Ming-Te Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flash memory structure with enhanced floating gate
- Patent number 12,022,651
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Shu Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device having composite dielectric film struct...
- Patent number 12,014,966
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source module and display device
- Patent number 12,013,564
- Issue date Jun 18, 2024
- Coretronic Corporation
- Hsin-Wei Chen
- G02 - OPTICS
Information Patent Grant
Notebook computer with flippable keyboard
- Patent number D1028971
- Issue date May 28, 2024
- Compal Electronics, Inc.
- Hsing-Yi Kao
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Bond pad structure coupled to multiple interconnect conductive\ str...
- Patent number 11,990,433
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an isolation structure having multiple thickness...
- Patent number 11,980,046
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chang Chang
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 11,948,969
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages and methods of forming the same
- Patent number 11,929,319
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage device with gate extensions
- Patent number 11,908,891
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided stacked DTC structure
- Patent number 11,869,988
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boundary design for high-voltage integration on HKMG technology
- Patent number 11,855,091
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gripper device
- Patent number 11,850,734
- Issue date Dec 26, 2023
- Hiwin Technologies Corp.
- Ming-Shiou Liu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Device with a recessed gate electrode that has high thickness unifo...
- Patent number 11,846,871
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Shu Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump bonding structure to mitigate space contamination for III-V di...
- Patent number 11,784,460
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Optical film and display device
- Publication number 20240411063
- Publication date Dec 12, 2024
- CORETRONIC CORPORATION
- CHAO-HUNG WENG
- G02 - OPTICS
Information Patent Application
OPTICAL IMAGING LENS
- Publication number 20240402466
- Publication date Dec 5, 2024
- CALIN TECHNOLOGY CO., LTD.
- SHANG-RU YANG
- G02 - OPTICS
Information Patent Application
BACKLIGHT MODULE AND DISPLAY DEVICE
- Publication number 20240402412
- Publication date Dec 5, 2024
- CORETRONIC CORPORATION
- Kuan-Wen Liu
- G02 - OPTICS
Information Patent Application
DOUBLE-SIDED STACKED DTC STRUCTURE
- Publication number 20240395948
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKLIGHT MODULE AND DISPLAY DEVICE
- Publication number 20240385363
- Publication date Nov 21, 2024
- CORETRONIC CORPORATION
- Chao-Hung Weng
- G02 - OPTICS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387454
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...
- Publication number 20240387185
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387359
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BOSCH DEEP ETCH
- Publication number 20240379373
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNEQUAL CMOS IMAGE SENSOR PIXEL SIZE TO BOOST QUANTUM EFFICIENCY
- Publication number 20240379695
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
- Publication number 20240372538
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh CHIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...
- Publication number 20240371882
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS
- Publication number 20240363563
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Shu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC SIDEWALL STRUCTURE FOR QUALITY IMPROVEMENT IN GE AND SIG...
- Publication number 20240363777
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF A TWO-LAYER VIA STRUCTURE TO MITIGATE DAMAGE TO A DISP...
- Publication number 20240357854
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chang Chang
Information Patent Application
OPTICAL ENGINE MODULE AND PROJECTION DEVICE
- Publication number 20240329509
- Publication date Oct 3, 2024
- CORETRONIC CORPORATION
- Chin-Wen Huang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHASE COMPENSATION METHOD OF BRUSHLESS DIRECT CURRENT MOTOR AND MOT...
- Publication number 20240322716
- Publication date Sep 26, 2024
- Weltrend Semiconductor Inc.
- Chien-Tsung Hung
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DUSTPROOF FRAME AND DUSTPROOF SYSTEM
- Publication number 20240297458
- Publication date Sep 5, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Ming Tsung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE HAVING COMPOSITE DIELECTRIC FILM STRUCT...
- Publication number 20240290672
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Chieh CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING METHOD OF SUPPORT ROD
- Publication number 20240239059
- Publication date Jul 18, 2024
- Hocheng Corporation
- Che-Yuan Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
POSITIONING METHOD AND PROBE SYSTEM FOR PERFORMING THE SAME, METHOD...
- Publication number 20240219427
- Publication date Jul 4, 2024
- MPI CORPORATION
- STOJAN KANEV
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
- Publication number 20240204759
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING SYSTEM FOR AN ELECTRONIC DEVICE
- Publication number 20240192739
- Publication date Jun 13, 2024
- QUANTA COMPUTER INC.
- Chao-Jung CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLASH MEMORY STRUCTURE WITH ENHANCED FLOATING GATE
- Publication number 20240147714
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Shu Huang
- G11 - INFORMATION STORAGE
Information Patent Application
IMAGE SENSOR STRUCTURE
- Publication number 20240145494
- Publication date May 2, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Ju-Sheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE DEVICE WITH GATE EXTENSIONS
- Publication number 20240136397
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE MODULE AND DISPLAY DEVICE
- Publication number 20240126003
- Publication date Apr 18, 2024
- Nano Precision Taiwan Limited
- Hsin-Wei Chen
- G02 - OPTICS
Information Patent Application
PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240120363
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chyi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOUNDARY DESIGN FOR HIGH-VOLTAGE INTEGRATION ON HKMG TECHNOLOGY
- Publication number 20240088154
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVELENGTH CONVERSION ELEMENT AND BACKLIGHT MODULE
- Publication number 20240085739
- Publication date Mar 14, 2024
- Nano Precision Taiwan Limited
- Ching-Nan Chuang
- G02 - OPTICS

Ming-Hui Liu

Person

Patents Grantslast 30 patents

Through-substrate via formation to enlarge electrochemical plating...

Semiconductor on insulator having a semiconductor layer with differ...

Unequal CMOS image sensor pixel size to boost quantum efficiency

Semiconductor structure and forming method thereof

Memory device and manufacturing method thereof

Backlight module and display apparatus

Formation of a two-layer via structure to mitigate damage to a disp...

Fan management system and method

Integrated circuit and method of forming the same

Dielectric sidewall structure for quality improvement in Ge and SiG...

Semiconductor arrangement and formation thereof

Image sensor with absorption enhancement structure

Passivation structure with increased thickness for metal pads

By-site-compensated etch back for local planarization/topography ad...

Method for operating mirrored content under mirror mode and compute...

Flash memory structure with enhanced floating gate

Semiconductor memory device having composite dielectric film struct...

Light source module and display device

Notebook computer with flippable keyboard

Bond pad structure coupled to multiple interconnect conductive\ str...

Method for forming an isolation structure having multiple thickness...

Semiconductor structure and method of manufacturing the same

Integrated fan-out packages and methods of forming the same

High voltage device with gate extensions

Methods of manufacturing a semiconductor device including a joint a...

Double-sided stacked DTC structure

Boundary design for high-voltage integration on HKMG technology

Gripper device

Device with a recessed gate electrode that has high thickness unifo...

Bump bonding structure to mitigate space contamination for III-V di...

Patents Applicationslast 30 patents

Optical film and display device

OPTICAL IMAGING LENS

BACKLIGHT MODULE AND DISPLAY DEVICE

DOUBLE-SIDED STACKED DTC STRUCTURE

BACKLIGHT MODULE AND DISPLAY DEVICE

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

HIGH ASPECT RATIO BOSCH DEEP ETCH

UNEQUAL CMOS IMAGE SENSOR PIXEL SIZE TO BOOST QUANTUM EFFICIENCY

INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME

SEMICONDUCTOR ON INSULATOR HAVING A SEMICONDUCTOR LAYER WITH DIFFER...

PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS

DIELECTRIC SIDEWALL STRUCTURE FOR QUALITY IMPROVEMENT IN GE AND SIG...

FORMATION OF A TWO-LAYER VIA STRUCTURE TO MITIGATE DAMAGE TO A DISP...

OPTICAL ENGINE MODULE AND PROJECTION DEVICE

PHASE COMPENSATION METHOD OF BRUSHLESS DIRECT CURRENT MOTOR AND MOT...

DUSTPROOF FRAME AND DUSTPROOF SYSTEM

SEMICONDUCTOR MEMORY DEVICE HAVING COMPOSITE DIELECTRIC FILM STRUCT...

MOLDING METHOD OF SUPPORT ROD

POSITIONING METHOD AND PROBE SYSTEM FOR PERFORMING THE SAME, METHOD...

INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME

MOUNTING SYSTEM FOR AN ELECTRONIC DEVICE

FLASH MEMORY STRUCTURE WITH ENHANCED FLOATING GATE

IMAGE SENSOR STRUCTURE

HIGH VOLTAGE DEVICE WITH GATE EXTENSIONS

LIGHT SOURCE MODULE AND DISPLAY DEVICE

PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME

BOUNDARY DESIGN FOR HIGH-VOLTAGE INTEGRATION ON HKMG TECHNOLOGY

WAVELENGTH CONVERSION ELEMENT AND BACKLIGHT MODULE