Ming LI

Person

Kwai Chung, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Gang bonding process for assembling a matrix of light-emitting elem...
- Patent number 10,186,549
- Issue date Jan 22, 2019
- ASM Technology Singapore Pte. Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding with liquid phase solder
- Patent number 10,014,272
- Issue date Jul 3, 2018
- ASM Technology Singapore Pte. Ltd.
- Dewen Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-enhanced provision of underfill to electronic devices usi...
- Patent number 9,583,366
- Issue date Feb 28, 2017
- ASM Technology Singapore Pte. Ltd.
- Qinglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compression bonding of semiconductor chips
- Patent number 8,967,452
- Issue date Mar 3, 2015
- ASM Technology Singapore Pte. Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad assessment for wire bonding
- Patent number 8,657,180
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Ming Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct die attach utilizing heated bond head
- Patent number 7,854,365
- Issue date Dec 21, 2010
- ASM Assembly Automation LTD
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL INTEGRATED FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20190006339
- Publication date Jan 3, 2019
- ASM Technology Singapore Pte Ltd
- Hon Shing, John LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING WITH LIQUID PHASE SOLDER
- Publication number 20160336292
- Publication date Nov 17, 2016
- ASM Technology Singapore Pte Ltd
- Dewen TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-ENHANCED PROVISION OF UNDERFILL TO ELECTRONIC DEVICES
- Publication number 20160276177
- Publication date Sep 22, 2016
- ASM Technology Singapore Pte Ltd
- Qinglong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD ASSESSMENT FOR WIRE BONDING
- Publication number 20130327812
- Publication date Dec 12, 2013
- Ming LI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS
- Publication number 20130270230
- Publication date Oct 17, 2013
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE
- Publication number 20130178002
- Publication date Jul 11, 2013
- ASM Technology Singapore Pte Ltd
- Kui Kam LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE ATTACH UTILIZING HEATED BOND HEAD
- Publication number 20100105172
- Publication date Apr 29, 2010
- Ming LI
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Gang bonding process for assembling a matrix of light-emitting elem...

Die bonding with liquid phase solder

Thermally-enhanced provision of underfill to electronic devices usi...

Thermal compression bonding of semiconductor chips

Bond pad assessment for wire bonding

Direct die attach utilizing heated bond head

Patents Applicationslast 30 patents

THREE-DIMENSIONAL INTEGRATED FAN-OUT WAFER LEVEL PACKAGE

DIE BONDING WITH LIQUID PHASE SOLDER

THERMALLY-ENHANCED PROVISION OF UNDERFILL TO ELECTRONIC DEVICES

BOND PAD ASSESSMENT FOR WIRE BONDING

THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS

METHOD AND APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE

DIRECT DIE ATTACH UTILIZING HEATED BOND HEAD