Ming M. Li

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 11,557,722
- Issue date Jan 17, 2023
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded coil assembly and method of making
- Patent number 10,978,239
- Issue date Apr 13, 2021
- Texas Instruments Incorporated
- Haiying Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 10,892,405
- Issue date Jan 12, 2021
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded coil assembly and method of making
- Patent number 10,854,370
- Issue date Dec 1, 2020
- Texas Instruments Incorporated
- Haiying Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Embedded coil assembly and production method
- Patent number 10,256,027
- Issue date Apr 9, 2019
- Texas Instruments Incorporated
- Haiying Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded coil assembly and method of making
- Patent number 9,824,811
- Issue date Nov 21, 2017
- Texas Instruments Incorporated
- Haiying Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming controlled voids in interlevel dielectric
- Patent number 5,960,311
- Issue date Sep 28, 1999
- STMicroelectronics, Inc.
- Abha R. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming controlled voids in interlevel dielectric
- Patent number 5,847,464
- Issue date Dec 8, 1998
- SGS-Thomson Microelectronics, Inc.
- Abha R. Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH
- Publication number 20210159403
- Publication date May 27, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH
- Publication number 20200357987
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Ming Li
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDED COIL ASSEMBLY AND METHOD OF MAKING
- Publication number 20180336994
- Publication date Nov 22, 2018
- Haiying Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY ANTENNA STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND...
- Publication number 20170347490
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED COIL ASSEMBLY AND METHOD OF MAKING
- Publication number 20170294263
- Publication date Oct 12, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Haiying Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COIL ASSEMBLY AND METHOD OF MAKING
- Publication number 20160181003
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Haiying Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COIL ASSEMBLY AND PRODUCTION METHOD
- Publication number 20160181004
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Haiying Li
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Hall-effect sensor package with added current path

Embedded coil assembly and method of making

Hall-effect sensor package with added current path

Embedded coil assembly and method of making

Embedded coil assembly and production method

Embedded coil assembly and method of making

Method for forming controlled voids in interlevel dielectric

Method for forming controlled voids in interlevel dielectric

Patents Applicationslast 30 patents

HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH

HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH

EMBEDDED COIL ASSEMBLY AND METHOD OF MAKING

HIGH-FREQUENCY ANTENNA STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND...

EMBEDDED COIL ASSEMBLY AND METHOD OF MAKING

EMBEDDED COIL ASSEMBLY AND METHOD OF MAKING

EMBEDDED COIL ASSEMBLY AND PRODUCTION METHOD