Ming-Shi Yeh

Person

Chang-Hua, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Hearing compensation device and hearing compensation method
- Patent number 11,985,481
- Issue date May 14, 2024
- REHEAR AUDIOLOGY COMPANY LTD.
- Ying-Hui Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fin field-effect transistor device and method of forming the same
- Patent number 11,978,801
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,972,982
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric substrate including a trench
- Patent number 11,961,796
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,935,836
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emergency response containment vessel for cylinder
- Patent number 11,927,310
- Issue date Mar 12, 2024
- LINDE LIENHWA INDUSTRIAL GASES CO., LTD.
- Ming-Hui Yeh
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Grant
Fin field-effect transistor and method of forming the same
- Patent number 11,923,428
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chi Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-protective layer formed on high-K dielectric layer
- Patent number 11,923,201
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ju-Li Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling fin-thinning through feedback
- Patent number 11,923,437
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with semiconductor devices and method...
- Patent number 11,916,075
- Issue date Feb 27, 2024
- United Microelectronics Corp.
- Wei-Lun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor and method of forming the same
- Patent number 11,901,441
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emergency response containment vessel
- Patent number 11,897,667
- Issue date Feb 13, 2024
- LINDE LIENHWA INDUSTRIAL GASES CO., LTD.
- Ming-Hui Yeh
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of breaking through etch stop layer
- Patent number 11,901,180
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Luminous touch pad module
- Patent number 11,861,079
- Issue date Jan 2, 2024
- Primax Electronics Ltd.
- Ming-Hui Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 11,854,816
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device and method of forming the same
- Patent number 11,855,193
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structure for integrated circuit package and method...
- Patent number 11,854,994
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for interconnect structure
- Patent number 11,854,870
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Footing removal in cut-metal process
- Patent number 11,854,903
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method and structures resulting therefrom
- Patent number 11,848,239
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,837,587
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning semiconductor wafer
- Patent number 11,823,945
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wang-Hua Lin
- B08 - CLEANING
Information Patent Grant
Method for processing substrate
- Patent number 11,817,330
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate resistance improvement and method thereof
- Patent number 11,810,978
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ju-Li Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device with a gate structure hav...
- Patent number 11,749,753
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor and method of forming the same
- Patent number 11,735,425
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu Ang Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,735,426
- Issue date Aug 22, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,728,249
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FIN field-effect transistor and method of forming the same
- Patent number 11,715,670
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chi Pan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF BREAKING THROUGH ETCH STOP LAYER
- Publication number 20240136183
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128218
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field-Effect Transistor Device and Method of Forming the Same
- Publication number 20240105818
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Footing Removal in Cut-Metal Process
- Publication number 20240096707
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096811
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Chung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240072021
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING METHOD AND STRUCTURES RESULTING THEREFROM
- Publication number 20240063060
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055311
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE HAVING HYBRID WORK FUNCTION LAYE...
- Publication number 20240021729
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EARPHONE DEVICE, COMPENSATION METHOD THEREOF AND COMPUTER PROGRAM P...
- Publication number 20240021186
- Publication date Jan 18, 2024
- GMI Technology Inc.
- Ming-Han YEH
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240014043
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH MODIFIED WORK FUNCTION LAYER AND METHOD OF FORMING THE...
- Publication number 20230420538
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chi PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230420543
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ling CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME
- Publication number 20230420508
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei Yun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230420534
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ling CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC WET ETCHING IN PATTERNING
- Publication number 20230420265
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tefu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FITTING HEARING COMPENSATION DEVICE WITH REAL-EAR MEASUREMENT,...
- Publication number 20230403522
- Publication date Dec 14, 2023
- GMI Technology Inc.
- Ming-Han YEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Controlling Fin-Thinning Through Feedback
- Publication number 20230387263
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20230386989
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH METHOD FOR INTERCONNECT STRUCTURE
- Publication number 20230386898
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE RESISTANCE IMPROVEMENT AND METHOD THEREOF
- Publication number 20230378360
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ju-Li Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PARTIALLY REMOVING TUNGSTEN IN SEMICONDUCTOR MANUFACTURI...
- Publication number 20230369063
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ling CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20230369494
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- CHUN-NENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20230352306
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu Ang Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MODIFYING METAL-INCLUDING MATERIAL IN SEMICONDUCTOR MANU...
- Publication number 20230352346
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Chen LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230343820
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ren-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20230335443
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chi Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230335471
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20230327002
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Shi Yeh

Person

Patents Grantslast 30 patents

Hearing compensation device and hearing compensation method

Fin field-effect transistor device and method of forming the same

Method of manufacturing a semiconductor device

Semiconductor package dielectric substrate including a trench

Via for semiconductor device connection and methods of forming the...

Semiconductor devices

Emergency response containment vessel for cylinder

Fin field-effect transistor and method of forming the same

Self-protective layer formed on high-K dielectric layer

Controlling fin-thinning through feedback

Integrated circuit structure with semiconductor devices and method...

Fin field-effect transistor and method of forming the same

Emergency response containment vessel

Method of breaking through etch stop layer

Luminous touch pad module

Semiconductor devices and methods of manufacturing thereof

Fin field-effect transistor device and method of forming the same

Redistribution structure for integrated circuit package and method...

Etch method for interconnect structure

Footing removal in cut-metal process

Patterning method and structures resulting therefrom

Package structure and manufacturing method thereof

Method for cleaning semiconductor wafer

Method for processing substrate

Gate resistance improvement and method thereof

Methods of forming a semiconductor device with a gate structure hav...

Fin field-effect transistor and method of forming the same

Semiconductor device and method of manufacture

Semiconductor package and method

FIN field-effect transistor and method of forming the same

Patents Applicationslast 30 patents

METHOD OF BREAKING THROUGH ETCH STOP LAYER

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Fin Field-Effect Transistor Device and Method of Forming the Same

Footing Removal in Cut-Metal Process

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PATTERNING METHOD AND STRUCTURES RESULTING THEREFROM

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

FIN FIELD-EFFECT TRANSISTOR DEVICE HAVING HYBRID WORK FUNCTION LAYE...

EARPHONE DEVICE, COMPENSATION METHOD THEREOF AND COMPUTER PROGRAM P...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

DEVICE WITH MODIFIED WORK FUNCTION LAYER AND METHOD OF FORMING THE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ANISOTROPIC WET ETCHING IN PATTERNING

SELF-FITTING HEARING COMPENSATION DEVICE WITH REAL-EAR MEASUREMENT,...

Controlling Fin-Thinning Through Feedback

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

ETCH METHOD FOR INTERCONNECT STRUCTURE

GATE RESISTANCE IMPROVEMENT AND METHOD THEREOF

METHOD FOR PARTIALLY REMOVING TUNGSTEN IN SEMICONDUCTOR MANUFACTURI...

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

METHOD FOR MODIFYING METAL-INCLUDING MATERIAL IN SEMICONDUCTOR MANU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGES

METHOD OF FORMING SEMICONDUCTOR DEVICE