Ming-Shi Yeh

Person

Chang-Hua, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Earphone device, compensation method thereof and computer program p...
- Patent number 12,266,336
- Issue date Apr 1, 2025
- REHEAR AUDIOLOGY COMPANY LTD.
- Ming-Han Yeh
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Method of forming semiconductor device
- Patent number 12,237,400
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chieh-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,224,204
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Nan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric susbtrate including a trench
- Patent number 12,211,782
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,191,380
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ssu-Yu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor with a gate structure having a dielectr...
- Patent number 12,183,823
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor and method of forming the same
- Patent number 12,183,637
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chi Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling fin-thinning through feedback
- Patent number 12,176,422
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 12,159,853
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for component electrode connection
- Patent number 12,142,524
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,136,566
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate spacer structures and methods for forming the same
- Patent number 12,119,390
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-sided auxiliary structure for induction cards
- Patent number 12,094,641
- Issue date Sep 17, 2024
- FOURTEEN DESIGN COMPANY LIMITED
- Ming-Hong Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-fitting hearing compensation device with real-ear measurement,...
- Patent number 12,081,948
- Issue date Sep 3, 2024
- GMI Technology Inc.
- Ming-Han Yeh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fin field-effect transistor and method of forming the same
- Patent number 12,080,556
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu Ang Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for partially removing tungsten in semiconductor manufacturi...
- Patent number 12,074,035
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation to mitigate dry etch and/or wet etch fluorine residue
- Patent number 12,068,385
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,062,602
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing data analyzing method and manufacturing data analyzin...
- Patent number 12,061,669
- Issue date Aug 13, 2024
- United Microelectronics Corp.
- Ching-Pei Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fin field-effect transistor device having hybrid work function laye...
- Patent number 12,051,753
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,051,619
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin Field-Effect transistor and method of forming the same
- Patent number 12,051,626
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etching chemistry and method of forming semiconductor device us...
- Patent number 12,046,476
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch module
- Patent number 12,038,598
- Issue date Jul 16, 2024
- Primax Electronics Ltd.
- Wei-Ping Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device having hybrid work function laye...
- Patent number 12,021,145
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate using monolayers
- Patent number 12,015,077
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ju-Li Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of storage space management for improving endurance of stora...
- Patent number 12,008,260
- Issue date Jun 11, 2024
- Realtek Semiconductor Corporation
- Yen-Chung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fin field-effect transistor and method of forming the same
- Patent number 11,996,470
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20250113588
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chi Pan
Information Patent Application
ELECTRONIC DEVICE AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM
- Publication number 20250086377
- Publication date Mar 13, 2025
- Potix Corporation
- Chih-Heng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Packages with Implantation
- Publication number 20250062136
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING FIN-THINNING THROUGH FEEDBACK
- Publication number 20250056823
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20250054894
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Spacer Structures And Methods For Forming The Same
- Publication number 20250040218
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hsiung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...
- Publication number 20240404898
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM...
- Publication number 20240395652
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Component Electrode Connection
- Publication number 20240387263
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387709
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ssu-Yu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387182
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER
- Publication number 20240371688
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371962
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- U-Ting CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20240355680
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355721
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY
- Publication number 20240339327
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE HAVING HYBRID WORK FUNCTION LAYE...
- Publication number 20240313114
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240258174
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hsiung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240258428
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE PATTERNING
- Publication number 20240222196
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tefu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOUCH MODULE
- Publication number 20240219624
- Publication date Jul 4, 2024
- Primax Electronics Ltd.
- Wei-Ping Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF-PROTECTIVE LAYER FORMED ON HIGH-K DIELECTRIC LAYER
- Publication number 20240203740
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ju-Li Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20240186390
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chi PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240186252
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A MEDICAL IMPLANT ADOPTING ADDITIVE MANUFACTURING
- Publication number 20240173775
- Publication date May 30, 2024
- National Cheng Kung University
- Ming-Long Yeh
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRONIC DEVICE AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM
- Publication number 20240169615
- Publication date May 23, 2024
- Potix Corporation
- Chih-Heng Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF BREAKING THROUGH ETCH STOP LAYER
- Publication number 20240136183
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS

Ming-Shi Yeh

Person

Patents Grantslast 30 patents

Earphone device, compensation method thereof and computer program p...

Method of forming semiconductor device

Semiconductor device and method

Semiconductor package dielectric susbtrate including a trench

Semiconductor device and method

Fin field-effect transistor with a gate structure having a dielectr...

Fin field-effect transistor and method of forming the same

Controlling fin-thinning through feedback

Package structure including IPD and method of forming the same

Via for component electrode connection

Semiconductor device and method of manufacture

Gate spacer structures and methods for forming the same

Two-sided auxiliary structure for induction cards

Package structure and manufacturing method thereof

Self-fitting hearing compensation device with real-ear measurement,...

Fin field-effect transistor and method of forming the same

Method for partially removing tungsten in semiconductor manufacturi...

Oxidation to mitigate dry etch and/or wet etch fluorine residue

Semiconductor package and method of manufacturing the same

Manufacturing data analyzing method and manufacturing data analyzin...

Fin field-effect transistor device having hybrid work function laye...

Semiconductor device and method of manufacture

Fin Field-Effect transistor and method of forming the same

Wet etching chemistry and method of forming semiconductor device us...

Touch module

Package structure with bridge die laterally wrapped by insulating e...

Fin field-effect transistor device having hybrid work function laye...

Metal gate using monolayers

Method of storage space management for improving endurance of stora...

Fin field-effect transistor and method of forming the same

Patents Applicationslast 30 patents

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

ELECTRONIC DEVICE AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM

Packages with Implantation

CONTROLLING FIN-THINNING THROUGH FEEDBACK

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

Gate Spacer Structures And Methods For Forming The Same

MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM...

Via for Component Electrode Connection

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

FIN FIELD-EFFECT TRANSISTOR DEVICE HAVING HYBRID WORK FUNCTION LAYE...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

METAL GATE PATTERNING

TOUCH MODULE

SELF-PROTECTIVE LAYER FORMED ON HIGH-K DIELECTRIC LAYER

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

METHOD OF PRODUCING A MEDICAL IMPLANT ADOPTING ADDITIVE MANUFACTURING

ELECTRONIC DEVICE AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM

METHOD OF BREAKING THROUGH ETCH STOP LAYER