Minoru Ueshima

Person

Adachi-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for synthesizing copper-silver alloy, method for forming con...
- Patent number 12,119,131
- Issue date Oct 15, 2024
- Senju Metal Industry Co., Ltd.
- Jinting Jiu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Solder alloy for power devices and solder joint having a high curre...
- Patent number 11,331,759
- Issue date May 17, 2022
- Senju Metal Industry Co., Ltd.
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for synthesizing copper-silver alloy, method for forming con...
- Patent number 11,217,359
- Issue date Jan 4, 2022
- Senju Metal Industry Co., Ltd.
- Jinting Jiu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metallic sintered bonding body and die bonding method
- Patent number 11,024,598
- Issue date Jun 1, 2021
- Senju Metal Industry Co., Ltd.
- Tetsu Takemasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Soldered joint and method for forming soldered joint
- Patent number 10,968,932
- Issue date Apr 6, 2021
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing permanent magnet
- Patent number 10,658,107
- Issue date May 19, 2020
- Senju Metal Industry Co., Ltd.
- Daisuke Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including soldered surface-mount component
- Patent number 10,297,539
- Issue date May 21, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder alloy, and LED module
- Patent number 10,272,527
- Issue date Apr 30, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and module
- Patent number 10,265,807
- Issue date Apr 23, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder bump, and solder bump
- Patent number 10,090,268
- Issue date Oct 2, 2018
- MURATA MANUFACTURING CO., LTD.
- Yasuyuki Sekimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component to circuit board
- Patent number 9,807,889
- Issue date Oct 31, 2017
- Osaka University
- Kozo Fujimoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
High-temperature lead-free solder alloy
- Patent number 9,796,053
- Issue date Oct 24, 2017
- Senju Metal Industry Co., Ltd.
- Rei Fujimaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive bonding material
- Patent number 9,487,846
- Issue date Nov 8, 2016
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy having reduced shrinkage cavities
- Patent number 9,227,258
- Issue date Jan 5, 2016
- Senju Metal Industry Co., Ltd.
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bi—Sn based high-temperature solder alloy
- Patent number 9,205,513
- Issue date Dec 8, 2015
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder paste
- Patent number 9,185,812
- Issue date Nov 10, 2015
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste and solder joint
- Patent number 9,162,324
- Issue date Oct 20, 2015
- Senju Metal Industry Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder connection structure and solder ball
- Patent number 8,975,757
- Issue date Mar 10, 2015
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Indium-containing lead-free solder for vehicle-mounted electronic c...
- Patent number 8,888,932
- Issue date Nov 18, 2014
- Senju Metal Industry Co., Ltd.
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-temperature lead-free solder alloy
- Patent number 8,865,062
- Issue date Oct 21, 2014
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder for vehicles and a vehicle-mounted electronic circ...
- Patent number 8,845,826
- Issue date Sep 30, 2014
- Senju Metal Industry Co., Ltd.
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a solder preform having high-melting metal pa...
- Patent number 8,790,472
- Issue date Jul 29, 2014
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive material
- Patent number 8,343,383
- Issue date Jan 1, 2013
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Power semiconductor device and manufacturing method therefor
- Patent number 8,334,598
- Issue date Dec 18, 2012
- Mitsubishi Electric Corporation
- Hiroshi Nishibori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free low-temperature solder
- Patent number 8,303,735
- Issue date Nov 6, 2012
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy
- Patent number 8,216,395
- Issue date Jul 10, 2012
- Senju Metal Industry Co., Ltd.
- Osamu Munekata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preform and electronic component
- Patent number 7,800,230
- Issue date Sep 21, 2010
- Denso Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy
- Patent number 7,682,468
- Issue date Mar 23, 2010
- Senju Metal Industry Co., Ltd.
- Osamu Munekata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of replenishing an oxidation suppressing element in a solder...
- Patent number 7,628,308
- Issue date Dec 8, 2009
- Senju Metal Industry Co., Ltd.
- Masayuki Ojima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CON...
- Publication number 20210366627
- Publication date Nov 25, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Jinting JIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Solder Alloy for Power Devices and Solder Joint Having a High Curre...
- Publication number 20210008670
- Publication date Jan 14, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CON...
- Publication number 20200381136
- Publication date Dec 3, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Jinting JIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOLDERED JOINT AND METHOD FOR FORMING SOLDERED JOINT
- Publication number 20200284282
- Publication date Sep 10, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Minoru UESHIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD
- Publication number 20190393188
- Publication date Dec 26, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Tetsu TAKEMASA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Solder Alloy for LED, and LED Module
- Publication number 20180264601
- Publication date Sep 20, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Minoru UESHIMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method of Manufacturing Permanent Magnet
- Publication number 20180102214
- Publication date Apr 12, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Daisuke Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Alloy for LED, and LED Module
- Publication number 20170014955
- Publication date Jan 19, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Minoru UESHIMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electroconductive Bonding Material
- Publication number 20160010179
- Publication date Jan 14, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method of Forming Solder Bump, and Solder Bump
- Publication number 20150333027
- Publication date Nov 19, 2015
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC DEVICE INCLUDING SOLDERED SURFACE-MOUNT COMPONENT
- Publication number 20150262926
- Publication date Sep 17, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY
- Publication number 20150217410
- Publication date Aug 6, 2015
- SENJUMETAL INDUSTRY CO., LTD.
- Rei Fujimaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
AUDIO SOLDER ALLOY
- Publication number 20140186208
- Publication date Jul 3, 2014
- SENJU METAL INDUSTRY CO., LTD.
- Ippei Akagi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Solder Alloy for Power Devices and Solder Joint Having a High Curre...
- Publication number 20140112710
- Publication date Apr 24, 2014
- SENJU METAL INDUSTRY CO., LTD.
- Hans-Jurgen Albrecht
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY
- Publication number 20140044479
- Publication date Feb 13, 2014
- Minoru Ueshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD, SOLDER JOIN...
- Publication number 20140029224
- Publication date Jan 30, 2014
- SENJU METAL INDUSTRY CO., LTD.
- Kozo FUJIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bi-Sn Based High-Temperature Solder Alloy
- Publication number 20130121874
- Publication date May 16, 2013
- Minoru Ueshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...
- Publication number 20120292087
- Publication date Nov 22, 2012
- SENJU METAL INDUSTRY CO., LTD.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY HAVING REDUCED SHRINKAGE CAVITIES
- Publication number 20110204121
- Publication date Aug 25, 2011
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER CONNECTION STRUCTURE AND SOLDER BALL
- Publication number 20110115084
- Publication date May 19, 2011
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20110089568
- Publication date Apr 21, 2011
- MITSUBISHI ELECTRIC CORPORATION
- Hiroshi NISHIBORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDIUM-CONTAINING LEAD-FREE SOLDER FOR VEHICLE-MOUNTED ELECTRONIC C...
- Publication number 20100307823
- Publication date Dec 9, 2010
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER FOR VEHICLES AND AN VEHICLE-MOUNTED ELECTRONIC CIR...
- Publication number 20100294565
- Publication date Nov 25, 2010
- Yuji Kawamata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder alloy
- Publication number 20100297470
- Publication date Nov 25, 2010
- Senju Metal Industry Co., Ltd.
- Osamu Munekata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE MATERIAL
- Publication number 20100053924
- Publication date Mar 4, 2010
- Minoru Ueshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LEAD-FREE LOW-TEMPERATURE SOLDER
- Publication number 20100015004
- Publication date Jan 21, 2010
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder paste
- Publication number 20090301606
- Publication date Dec 10, 2009
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Paste and Solder Joint
- Publication number 20090301607
- Publication date Dec 10, 2009
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Preform and Electronic Component
- Publication number 20090236725
- Publication date Sep 24, 2009
- DENSO Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for increasing the effectiveness of a component of a material
- Publication number 20090236013
- Publication date Sep 24, 2009
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Minoru Ueshima

Person

Patents Grantslast 30 patents

Method for synthesizing copper-silver alloy, method for forming con...

Solder alloy for power devices and solder joint having a high curre...

Method for synthesizing copper-silver alloy, method for forming con...

Metallic sintered bonding body and die bonding method

Soldered joint and method for forming soldered joint

Method of manufacturing permanent magnet

Method for soldering surface-mount component and surface-mount comp...

Electronic device including soldered surface-mount component

Solder alloy, and LED module

Solder alloy and module

Method of forming solder bump, and solder bump

Method of mounting electronic component to circuit board

High-temperature lead-free solder alloy

Electroconductive bonding material

Lead-free solder alloy having reduced shrinkage cavities

Bi—Sn based high-temperature solder alloy

Lead-free solder paste

Solder paste and solder joint

Lead-free solder connection structure and solder ball

Indium-containing lead-free solder for vehicle-mounted electronic c...

High-temperature lead-free solder alloy

Lead-free solder for vehicles and a vehicle-mounted electronic circ...

Process for producing a solder preform having high-melting metal pa...

Anisotropic conductive material

Power semiconductor device and manufacturing method therefor

Lead-free low-temperature solder

Lead-free solder alloy

Solder preform and electronic component

Lead-free solder alloy

Method of replenishing an oxidation suppressing element in a solder...

Patents Applicationslast 30 patents

METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CON...

Solder Alloy for Power Devices and Solder Joint Having a High Curre...

METHOD FOR SYNTHESIZING COPPER-SILVER ALLOY, METHOD FOR FORMING CON...

SOLDERED JOINT AND METHOD FOR FORMING SOLDERED JOINT

METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD

Solder Alloy for LED, and LED Module

Method of Manufacturing Permanent Magnet

Solder Alloy for LED, and LED Module

Electroconductive Bonding Material

Method of Forming Solder Bump, and Solder Bump

ELECTRONIC DEVICE INCLUDING SOLDERED SURFACE-MOUNT COMPONENT

HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY

AUDIO SOLDER ALLOY

Solder Alloy for Power Devices and Solder Joint Having a High Curre...

HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY

METHOD OF MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD, SOLDER JOIN...

Bi-Sn Based High-Temperature Solder Alloy

METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMP...

LEAD-FREE SOLDER ALLOY HAVING REDUCED SHRINKAGE CAVITIES

LEAD-FREE SOLDER CONNECTION STRUCTURE AND SOLDER BALL

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

INDIUM-CONTAINING LEAD-FREE SOLDER FOR VEHICLE-MOUNTED ELECTRONIC C...

LEAD-FREE SOLDER FOR VEHICLES AND AN VEHICLE-MOUNTED ELECTRONIC CIR...

Lead-free solder alloy

ANISOTROPIC CONDUCTIVE MATERIAL

LEAD-FREE LOW-TEMPERATURE SOLDER

Lead-free solder paste

Solder Paste and Solder Joint

Solder Preform and Electronic Component

Method for increasing the effectiveness of a component of a material