Minoru Yamada

Person

Hanno, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Information processing apparatus
- Patent number 5,604,840
- Issue date Feb 18, 1997
- Hitachi, Ltd.
- Mitsuo Asai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit device and computer system using t...
- Patent number 5,434,453
- Issue date Jul 18, 1995
- Hitachi, Ltd.
- Kazumichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Serial to parallel data converting circuit
- Patent number 5,426,784
- Issue date Jun 20, 1995
- Hitachi, Ltd.
- Atsumi Kawata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of and apparatus for assigning logic gates to a plurality of...
- Patent number 5,229,953
- Issue date Jul 20, 1993
- Hitachi, Ltd.
- Yuko Isozaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Information processing apparatus
- Patent number 5,214,743
- Issue date May 25, 1993
- Hitachi, Ltd.
- Mitsuo Asai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit device having a signal transmissio...
- Patent number 5,214,318
- Issue date May 25, 1993
- Hitachi, Ltd.
- Keiichirou Nakanishi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit device having an ic chip mounted on the wiring s...
- Patent number 5,212,403
- Issue date May 18, 1993
- Hitachi, Ltd.
- Keiichirou Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information processing system
- Patent number 5,165,010
- Issue date Nov 17, 1992
- Hitachi, Ltd.
- Noboru Masuda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thick film and thin film composite substrate and electronic circuit...
- Patent number 5,110,664
- Issue date May 5, 1992
- Hitachi, Ltd.
- Keiichirou Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier
- Patent number 4,954,877
- Issue date Sep 4, 1990
- Hitachi, Ltd.
- Keiichirou Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integration of semiconductor circuit
- Patent number 4,893,174
- Issue date Jan 9, 1990
- Hitachi, Ltd.
- Minoru Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chips cooling module having coolant leakage prev...
- Patent number 4,870,477
- Issue date Sep 26, 1989
- Hitachi, Ltd.
- Keiichirou Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 4,809,058
- Issue date Feb 28, 1989
- Hitachi, Ltd.
- Takao Funamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transfer circuit for use in laminated multilayer electric ci...
- Patent number 4,723,082
- Issue date Feb 2, 1988
- Hitachi, Ltd.
- Michio Asano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Hybrid multilayer wiring board
- Patent number 4,710,854
- Issue date Dec 1, 1987
- Hitachi, Ltd.
- Minoru Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for cooling integrated circuit chip
- Patent number 4,686,606
- Issue date Aug 11, 1987
- Hitachi, Ltd.
- Minoru Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling module for integrated circuit chips
- Patent number 4,644,385
- Issue date Feb 17, 1987
- Hitachi, Ltd.
- Keiichirou Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling module for integrated circuit chips
- Patent number 4,558,395
- Issue date Dec 10, 1985
- Hitachi, Ltd.
- Minoru Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Minoru Yamada

Person

Patents Grantslast 30 patents

Information processing apparatus

Semiconductor integrated circuit device and computer system using t...

Serial to parallel data converting circuit

Method of and apparatus for assigning logic gates to a plurality of...

Information processing apparatus

Semiconductor integrated circuit device having a signal transmissio...

Integrated circuit device having an ic chip mounted on the wiring s...

Information processing system

Thick film and thin film composite substrate and electronic circuit...

Chip carrier

High density integration of semiconductor circuit

Integrated circuit chips cooling module having coolant leakage prev...

Integrated circuit device

Signal transfer circuit for use in laminated multilayer electric ci...

Hybrid multilayer wiring board

Device for cooling integrated circuit chip

Cooling module for integrated circuit chips

Cooling module for integrated circuit chips