IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978, Pascuzzo et al., "Integrated Circuit Module Package Cooling Structure", pp. 3898-3899. |
IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, Anacker, "Liquid Cooling of Integrated Circuit Chips", pp. 3742-3743. |
IBM Technical Disclosure Bulletin, vol. 19, No. 4, Sep. 1976, Jeannotte, "Circuit Module with Gallium Metal Cooling Structure", p. 1348. |
IBM Technical Disclosure Bulletin, vol. 23, No. 2, Jul. 1980, Amendola, "Cooling Structure for an Integrated Circuit Module", p. 602. |
Electronics, vol. 55, No. 17, Aug. 25, 1982, Fields, "Grooved Substrate Boosts IC Cooling", pp. 46-47. |