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Mirng-Ji Lii
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package with surface mounted pins on an organic...
Patent number
6,600,233
Issue date
Jul 29, 2003
Intel Corporation
Hwai-Peng Yeoh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit package with surface mounted pins on an organic...
Patent number
6,413,849
Issue date
Jul 2, 2002
Intel Corporation
Hwai-Peng Yeoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate for reducing electromagnetic interference and enclosure
Patent number
6,191,475
Issue date
Feb 20, 2001
Intel Corporation
Harry G. Skinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Energy-absorbing stable guard ring
Patent number
6,163,065
Issue date
Dec 19, 2000
Intel Corporation
Krishna Seshan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
MPC module with exposed C4 die and removal thermal plate design
Patent number
5,936,838
Issue date
Aug 10, 1999
Intel Corporation
Mirng-Ji Lii
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
C4 package die backside coating
Patent number
5,936,304
Issue date
Aug 10, 1999
Intel Corporation
Mirng-Ji Lii
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Socketless package to circuit board assemblies and methods of using...
Publication number
20040000428
Publication date
Jan 1, 2004
Mirng-Ji Lii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Integrated circuit package with surface mounted pins on an organic...
Publication number
20020125583
Publication date
Sep 12, 2002
Intel Corporation
Hwai-Peng Yeoh
H01 - BASIC ELECTRIC ELEMENTS